Search Results - "KAO, C. R"

Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations by Tatsumi, Hiroaki, Kao, C. R., Nishikawa, Hiroshi

“…High-density electronics are hindered by the constraints of Sn-based solder joints, necessitating the exploration of Cu–Cu solid-state bonding. However,…”
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Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation by Tatsumi, Hiroaki, Kao, C. R., Nishikawa, Hiroshi

“…In recent years, solid-state bonding has attracted attention for various electronic packaging applications as an alternative to conventional solders…”
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Phase Equilibria Related to NiGa5 in the Binary Ni-Ga System by Chang, Chih-Chia Bill, Kao, C. R.

“…The assembly of Ga alloys with Ni or Ni alloy has been widely developed for various low-temperature applications in recent years. In the constituent Ni-Ga…”
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Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling by Chang, Fu-Ling, Lin, Yu-Hsin, Hung, Han-Tang, Kao, Chen-Wei, Kao, C R

“…Eutectic In-48Sn was considered a promising candidate for low-temperature solder due to its low melting point and excellent mechanical properties. Both Cu…”
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Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate by Hung, Han-Tang, Chang, Fu-Ling, Tsai, Chin-Hao, Liao, Chia-Yi, Kao, C. R.

“…Indium is considered a candidate low-temperature solder because of its low melting temperature and excellent mechanical properties. However, the solid-state…”
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Effects of Ti addition to Sn–Ag and Sn–Cu solders by Chen, W.M., Kang, S.K., Kao, C.R.

“…► Ti additions to Sn–Cu and Sn–Ag solders can effectively reduce the undercooling. ► Increasing the cooling rate will increase the hardness of Ti-added…”
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Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration by Kung, Po-Yu, Huang, Wei-Lun, Kao, Chin-Li, Lin, Yung-Sheng, Hung, Yun-Ching, Kao, C. R.

“…Cu-to-Cu direct bonding plays an important role in three-dimensional integrated circuits (3D IC). However, the bonding process always requires high…”
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Interfacial reaction issues for lead-free electronic solders: Lead-free electronic solders by HO, C. E, YANG, S. C, KAO, C. R

“…Issue Title: Special Issue: Lead-Free Electronic Solders Guest Editor: K. N. Subramanian The interfacial reactions between Sn-based solders and two common…”
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The Demonstration of Carbon Nanotubes (CNTs) as Flip-Chip Connections in 3-D Integrated Circuits With an Ultralow Connection Resistance by Liao, M.-H., Lu, P.-Y., Su, W.-J., Chen, S.-C., Hung, H.-T., Kao, C.-R., Pu, W.-C., Chen, C.-C. A., Lee, M.-H.

“…In this brief, the high-quality carbon nanotubes (CNTs) is grown by a chemical vapor deposition (CVD) method, and it is used as an ultrafine flip-chip…”
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Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping by Bashir, M. Nasir, Haseeb, A. S. M. A, Rahman, Abu Zayed Mohammad Saliqur, Fazal, M. A, Kao, C. R

“…The characteristics of interfacial intermetallic compounds (IMCs) can have serious impact on the reliability of solder joints. In this study, Ni nanoparticles…”
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Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu by Wang, Y.W., Lin, Y.W., Tu, C.T., Kao, C.R.

“…The reactions between Cu and the Sn2.5Ag0.8Cu solders doped with 0.03 wt.% Fe, Co, or Ni were studied. Reaction conditions included multiple reflows for up to…”
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Phase field microelasticity model of dislocation climb: Methodology and applications by Ke, J.H., Boyne, A., Wang, Y., Kao, C.R.

“…We develop a dislocation climb model based on a phase field description that couples non-conservative dislocation motion and vacancy diffusion. A…”
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Effects of silver addition on Cu–Sn microjoints for chip-stacking applications by Yang, T.L., Yu, J.J., Shih, W.L., Hsueh, C.H., Kao, C.R.

“…•Highly faceted Cu6Sn5 IMC are observed during solid-state interfacial reactions.•The “time-to-impingement” of intermetallics is established for the first time…”
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Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps by Kao, Chen-Wei, Kung, Po-Yu, Chang, Chih-Chia, Huang, Wei-Chen, Chang, Fu-Ling, Kao, C. R.

“…The use of scaled-down micro-bumps in miniaturized consumer electronic products has led to the easy realization of full intermetallic solder bumps owing to the…”
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The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering by Chang, C.C., Lin, Y.W., Wang, Y.W., Kao, C.R.

“…The combined effect of solder volume and Cu concentration in solder on the Cu consumption rate is of significant practical importance but has never been…”
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Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni by HO, C. E, TSAI, R. Y, LIN, Y. L, KAO, C. R

“…The reaction between the Sn-Ag-Cu solders and Ni at 250 degree C for 10 min and 25 h was studied. Nine different Sn-Ag-Cu solders, with the Ag concentration…”
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Effects of bottom topography on dynamics of river discharges in tidal regions: case study of twin plumes in Taiwan Strait by Korotenko, K. A, Osadchiev, A. A, Zavialov, P. O, Kao, R.-C, Ding, C.-F

“…The Princeton Ocean Model (POM) is used to investigate the intratidal variability of currents and turbulent mixing and their impact on the characteristics and…”
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Origin and evolution of voids in electroless Ni during soldering reaction by Chung, C. Key, Chen, Y.J., Chen, W.M., Kao, C.R.

“…[Display omitted] ► Nano voids (2–4nm) found at electroless Ni substrate. ► These voids grow to about 18nm during reflow. ► Higher soldering cycles lead to…”
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Micromechanical behavior of single-crystalline Cu6Sn5 by picoindentation by Yu, J. J., Wu, J. Y., Yu, L. J., Yang, H. W., Kao, C. R.

“…The micromechanical behavior of single-crystalline Cu 6 Sn 5 is studied by micropillar compression in a picoindenter. The compound Cu 6 Sn 5 is important…”
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Effects of limited Cu supply on soldering reactions between SnAgCu and Ni by HO, C. E, LIN, Y. W, YANG, S. C, KAO, C. R, JIANG, D. S

“…The volume difference between the various types of solder joints in electronic devices can be enormous. For example, the volume difference between a 760-µm…”
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