Search Results - "Jui-i Yu"
-
1
ATR-FTIR and Nanoindentation Measurements of PMDA-ODA Polyimide Film under Different Curing Temperature
Published in MATERIALS TRANSACTIONS (01-01-2007)“…ATR-FTIR apparatus is used to measure the curing rate of PMDA-ODA polyimide film in order to avoid sinusoidal interference fringe. From the corrected height…”
Get full text
Journal Article -
2
Sensorless BLDC Motor Sliding Mode Controller Design for Interference Recovery
Published in 2019 6th International Conference on Control, Decision and Information Technologies (CoDIT) (01-04-2019)“…This research focus on studying two full sensorless Sliding Mode Control (SMC) on a three phase Brushless Direct-Current (BLDC) motor for recovery on…”
Get full text
Conference Proceeding -
3
Al-MCM-41 supported magnesium oxide as catalyst for synthesis of α-pentylcinnamaldehyde
Published in Catalysis letters (01-11-2001)“…The catalytic reaction of benzaldehyde with n-heptaldehyde was studied at 100–175°C in a stirred batch autoclave reactor using mesoporous molecular sieve…”
Get full text
Journal Article -
4
Effects of Photosensitive Film Sidewall Profile with Different Exposure Wavelength and Process Characteristics of Wafer Bump Technology
Published in 2006 International Microsystems, Package, Assembly Conference Taiwan (01-10-2006)“…Wafer bumping is growing in importance with the increasing used of flip chip package. In this study, we tried to determine which factors at photosensitive film…”
Get full text
Conference Proceeding -
5
Effects of photosensitive film sidewall profile with different exposure wavelength and process characteristics of plating bump technology
Published in 56th Electronic Components and Technology Conference 2006 (2006)“…Wafer bumping is growing in importance with the increasing used of flip chip package. In this study, we tried to determine which factors at photosensitive film…”
Get full text
Conference Proceeding -
6
Process characteristics of 100 /spl mu/m bump pitch with lead-free and high lead plating solder bump
Published in 2005 7th Electronic Packaging Technology Conference (2005)“…A technique for 100 mum fine pitch bump process characteristics with stack thin film as under bump metallization structure, such as Ti/Cu/Ni and Ti/NiV/Cu were…”
Get full text
Conference Proceeding -
7
Broad-Spectrum Activity of Volatile Organic Compounds from Three Yeast-like Fungi of the Galactomyces Genus Against Diverse Plant Pathogens
Published in Mycobiology (28-02-2021)“…The application of antagonistic fungi for plant protection has attracted considerable interest because they may potentially replace the use of chemical…”
Get full text
Journal Article -
8
Screening and Evaluation of Yeast Antagonists for Biological Control of Botrytis cinerea on Strawberry Fruits
Published in Mycobiology (31-03-2018)“…Gray mold (Botrytis cinerea) is one of the most common diseases of strawberries (Fragaria×ananassa Duchesne) worldwide. Although many chemical fungicides are…”
Get full text
Journal Article