Search Results - "KALANTARY, M. R"

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    The production of compositionally modulated alloys by simulated high speed electrodeposition from a single solution by Kalantary, M.R., Wilcox, G.D., Gabe, D.R.

    Published in Electrochimica acta (01-08-1995)
    “…Simulation of high speed electrodeposition, using a rotating cylinder electrode, has been carried out in order to obtain an operating window for applied…”
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    Journal Article
  3. 3

    Physical properties of pulsed current copper electrodeposits by KALANTARY, M. R, GABE, D. R

    Published in Journal of materials science (15-09-1995)
    “…Square-wave unipolar pulse electroplating and bipolar pulse reverse electroplating of copper using an acid copper electrolyte of the type used for printed…”
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  4. 4

    A model for the mechanism of nickel fluoride cold sealing of anodized aluminium by KALANTARY, M. R, GABE, D. R, ROSS, D. H

    Published in Journal of applied electrochemistry (01-03-1992)
    “…The sealing of porous anodic oxide films on Al1080 by the use of nickel fluoride solutions at ambient temperatures has been proposed as an alternative to…”
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  5. 5

    Unipolar and bipolar pulsed current electrodeposition for PCB production by KALANTARY, M. R, GABE, D. R, GOODENOUGH, M. R

    Published in Journal of applied electrochemistry (01-03-1993)
    “…Square-wave unipolar-pulse and bipolar-pulse reverse electroplating (i.e. of copper) and, particularly, the determination of pulse parameters to optimise…”
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    Vibratory Agitation to Enhance Mass Transfer in Electrodeposition by Kalantary, M.R., Amadi, S.A., Gabe, D.R.

    Published in Circuit world (01-03-1989)
    “…A study has been carried out employing a vibratory motor, offering amplitudes of 0·4-4 mm at 50 Hz in acid copper sulphate as a model electrolyte in which…”
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    Observed Phenomenology of the Interaction between Solder Paste and Soldering Processes by Kalantary, M.R, Sarvar, F, Conway, P.P, Williams, D.J, Whalley, D.C

    Published in Soldering & surface mount technology (01-03-1994)
    “…Increases in component packing density and the consequent decrease in feature size in electronics products continue to place ever more emphasis on process…”
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