Search Results - "Kamibayashi, Takumi"

Liquid/solution-based microfluidic quantum dots light-emitting diodes for high-colour-purity light emission by Kawamura, Masahiro, Kuwae, Hiroyuki, Kamibayashi, Takumi, Oshima, Juro, Kasahara, Takashi, Shoji, Shuichi, Mizuno, Jun

“…Organic light-emitting diodes (OLEDs) using a liquid organic semiconductor (LOS) are expected to provide extremely flexible displays. Recently, microfluidic…”
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Compensation of Surface Roughness Using an Au Intermediate Layer in a Cu Direct Bonding Process by Noma, Hirokazu, Kamibayashi, Takumi, Kuwae, Hiroyuki, Suzuki, Naoya, Nonaka, Toshihisa, Shoji, Shuichi, Mizuno, Jun

“…Copper-copper (Cu-Cu) direct bonding assisted by direct immersion gold (DIG) was demonstrated. Cu-Cu direct bonding is a critical technology for inductively…”
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Development of face-to-face and face-to-back ultra-fine pitch Cu-Cu hybrid bonding by Kagawa, Yoshihisa, Kamibayashi, Takumi, Yamano, Yuriko, Nishio, Kenya, Sakamoto, Akihisa, Yamada, Taichi, Shimizu, Kan, Hirano, Tomoyuki, Iwamoto, Hayato

“…We have developed the novel fabrication process that has realized the robust ultra-fine pitch, 1 μm pitch, wafer level face-to-face Cu-Cu hybrid bonding. For…”
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RGB all Liquid-Based Microfluidic Quantum Dots Light-Emitting Diodes Using Deep-Blue Liquid Organic Semiconductor Backlight by Kawamura, Masahiro, Kuwae, Hiroyuki, Kamibayashi, Takumi, Oshima, Juro, Kasahara, Takashi, Shoji, Shuichi, Mizuno, Jun

“…We developed an RGB microfluidic quantum dots light-emitting diode (QLED). All emitter and luminophores were liquid materials, including liquid organic…”
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High-Color-Purity Microfluidic Quantum Dots Light-Emitting Diodes Using the Electroluminescence of the Liquid Organic Semiconductor Backlight by Kawamura, Masahiro, Kuwae, Hiroyuki, Kamibayashi, Takumi, Oshima, Juro, Kasahara, Takashi, Shoji, Shuichi, Mizuno, Jun

“…We proposed microfluidic quantum dots light-emitting diodes using a liquid organic semiconductor (LOS) and quantum dots (QDs) solutions. LOS and QDs solutions…”
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Cu-Cu Wiring: The Novel Structure of Cu-Cu Hybrid Bonding by Kagawa, Yoshihisa, Kamibayashi, Takumi, Fujii, Nobutoshi, Furuse, Shunsuke, Yamada, Taichi, Hirano, Tomoyuki, Iwamoto, Hayato

“…We have developed the novel structure of Cu-Cu hybrid bonding called "Cu-Cu wiring". The Cu-Cu wirings have been formed through hybrid bonding of Cu lines. The…”
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Study on role of inserted Pt intermediate layer deposited by atomic layer deposition for Cu-Cu quasi-direct bonding by Yamada, Kosuke, Kuwae, Hiroyuki, Kamibayashi, Takumi, Shoji, Shuichi, Momose, Wataru, Mizuno, Jun

“…Recently, we developed Cu-Cu quasi-direct bonding with Pt intermediate layer deposited by atomic layer deposition (ALD). In this report, we study about a role…”
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High-aspect-ratio Sub-2-μm Vias Using Thermal Imprint with Build-up Resin by Kamibayashi, Takumi, Kuwae, Hiroyuki, Kishioka, Takahiro, Usui, Yuki, Ohashi, Takuya, Tamura, Mamoru, Shoji, Shuichi, Mizuno, Jun

“…We developed a fabrication method of high-aspect-ratio fine vias with a build-up resin. The build-up resin composed of a thermosetting resin and silica fillers…”
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Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition by Yamada, Kosuke, Kuwae, Hiroyuki, Kamibayashi, Takumi, Momose, Wataru, Shoji, Shuichi, Mizuno, Jun

“…We propose a low temperature bonding technique using an ultrathin intermediate layer deposited by atomic layer deposition. The ultrathin Pt film is selectively…”
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Cu-Cu direct bonding by introducing Au intermediate layer by Noma, Hirokazu, Kamibayashi, Takumi, Kuwae, Hiroyuki, Suzuki, Naoya, Nonaka, Toshihisa, Shoji, Shuichi, Mizuno, Jun

“…Cu-Cu direct bonding under help of direct immersion gold (DIG) for multi-die fan-out wafer level package was demonstrated. Cu-Cu direct bonding is a critical…”
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