Search Results - "Jong-Shiou Peng"
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The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01-10-2012)“…In this study, various micro-bump-bonded structures with TCB + NCP processes were evaluated and developed. A commercial available snap-cure NCP material was…”
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Conference Proceeding
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Development of 30 μm pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip (COC) interconnects
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01-10-2010)“…In this study, the assembly processes and reliability performance of interconnects with 30 μm pitch Cu/Ni/SnAg joints are evaluated, Plasma was treated on the…”
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Conference Proceeding -
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Development of micro-bump-bonded processes for 3DIC stacking with high throughput
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01-10-2011)“…Various approaches of high throughput bonding processes were investigated in the micro-bump-bonded processes for 3DIC stacking. The two-step bonding methods,…”
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Conference Proceeding