Search Results - "Journal of electronic materials"

The Development Trend of Graphene Derivatives by Li, Chen, Zheng, Cun, Cao, Feng, Zhang, Yongqi, Xia, Xinhui

“…Graphene has been considered a star material since its discovery in 2004 due to its attractive properties such as high electronic conductivity, large surface…”
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Current Technology of Supercapacitors: A Review by Sharma, Priyanka, Kumar, Vinod

“…A supercapacitor is a solid-state device that can store electrical energy in the form of charges. It represents an advancement in the field of energy storage,…”
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GaN Technology for Power Electronic Applications: A Review by Flack, Tyler J., Pushpakaran, Bejoy N., Bayne, Stephen B.

“…Power semiconductor devices based on silicon (Si) are quickly approaching their limits, set by fundamental material properties. In order to address these…”
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Investigation of the Structural, Elastic, Electronic, and Optical Properties of Half-Heusler CaMgZ (Z = C, Si, Ge, Sn, Pb) Compounds by Saim, A., Belkharroubi, F., Boufadi, F. Z., Ameri, I., Blaha, L. F., Tebboune, A., Belkaid, M. N., Belkilali, W., Ameri, M., Al-Douri, Y., Abd El-Rehim, A. F.

“…The structural, elastic, electronic, and optical properties of half-Heusler CaMgZ (Z = C, Si, Ge, Sn, Pb) compounds are investigated herein. Density functional…”
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Improved Discharge Energy Density of Poly(vinylidene fluoride)-Based Nanocomposites via a Small Amount of Dopamine-Modified TiO2 Nanosheets by Xu, Jingjing, Fu, Chao, Chu, Huiying, Qian, Jing, Li, Weiyan, Ran, Xianghai, Nie, Wei

“…Dielectric capacitors have attracted increasing attention for their fast charge–discharge speeds as well as high power density, and they have been widely used…”
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Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process by Hwang, Seyeon, Reyes, Edgar I., Moon, Kyoung-sik, Rumpf, Raymond C., Kim, Nam Soo

“…New metal/polymer composite filaments for fused deposition modeling (FDM) processes were developed in order to observe the thermo-mechanical properties of the…”
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Applications of Microwave Materials: A Review by Raveendran, Athira, Sebastian, Mailadil Thomas, Raman, Sujith

“…The performance of microwave devices mainly depends on the properties of materials used in the fabrication. Knowledge of material properties at microwave…”
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A Critical Review of the Role of Carbon Nanotubes in the Progress of Next-Generation Electronic Applications by Maheswaran, Rajalakshmi, Shanmugavel, Balasivanandha Prabu

“…Electronic products are becoming an essential part of our daily life. There is a huge demand to produce small and portable but powerful electronic products…”
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Dye-Sensitized Solar Cell for Indoor Applications: A Mini-Review by Devadiga, Dheeraj, Selvakumar, M., Shetty, Prakasha, Santosh, M. S.

“…Lightweight computing technologies such as the Internet of Things and flexible wearable systems have penetrated our everyday lives exponentially in recent…”
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Recent Advances and Progress in Development of the Field Effect Transistor Biosensor: A Review by Wadhera, Tanu, Kakkar, Deepti, Wadhwa, Girish, Raj, Balwinder

“…The vital utilization of biosensors in different domains has led to the design of much more precise and powerful biosensors, since they have the potential to…”
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Review on Thermal Runaway of Lithium-Ion Batteries for Electric Vehicles by Song, Liubin, Zheng, Youhang, Xiao, Zhongliang, Wang, Cheng, Long, Tianyuan

“…Lithium-ion batteries are favored by the electric vehicle (EV) industry due to their high energy density, good cycling performance and no memory. However, with…”
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The Effect of Indium Doping on Deep Level Defects and Electrical Properties of CdZnTe by Yang, Fan, Jie, Wanqi, Zha, Gangqiang, Xi, Shouzhi, Wang, Miao, Wang, Tao

“…CdZnTe (CZT) ingots doped with different concentrations of indium (2 ppm, 5 ppm, 8 ppm, and 11 ppm) were grown by the Vertical Bridgman Method. The charge…”
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Advances in Supercapacitor Development: Materials, Processes, and Applications by Oyedotun, Kabir O., Ighalo, Joshua O., Amaku, James F., Olisah, Chijioke, Adeola, Adedapo O., Iwuozor, Kingsley O., Akpomie, Kovo G., Conradie, Jeanet, Adegoke, Kayode A.

“…Global carbon reduction targets can be facilitated via energy storage enhancements. Energy derived from solar and wind sources requires effective storage to…”
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Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices by Aziz, Shujahadeen B.

“…An innovative method has been used to reduce the bandgap of poly(vinyl alcohol) (PVA) polymer by addition of a nontoxic, inexpensive, and environmentally…”
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A Review on Printed Electronics with Digital 3D Printing: Fabrication Techniques, Materials, Challenges and Future Opportunities by Rao, C. Hanumanth, Avinash, Kothuru, Varaprasad, B. K. S. V. L., Goel, Sanket

“…The introduction of 3D printing technology has revolutionised the manufacturing and electronic product design in the past few years, where it is used to even…”
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Dispersion Parameters, Polarizability, and Basicity of Lithium Phosphate Glasses by Sayed, M. A., Ali, Atif Mossad, Abd El-Rehim, A. F., Abdel Wahab, E. A., Shaaban, Kh. S.

“…The melt-quenching technique has been used to manufacture glasses in the ( 70 - x ) P 2 O 5 -25Li 2 O-5Al 2 O 3 - x TiO 2 ( 0 ≤ x ≥ 25 ) system. XRD analysis…”
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Commercial GaN-Based Power Electronic Systems: A Review by Pushpakaran, Bejoy N., Subburaj, Anitha S., Bayne, Stephen B.

“…Wide bandgap semiconductor technology is gaining widespread acceptance in the area of high-power and high-temperature power electronics. Gallium nitride (GaN)…”
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Electrochemical Analysis of Indigo Carmine in Food and Water Samples Using a Poly(Glutamic Acid) Layered Multi-walled Carbon Nanotube Paste Electrode by Hareesha, N., Manjunatha, J. G., Amrutha, B. M., Pushpanjali, P. A., Charithra, M. M., Prinith Subbaiah, N.

“…Some colourants are hazardous to living species; hence, a powerful and fast methodology is required for the analysis of those colourants in food and water…”
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Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? by Siow, Kim S.

“…Silver (Ag) has been under development for use as interconnect material for power electronics packaging since the late 1980s. Despite its long development…”
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High-Temperature Capacitor Polymer Films by Tan, Daniel, Zhang, Lili, Chen, Qin, Irwin, Patricia

“…Film capacitor technology has been under development for over half a century to meet various applications such as direct-current link capacitors for…”
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