Search Results - "Jung, GyuIck"
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Thermal Modeling and Optimization of Mobile Device using modified LPV ROM
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30-05-2023)“…As computing power increases rapidly, thermal limit becomes the bottleneck of device performance. Therefore, performance estimation and design optimization…”
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2
Advanced coreless flip-chip BGA package with high dielectric constant thin film embedded decoupling capacitor
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01-05-2011)“…In this paper, coreless flip-chip BGA in Amkor Technology will be introduced with two options. First option is a revised coreless substrate design with layer…”
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Conference Proceeding
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3
Wafer Level Void-Free Molded Underfill for High-Density Fan-out Packages
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02-12-2020)“…In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density…”
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Conference Proceeding