Search Results - "Kamgaing, T."

How do layered double hydroxides evolve? First in situ insights into their synthesis processes by Doungmo, G., Morais, A. F., Mustafa, D., Kamgaing, T., Njanja, E., Etter, M., Tonlé, I. K., Terraschke, H.

“…Despite the importance of layered double hydroxides (LDHs) in catalysis, medicine and water treatment, the crystallisation process of these materials is seldom…”
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A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface by Kamgaing, T., Ramahi, O.M.

“…A novel technique for suppressing power plane resonance at microwave and radio frequencies is presented. The new concept consists of replacing one of the…”
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Design and modeling of high-impedance electromagnetic surfaces for switching noise suppression in power planes by Kamgaing, T., Ramahi, O.M.

“…This paper presents a detailed design and modeling approach for power planes with integrated high-impedance electromagnetic surfaces (HIS). These novel power…”
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Multiband Electromagnetic-Bandgap Structures for Applications in Small Form-Factor Multichip Module Packages by Kamgaing, T., Ramahi, O.M.

“…The design and implementation of package-level electromagnetic-bandgap (EBG) structures is presented. By using spiral-based inductance-enhanced…”
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Multi-layer FCCSP organic packaging for D-band millimeter wave applications by Gaunkar, N. Prabhu, Dogiamis, G., Kamgaing, T., Elsherbini, A., Swan, J.

“…A multi-layer, organic, low-loss flip-chip chip-scale package (FCCSP) for sub-THz applications has been developed and validated with on-package passive…”
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Organic Package Substrates Using Lithographic Via Technology for RF to THz Applications by Aleksov, A., Dogiamis, G., Kamgaing, T., Elsherbini, A., Swan, J., Darmawikarta, K., Boyapati, S., Holloway, J., Han, R.

“…RF substrate packages were built using organic dielectric layers with Copper (Cu) based interconnects employing lithographically defined vias as a new…”
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Efficacy of Emilia coccinea aqueous extract on inhibition of α-amylase enzyme activity and insulin resistance in dexamethasone treated-rats by Poualeu Kamani, Sl, Kamgaing Waguia, J., Miaffo, D., Nchouwet, Ml, Demeni Kadji, Cl, Wego Kamgaing, M.T., Douho Djimeli, Rc, Mzoyem Ngnitedem, J., Kamanyi, A., Wansi Ngnokam, Sl

“…Diabetes mellitus is one of the most common chronic metabolic diseases throughout the world, characterized by hyperglycemia and insulin resistance. The purpose…”
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Modeling of frequency dependent losses in two-port and three-port inductors on silicon by Kamgaing, T., Myers, T., Petras, M., Miller, M.

“…New compact model forms for two-port and three-port symmetric inductors fabricated on silicon are discussed in this paper. These new models incorporate a…”
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Broadband compact models for transformers integrated on conductive silicon substrates by Kamgaing, T., Petras, M., Miller, M.

“…A broadband scalable lumped-element model for multiport transformers integrated on a silicon substrate is presented. The model is based on a pi-T network for…”
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Inductance-enhanced high-impedance surfaces for broadband simultaneous switching noise mitigation in power planes by Kamgaing, T., Ramahi, O.M.

“…Full wave electromagnetic simulation is used to study the application of high-impedance surfaces (HIS) in simultaneous switching noise (SSN) mitigation in…”
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How do layered double hydroxides evolve? First insights into their synthesis processes by Doungmo, G, Morais, A. F, Mustafa, D, Kamgaing, T, Njanja, E, Etter, M, Tonlé, I. K, Terraschke, H

“…Despite the importance of layered double hydroxides (LDHs) in catalysis, medicine and water treatment, the crystallisation process of these materials is seldom…”
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Performance analysis of monolithic RF transformers by experimental characterization by Kamgaing, T., Myers, T., Feng Ling, Petras, M., Miller, M., Ramahi, O.

“…Electrical performances of 4-port n:n dual-spiral transformers fabricated in a thick plated copper on silicon process are analyzed. Multiport data analysis…”
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Modeling of frequency dependent losses in two-port and three-port inductors on silicon by Kamgaing, T., Myers, T., Petras, M., Miller, M.

“…New compact model forms for two-port and three-port symmetric inductors fabricated on silicon are discussed in this paper. These new models incorporate a…”
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Integration of SAW RF Rx filter stacked on a transceiver chip in a QFN package by Jones, R.E., Ramiah, C., Kamgaing, T., Banerjee, S.K., Chi-Taou Tsai, Hughes, H., De Silva, A., Drye, J., Vaughan, C., Miglore, R., Penunuri, D., Lucero, R., Frear, D.R., Miller, M.

“…Enhanced integration of mobile phone components is driven by demands for reduced form factor and cost. Because SAW filters must be fabricated on piezoelectric…”
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High-impedance electromagnetic surfaces for parallel-plate mode suppression in high-speed digital systems by Kamgaing, T., Ramahi, O.M.

“…This paper discusses the application of high-impedance electromagnetic surfaces (HIS) for EMI shielding in high-speed circuits. The limitations of the HIS with…”
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EMI Suppression and Switching Noise Mitigation in Packages and Boards using Electromagnetic Band Gap Structures by Ramahi, O.M., Mohajer-Iravani, B., Qin, J., Shahparnia, S., Kamgaing, T.

“…In this paper, we present some developments in the application of electromagnetic band gap (EBG) structures to the problem of switching noise and…”
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Design of RF filters using silicon integrated passive components by Kamgaing, T., Henderson, R., Petras, M.

“…The paper discusses the design and characterization of RF filters in Freescale's 0.4 micron SiGe BiCMOS process. An integration scheme for bandpass filters on…”
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Electromagnetic band-gap structures for multiband mitigation of resonant modes in parallel-plate waveguides by Kamgaing, T., Ramahi, O.M.

“…A novel electromagnetic band-gap structure (EBG), whose surface impedance is primarily controlled by its inductance per unit area, is presented. This EBG,…”
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Simulation, modeling, and testing embedded RF capacitors in low temperature cofired ceramic by Blood, W., Feng Ling, Kamgaing, T., Myers, T., Petras, M.

“…Accurate circuit simulation models for embedded RF passive components in low temperature cofired ceramic (LTCC) provide a way to efficiently design high…”
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A compact 802.11 a/b/g/n WLAN Front-End Module using passives embedded in a flip-chip BGA organic package substrate by Kamgaing, T., Davies-Venn, E., Radhakrishnan, K.

“…This paper discusses the design and implementation of a compact RF front-end-module for 802.11 a/b/g/n application. A high performance embedded passives…”
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