Search Results - "Josell, D"
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Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing
Published in Electrochimica acta (20-11-2007)“…Superconformal electrodeposition is explained by the curvature enhanced adsorbate coverage (CEAC) mechanism. A CEAC model is used to quantitatively explain…”
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2
Heat transfer through nanoscale multilayered thermal barrier coatings at elevated temperatures
Published in Surface & coatings technology (15-08-2015)“…Heat transfer through thermal barrier coatings (TBCs) composed of alternating nanometer thick layers of aluminum oxide and 7% yttria stabilized zirconia (7YSZ)…”
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3
Stability in thin film multilayers and microlaminates: the role of free energy, structure, and orientation at interfaces and grain boundaries
Published in Scripta materialia (14-04-2003)“…In polycrystalline multilayer systems, the free energies of the interfaces and grain boundaries will determine the relative stability of each layer as well as…”
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4
Superconformal electrodeposition in submicron features
Published in Physical review letters (02-07-2001)“…Superconformal electrodeposition is explained based on a local growth velocity that increases with coverage of a catalytic species adsorbed on the…”
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5
Backcontact CdSe/CdTe windowless solar cells
Published in Solar energy materials and solar cells (01-02-2013)“…This paper details the fabrication and properties of CdSe/CdTe thin film photovoltaic devices with a dual back contact geometry. Device fabrication involves…”
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6
Infrared emission imaging as a tool for characterization of hydrogen storage materials
Published in Journal of alloys and compounds (27-05-2009)“…Combinatorial thin films provide an opportunity for studying a variety of properties over a wide range of compositions and microstructures on a single…”
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7
Orientation and magnetic properties of FePt and CoPt films grown on MgO(1 1 0) single-crystal substrate by electron-beam coevaporation
Published in Materials science & engineering. B, Solid-state materials for advanced technology (25-09-2007)“…We have studied the orientation and magnetic properties of FePt and CoPt films deposited by electron-beam co-evaporation on MgO(1 1 0) single-crystal…”
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8
Hillock and whisker growth on Sn and SnCu electrodeposits on a substrate not forming interfacial intermetallic compounds
Published in Journal of electronic materials (01-03-2007)“…Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to…”
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9
Interceptive Orthodontic Treatment may be Effective in Reducing the Severity of Developing Malocclusion
Published in The journal of evidence-based dental practice (01-03-2011)“…Article Title and Bibliographic Information Dental effects of interceptive orthodontic treatment in a Medicaid population: interim results from a randomized…”
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10
The formation of f.c.c. titanium in titanium-aluminum multilayers
Published in Acta materialia (01-01-1996)“…The Ti layers in AlTi multilayers are shown to transform from hexagonal close packed in the as-deposited multilayers to face centered cubic on ion milling in…”
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11
Determination of the CoTi congruent melting point and thermodynamic reassessment of the Co-Ti system
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01-09-2001)“…New experimental results and a thermodynamic re-evaluation of the Co-Ti system are presented. Using differential thermal analysis (DTA) and a visual…”
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12
Tensile testing low density multilayers: Aluminum/titanium
Published in Journal of materials research (01-10-1998)“…Yield stresses, ultimate tensile strengths, and specific strengths of aluminum/titanium multilayer thin films are determined from the results of uniaxial…”
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13
Simulating Cu electrodeposition in high aspect ratio features: Effect of control mode and uncompensated resistance in S-NDR systems
Published in Electrochimica acta (10-04-2021)“…Void-free Cu electrodeposition in high aspect ratio features requires, at a minimum, an additive package containing micromolar halide and polyether that…”
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14
Face-centered-cubic titanium: An artifact in titanium/aluminum multilayers
Published in Journal of materials research (01-05-1999)“…The present investigation is the first comprehensive comparative study of x-ray diffraction (XRD) and transmission electron microscopy (TEM) results to address…”
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15
Comment on “Dimensionally Induced Structural Transformations in Titanium-Aluminum Multilayers”
Published in Physical review letters (01-03-1999)Get full text
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A new method for tensile testing of thin films
Published in Journal of materials research (01-01-1993)Get full text
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17
Combinatorial investigation of structural quality of Au/Ni contacts on GaN
Published in Applied surface science (15-02-2004)“…A combinatorial library of Au/Ni metallizations on GaN was microstructurally characterized by X-ray diffraction (XRD), electron back-scattered diffraction…”
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Journal Article Conference Proceeding -
18
Measuring the interface stress: Silver/nickel interfaces
Published in Journal of materials research (01-11-1999)“…Interface stress is a surface thermodynamics quantity associated with the reversible work of elastically straining an internal solid interface. In a…”
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19
Habits affecting dental and maxillofacial growth and development
Published in The Dental clinics of North America (01-10-1995)“…In concluding this discussion, it is apparent that altered oral function or rest position may have a significant influence on the developing orofacial region…”
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20
Thermal transport through thin films: Mirage technique measurements on aluminum/titanium multilayers
Published in Journal of materials research (01-03-2000)“…Thermal transport properties of multilayer thin films both normal and parallel to the layers were measured. Al/Ti multilayer films 3 μm thick, with individual…”
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