Search Results - "Journal of Electronic Materials (A.I.M.E. Metallurgical Society); (United States)"

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  1. 1

    UV photon assisted control of interface charge between CdTe substrates and metalorganic chemical vapor deposition CdTe epilayers by NEMIROVSKY, Y, RUZIN, A, BEZINGER, A

    Published in Journal of electronic materials (01-08-1993)
    “…The technology to control the interface charge density between CdTe substrates and CdTe epilayers grown by metalorganic chemical vapor deposition is studied…”
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    Conference Proceeding Journal Article
  2. 2

    Synchrotron white beam x-ray topography analysis of MBE grown CdTe/CdTe (111)B by Fanning, T., Lee, M. B., Casagrande, L. G., Di Marzio, D., Dudley, M.

    Published in Journal of electronic materials (01-08-1993)
    “…Reflection SWBXT indicated that CdTe substrates with comparable X-ray double-crystal rocking curve full width at half max values can have different defect…”
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    Journal Article Conference Proceeding
  3. 3

    Observation of indium-vacancy and indium-hydrogen interactions in Hg[sub 1-x]Cd[sub x]Te by Hughes, W.C., Swanson, M.L., Austin, J.C.

    “…We have used a nuclear hyperfine technique, perturbed [gamma][gamma] angular correlation (PAC), to study the interactions between [sup 111]In and native…”
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    Conference Proceeding
  4. 4

    Structure of organometallic chemical vapor deposited BaTiO[sub 3] thin films on LaAlO[sub 3] by Chen, J., Wills, L.A., Wessels, B.W., Schulz, D.L., Marks, T.J.

    “…BaTiO[sub 3] thin films grown on LaAlO[sub 3] by organometallic chemical vapor deposition were characterized with cross-sectional high resolution transmission…”
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    Conference Proceeding
  5. 5

    Relationship between texture and electromigration lifetime in sputtered Al-1 % Si thin films by CAMPBELL, A. N, MIKAWA, R. E, KNORR, D. B

    Published in Journal of electronic materials (1993)
    “…The relationship among the grain structure, texture, and electromigration lifetime of four Al-1% silicon metallizations produced under similar sputtering…”
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    Conference Proceeding