Search Results - "Jung, Hokyoung"

Modeling of step height reduction with temperature function in copper CMP by Shin, Yeongil, Jeong, Jongmin, Park, Youngwook, Jeong, Seonho, Jung, Hokyoung, Jeong, Haedo

“…Chemical mechanical polishing (CMP) is a global planarization process that effectively reduces the step height of patterns. Conventional mathematical models…”
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X-ray Diffraction Analysis of Damaged Layer During Polishing of Silicon Carbide by Jung, Hokyoung, Jeong, Seonho, Park, Youngwook, Shin, Yeongil, Jeong, Haedo

“…This study focused on the damaged layer of silicon carbide produced during polishing. For the experiment, 2-inch single-crystal 4H-SiC was used. In order to…”
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