Search Results - "KOPPERSCHMIDT, P"

Tetragonal photonic woodpile structures by KOPPERSCHMIDT, P

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Tunable band gaps in electro-optical photonic bi-oriented crystals by KOPPERSCHMIDT, P

“…Electrically induced birefringence is studied in photonic bi-oriented crystals in terms of molding lightflow in optical devices. In photonic bi-oriented…”
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“Compliant” twist-bonded GaAs substrates: The potential role of pinholes by Kopperschmidt, P., Senz, St, Scholz, R., Gösele, U.

“…By twist wafer bonding, thin (100) GaAs layers were transferred onto (100) GaAs handling wafers in order to fabricate structures like those suggested in the…”
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Fundamental issues in wafer bonding by Gösele, U., Bluhm, Y., Kästner, G., Kopperschmidt, P., Kräuter, G., Scholz, R., Schumacher, A., Senz, St, Tong, Q.-Y., Huang, L.-J., Chao, Y.-L., Lee, T. H.

“…Semiconductor wafer bonding has increasingly become a technology of choice for materials integration in microelectronics, optoelectronics, and…”
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Wafer bonding for microsystems technologies by Gösele, U., Tong, Q.-Y., Schumacher, A., Kräuter, G., Reiche, M., Plößl, A., Kopperschmidt, P., Lee, T.-H., Kim, W.-J.

“…In microsystems technologies, frequently complex structures consisting of structured or plain silicon or other wafers have to be joined to one mechanically…”
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Materials integration of gallium arsenide and silicon by wafer bonding by Kopperschmidt, P., Senz, S., Kästner, G., Hesse, D., Gösele, U. M.

“…We present a technique for the fabrication of materials integration of (100) silicon and (100) gallium arsenide by direct wafer bonding. GaAs wafers 3 in. in…”
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Interface defects in integrated hybrid semiconductors by wafer bonding by Kopperschmidt, P., Senz, St, Scholz, R.

“…The integration of materials by wafer bonding offers novel device fabrication for applications in micromechanics, microelectronics, and optoelectronics. Two…”
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High bond energy and thermomechanical stress in silicon on sapphire wafer bonding by Kopperschmidt, P., Kästner, G., Hesse, D., Zakharov, N. D., Gösele, U.

“…Silicon on sapphire wafer pairs are formed by direct wafer bonding of 3-in. silicon and sapphire wafers. Subsequent annealing commonly used to increase the…”
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Wafer bonding of gallium arsenide on sapphire by KOPPERSCHMIDT, P, KÄSTNER, G, SENZ, S, HESSE, D, GÖSELE, U

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Phase identification of micro and macro bubbles at the interface of directly bonded GaAs on sapphire by SENZ, S, KOPPERSCHMIDT, P, KÄSTNER, G, HESSE, D

“…Direct wafer bonding (DWB) of 3″ GaAs and R-cut sapphire was performed in a microcleanroom using ultra pure water as cleaning agent. The initial bonding is…”
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Optimisation of the wire-shadow TEM cross-section preparation technique by Senz, S, Kopperschmidt, P, Langer, E, Sieber, H, Hesse, D

“…The wire-shadow technique is a simple and easy-to-use preparation method of cross-section specimens for TEM investigations. The method has been optimised for…”
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Multichannel process monitor for real-time film thickness and rate measurements in dry etching and deposition by Heinrich, F, Heinze, D, Kowalski, T, Hoffmann, P, Kopperschmidt, P

“…The versatile multichannel process monitor system, MPM- X, designed for the online control of plasma and ion beam etching and deposition is introduced. It…”
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Back-to-back substrate wafer bonding : A new approach to the fabrication of double-side coated wafers by KOPPERSCHMIDT, P, KÄSTNER, G, HESSE, D, GÖSELE, U. M, LORENZ, M

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Semiconductor wafer bonding. A flexible approach to materials combinations in microelectronics; micromechanics and optoelectronics by Gosele, U., Alexe, M., Kopperschmidt, P., Tong, Q.-Y.

“…The wafer bonding approach, originally developed mostly for the fabrication of silicon-on-insulator (SOI) substrates, has matured to a flexible technology…”
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Monitoring internal heat fluxes on Pulsating Heat Pipes using Kalman filter – Numerical and experimental results by Margotto, Bruno H.M., Kopperschmidt, Carlos E.P., Colaço, Marcelo J., da Silva, Wellington B., Bozzoli, Fabio, Cattani, Luca, Pagliarini, Luca

“…•Proposes an innovative approach to real-time monitoring of heat flux in Pulsating Heat Pipes (PHP).•Utilizes the Kalman Filter to estimate internal heat flux,…”
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Interface defects in integrated hybrid semiconductors by wafer bonding by KOPPERSCHMIDT, P, SENZ, St, SCHOLZ, R

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Multichannel process monitor for real-time film thickness and rate measurements in dry etching and deposition: Selected papers revised from the proceedings of the fourth international symposium on sputtering and plasma processes (ISSP'97) by HEINRICH, F, HEINZE, D, KOWALSKI, T, HOFFMANN, P, KOPPERSCHMIDT, P

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Wafer bonding: a flexible approach to materials integration by Gosele, U., Kastner, G., Senz, S., Kopperschmidt, P., Plossl, A., Scholz, R., Tong, Q.-Y., Chao, Y.-L., Huang, L.-J.

“…"Wafer bonding" refers to the phenomenon that mirror-polished, flat and clean surfaces of almost any material, when brought into contact at room temperature,…”
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