Search Results - "Josell, D"

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  1. 1

    Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing by Moffat, T.P., Wheeler, D., Kim, S.-K., Josell, D.

    Published in Electrochimica acta (20-11-2007)
    “…Superconformal electrodeposition is explained by the curvature enhanced adsorbate coverage (CEAC) mechanism. A CEAC model is used to quantitatively explain…”
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    Journal Article Conference Proceeding
  2. 2

    Heat transfer through nanoscale multilayered thermal barrier coatings at elevated temperatures by Josell, D., Bonevich, J.E., Nguyen, T.M., Johnson, R.N.

    Published in Surface & coatings technology (15-08-2015)
    “…Heat transfer through thermal barrier coatings (TBCs) composed of alternating nanometer thick layers of aluminum oxide and 7% yttria stabilized zirconia (7YSZ)…”
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    Journal Article
  3. 3

    Stability in thin film multilayers and microlaminates: the role of free energy, structure, and orientation at interfaces and grain boundaries by Lewis, A.C., Josell, D., Weihs, T.P.

    Published in Scripta materialia (14-04-2003)
    “…In polycrystalline multilayer systems, the free energies of the interfaces and grain boundaries will determine the relative stability of each layer as well as…”
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    Journal Article
  4. 4

    Superconformal electrodeposition in submicron features by Josell, D, Wheeler, D, Huber, W H, Moffat, T P

    Published in Physical review letters (02-07-2001)
    “…Superconformal electrodeposition is explained based on a local growth velocity that increases with coverage of a catalytic species adsorbed on the…”
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    Journal Article
  5. 5

    Backcontact CdSe/CdTe windowless solar cells by Kim, D.U., Hangarter, C.M., Debnath, R., Ha, J.Y., Beauchamp, C.R., Widstrom, M.D., Guyer, J.E., Nguyen, N., Yoo, B.Y., Josell, D.

    Published in Solar energy materials and solar cells (01-02-2013)
    “…This paper details the fabrication and properties of CdSe/CdTe thin film photovoltaic devices with a dual back contact geometry. Device fabrication involves…”
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    Journal Article
  6. 6

    Infrared emission imaging as a tool for characterization of hydrogen storage materials by Oguchi, H., Heilweil, E.J., Josell, D., Bendersky, L.A.

    Published in Journal of alloys and compounds (27-05-2009)
    “…Combinatorial thin films provide an opportunity for studying a variety of properties over a wide range of compositions and microstructures on a single…”
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    Journal Article
  7. 7

    Orientation and magnetic properties of FePt and CoPt films grown on MgO(1 1 0) single-crystal substrate by electron-beam coevaporation by Yu, Minghui, Ohguchi, H., Zambano, A., Takeuchi, I., Liu, J.P., Josell, D., Bendersky, L.A.

    “…We have studied the orientation and magnetic properties of FePt and CoPt films deposited by electron-beam co-evaporation on MgO(1 1 0) single-crystal…”
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  8. 8

    Hillock and whisker growth on Sn and SnCu electrodeposits on a substrate not forming interfacial intermetallic compounds by WILLIAMS, M. E, MOON, K.-W, BOETTINGER, W. J, JOSELL, D, DEAL, A. D

    Published in Journal of electronic materials (01-03-2007)
    “…Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to…”
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    Journal Article
  9. 9

    Interceptive Orthodontic Treatment may be Effective in Reducing the Severity of Developing Malocclusion by Josell, Stuart D., DMD, MDent Sc

    “…Article Title and Bibliographic Information Dental effects of interceptive orthodontic treatment in a Medicaid population: interim results from a randomized…”
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    Journal Article
  10. 10

    The formation of f.c.c. titanium in titanium-aluminum multilayers by Van Heerden, D., Josell, D., Shechtman, D.

    Published in Acta materialia (01-01-1996)
    “…The Ti layers in AlTi multilayers are shown to transform from hexagonal close packed in the as-deposited multilayers to face centered cubic on ion milling in…”
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    Journal Article
  11. 11

    Determination of the CoTi congruent melting point and thermodynamic reassessment of the Co-Ti system by DAVYDOV, A. V, KATTNER, U. R, JOSELL, D, BLENDELL, J. E, WATERSTRAT, R. M, SHAPIRO, A. J, BOETTINGER, W. J

    “…New experimental results and a thermodynamic re-evaluation of the Co-Ti system are presented. Using differential thermal analysis (DTA) and a visual…”
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    Journal Article
  12. 12

    Tensile testing low density multilayers: Aluminum/titanium by Josell, D., van Heerden, D., Read, D., Bonevich, J., Shechtman, D.

    Published in Journal of materials research (01-10-1998)
    “…Yield stresses, ultimate tensile strengths, and specific strengths of aluminum/titanium multilayer thin films are determined from the results of uniaxial…”
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    Journal Article
  13. 13

    Simulating Cu electrodeposition in high aspect ratio features: Effect of control mode and uncompensated resistance in S-NDR systems by Braun, T.M., Josell, D., Moffat, T.P.

    Published in Electrochimica acta (10-04-2021)
    “…Void-free Cu electrodeposition in high aspect ratio features requires, at a minimum, an additive package containing micromolar halide and polyether that…”
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    Journal Article
  14. 14

    Face-centered-cubic titanium: An artifact in titanium/aluminum multilayers by Bonevich, J., van Heerden, D., Josell, D.

    Published in Journal of materials research (01-05-1999)
    “…The present investigation is the first comprehensive comparative study of x-ray diffraction (XRD) and transmission electron microscopy (TEM) results to address…”
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    Journal Article
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    Combinatorial investigation of structural quality of Au/Ni contacts on GaN by Davydov, A.V., Bendersky, L.A., Boettinger, W.J., Josell, D., Vaudin, M.D., Chang, K.-S., Takeuchi, I.

    Published in Applied surface science (15-02-2004)
    “…A combinatorial library of Au/Ni metallizations on GaN was microstructurally characterized by X-ray diffraction (XRD), electron back-scattered diffraction…”
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    Journal Article Conference Proceeding
  18. 18

    Measuring the interface stress: Silver/nickel interfaces by Josell, D., Bonevich, J. E., Shao, I., Cammarata, R. C.

    Published in Journal of materials research (01-11-1999)
    “…Interface stress is a surface thermodynamics quantity associated with the reversible work of elastically straining an internal solid interface. In a…”
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    Journal Article
  19. 19

    Habits affecting dental and maxillofacial growth and development by Josell, S D

    Published in The Dental clinics of North America (01-10-1995)
    “…In concluding this discussion, it is apparent that altered oral function or rest position may have a significant influence on the developing orofacial region…”
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    Journal Article
  20. 20

    Thermal transport through thin films: Mirage technique measurements on aluminum/titanium multilayers by Gonzalez, E. J., Bonevich, J. E., Stafford, G. R., White, G., Josell, D.

    Published in Journal of materials research (01-03-2000)
    “…Thermal transport properties of multilayer thin films both normal and parallel to the layers were measured. Al/Ti multilayer films 3 μm thick, with individual…”
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    Journal Article