Search Results - "Jui-i Yu"

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  1. 1

    ATR-FTIR and Nanoindentation Measurements of PMDA-ODA Polyimide Film under Different Curing Temperature by Lee, Shih-Chin, Tai, Fong-Cheng, Wei, Che-Hung, Yu, Jui-I

    Published in MATERIALS TRANSACTIONS (01-01-2007)
    “…ATR-FTIR apparatus is used to measure the curing rate of PMDA-ODA polyimide film in order to avoid sinusoidal interference fringe. From the corrected height…”
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    Journal Article
  2. 2

    Sensorless BLDC Motor Sliding Mode Controller Design for Interference Recovery by Chang, Peter I-Tsyuen, Lin, Xin-You, Yu, I-Jui

    “…This research focus on studying two full sensorless Sliding Mode Control (SMC) on a three phase Brushless Direct-Current (BLDC) motor for recovery on…”
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    Conference Proceeding
  3. 3

    Al-MCM-41 supported magnesium oxide as catalyst for synthesis of α-pentylcinnamaldehyde by YU, Jui-I, SHIN YI SHIAU, KO, An-Nan

    Published in Catalysis letters (01-11-2001)
    “…The catalytic reaction of benzaldehyde with n-heptaldehyde was studied at 100–175°C in a stirred batch autoclave reactor using mesoporous molecular sieve…”
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    Journal Article
  4. 4

    Effects of Photosensitive Film Sidewall Profile with Different Exposure Wavelength and Process Characteristics of Wafer Bump Technology by Jui-i Yu, Yu, R., Tai, T., Huang, D., Jau, W., Ker-Chang Hsieh, Hsieh, A., Su, S., Homing Tong

    “…Wafer bumping is growing in importance with the increasing used of flip chip package. In this study, we tried to determine which factors at photosensitive film…”
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    Conference Proceeding
  5. 5

    Effects of photosensitive film sidewall profile with different exposure wavelength and process characteristics of plating bump technology by Jui-I Yu, Yu, R., Tai, T., Huang, D., Jau, W., Lin, J., Homing Tong, Ker-Chang Hsieh

    “…Wafer bumping is growing in importance with the increasing used of flip chip package. In this study, we tried to determine which factors at photosensitive film…”
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    Conference Proceeding
  6. 6

    Process characteristics of 100 /spl mu/m bump pitch with lead-free and high lead plating solder bump by Yu, R., Jui-I Yu, Tai, T., Kang, C.H., Jami Chen, Taguibao, J., Mars Tsai, Homing Tong, Ker-Chang Hsieh

    “…A technique for 100 mum fine pitch bump process characteristics with stack thin film as under bump metallization structure, such as Ti/Cu/Ni and Ti/NiV/Cu were…”
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    Conference Proceeding
  7. 7

    Broad-Spectrum Activity of Volatile Organic Compounds from Three Yeast-like Fungi of the Galactomyces Genus Against Diverse Plant Pathogens by Cai, Shu-Ting, Chiu, Ming-Chung, Chou, Jui-Yu

    Published in Mycobiology (28-02-2021)
    “…The application of antagonistic fungi for plant protection has attracted considerable interest because they may potentially replace the use of chemical…”
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    Journal Article
  8. 8

    Screening and Evaluation of Yeast Antagonists for Biological Control of Botrytis cinerea on Strawberry Fruits by Chen, Pei-Hua, Chen, Rou-Yun, Chou, Jui-Yu

    Published in Mycobiology (31-03-2018)
    “…Gray mold (Botrytis cinerea) is one of the most common diseases of strawberries (Fragaria×ananassa Duchesne) worldwide. Although many chemical fungicides are…”
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    Journal Article