Search Results - "Ka-Yi Yeh"

Compiler of Reed-Solomon Codec for 400-Gb/s IEEE 802.3bs Standard by Liu, Lin, Chi, Lai, Huang, Shi-Yu, Yeh, Ka-Yi

“…Error correction is often indispensable in a modern digital communication system that transmits data at a very high speed. Recently published IEEE Std 802.3bs…”
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A new CMOS image sensor readout structure for 3D integrated imagers by Shang-Fu Yeh, Jin-Yi Lin, Chih-Cheng Hsieh, Ka-Yi Yeh, Chung-Chi Jim Li

“…This paper presents a new CMOS image sensor (CIS) structure and ADC design for three-dimensional (3D) integrated imagers. A modular design of CIS sub-array is…”
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A 3 Megapixel 100 Fps 2.8 μm Pixel Pitch CMOS Image Sensor Layer With Built-in Self-Test for 3D Integrated Imagers by YEH, Shang-Fu, HSIEH, Chih-Cheng, YEH, Ka-Yi

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A 3 Megapixel 100 Fps 2.8 \mum Pixel Pitch CMOS Image Sensor Layer With Built-in Self-Test for 3D Integrated Imagers by Shang-Fu Yeh, Chih-Cheng Hsieh, Ka-Yi Yeh

“…This paper presents a 3 megapixel 100 fps 2.8 μm pixel pitch CMOS image sensor (CIS) layer with built-in self-test (BIST) for three-dimensional (3D) integrated…”
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Developing through-silicon stacking process using 3-D CMOS imager as a test vehicle by Ding-Ming Kwai, Ka-Yi Yeh

“…We present a three-dimensional (3-D) CMOS imager to be used as a process development vehicle for through-silicon stacking. The 3-D CMOS imager comprises three…”
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Contactless stacked-die testing for pre-bond interposers by Jui-Hung Chien, Ruei-Siang Hsu, Hsueh-Ju Lin, Ka-Yi Yeh, Shih-Chieh Chang

“…A stacked-die product integrates multiple dies on interposers. In this paper, we first discuss the difficulties of traditional testing mechanism for…”
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