Search Results - "Jui-Hung Chien"
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Dendrimers with Tetraphenylmethane Moiety as a Central Core: Synthesis, a Pore Study and the Adsorption of Volatile Organic Compounds
Published in International journal of molecular sciences (01-10-2022)“…Reasonable yields of two dendrimers with central tetraphenylmethane and peripheral 3,5-di-(tert-butanoylamino)benzoylpiperazine moieties are prepared. These…”
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Journal Article -
2
Verification of turning insert specifications through three-dimensional vision system
Published in International journal of advanced manufacturing technology (01-06-2018)“…Most computer numerically controlled (CNC) machine tools with turning capability use turning tools with clamped inserts due to their high precision and ease of…”
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3
Highly Porous, Biocompatible Tough Hydrogels, Processable via Gel Fiber Spinning and 3D Gel Printing
Published in Advanced materials interfaces (01-02-2020)“…Conventional tough hydrogels offer enhanced mechanical properties and high toughness. Their application scope however is limited by their lack of…”
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4
Highly reproducible rat arterial injury model of neointimal hyperplasia
Published in PloS one (17-08-2023)“…Models of arterial injury in rodents have been invaluable to our current understanding of vessel restenosis and play a continuing role in the development of…”
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5
Waste tire-derived porous nitrogen-doped carbon black as an electrode material for supercapacitors
Published in Sustainable chemistry and pharmacy (01-12-2021)“…Given that the disposal of waste tires has become a significant environmental hazard and economic challenge worldwide, establishing practical treatment…”
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6
Patient thermal comfort requirement for hospital environments in Taiwan
Published in Building and environment (01-08-2007)“…This study examines the comfort criteria of ASHRAE Standard 55-2004 for their applicability in hospital environments. Through an extensive field survey…”
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7
Ex Vivo Preservation of Ovine Periosteum Using a Perfusion Bioreactor System
Published in Cells (Basel, Switzerland) (27-06-2023)“…Periosteum is a highly vascularized membrane lining the surface of bones. It plays essential roles in bone repair following injury and reconstruction following…”
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A flexible surface wetness sensor using a RFID technique
Published in Biomedical microdevices (01-02-2008)Get full text
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9
Cyber physical system (CPS) for contactless IC testing
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01-10-2015)“…In this paper, we study the testing flow in fabrication process of stacked-die products. We discuss the difficulties of traditional testing mechanism. To…”
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Conference Proceeding -
10
DNA detection using a radio frequency biosensor with gold nanoparticles
Published in Frontiers in bioscience (01-05-2008)“…This study presents a novel method for DNA detection with multi-layer AuNPs to enhance overall detection sensitivity. This essay achieves not only an…”
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11
Periodic flow patterns of the magnetic fluid in microchannel
Published in Journal of magnetism and magnetic materials (01-03-2007)“…In this study, of interests are the periodic flow patterns of the oil-based magnetic fluid in microchannels. A microfluidic chip is made of…”
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Journal Article Conference Proceeding -
12
A novel CMOS sensor for measuring thermal diffusivity of liquids
Published in Sensors and actuators. A. Physical. (15-04-2007)“…This study aims at designing and developing a CMOS sensor chip for measuring thermal diffusivity of liquids. The CMOS sensor chip is realized by VIS 0.5μm 2P3M…”
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13
On the futility of thermal through-silicon-vias
Published in 2013 International Symposium onVLSI Design, Automation, and Test (VLSI-DAT) (01-04-2013)“…Thermal integrity is one of the most important challenges faced by three-dimensional integrated circuits (3D ICs). Towards this, thermal through-silicon-vias…”
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Conference Proceeding -
14
A novel fluorescence quantification method for polymerase chain reaction system
Published in Optics communications (15-10-2006)“…Due to the increasing demand of simultaneous DNA detection, known as multiplexing detection, in a single sample, the current real-time polymerase chain…”
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15
Thermal stress aware design for stacking IC with through glass via
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01-10-2012)“…Stacking die technology using interposer with through-substrate-via technology has attracted a lot of attention due to various advantages in performance and…”
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Conference Proceeding -
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Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01-05-2012)“…Stacking die technology using through-silicon-via (TSV) technology has attracted a lot of attention due to various advantages in performance and integration…”
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Conference Proceeding -
17
Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01-05-2011)“…Different from traditional static thermal solutions (STS) or dynamic thermal management (DTM), we propose a design of metallic thermal skeletons in order to…”
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Conference Proceeding -
18
Cellular responses to radical propagation from ion-implanted plasma polymer surfaces
Published in Applied surface science (31-10-2018)“…[Display omitted] •Radical-functionalized plasma polymer films (rPPFs) are promising platforms for covalent bio-functionalization.•The surface chemistry,…”
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19
Synthetic vascular graft with spatially distinct architecture for rapid biomimetic cell organisation in a perfusion bioreactor
Published in Biomedical materials (Bristol) (03-05-2022)“…Access to lab-grown fully functional blood vessels would provide an invaluable resource to vascular medicine. The complex architecture and cellular makeup of…”
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20
TSV fault-tolerant mechanisms with application to 3D clock networks
Published in 2011 International SoC Design Conference (01-11-2011)“…Three-dimensional integrated circuit (3D IC) has become an emerging technology in view of its advantages in packing density and flexibility in heterogeneous…”
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Conference Proceeding