Search Results - "Johnson, Christopher Mark"
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1
A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module
Published in IEEE transactions on power electronics (01-03-2018)“…This paper is concerned with the thermal models which can physically reflect the heat-flow paths in a lightweight three-phase half-bridge two-level SiC power…”
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Journal Article -
2
A GaN-HEMT Compact Model Including Dynamic RDSon Effect for Power Electronics Converters
Published in Energies (Basel) (09-04-2021)“…In order to model GaN-HEMT switching transients and determine power losses, a compact model including dynamic RDSon effect is proposed herein. The model…”
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Journal Article -
3
Characterisation and Modeling of Gallium Nitride Power Semiconductor Devices Dynamic On-State Resistance
Published in IEEE transactions on power electronics (01-06-2018)“…Gallium nitride high-electron-mobility transistors (GaN-HEMTs) suffer from trapping effects that increases device on-state resistance (RDS(on)) above its…”
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Journal Article -
4
Accurate Measurement of Dynamic on-State Resistances of GaN Devices Under Reverse and Forward Conduction in High Frequency Power Converter
Published in IEEE transactions on power electronics (01-09-2020)“…Because of trapped charges in GaN transistor structure, device dynamic on -state resistance <inline-formula><tex-math…”
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Journal Article -
5
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints
Published in Microelectronics and reliability (01-05-2018)“…The power cycling reliability of flexible printed circuit board (PCB) interconnect smaller/thinner (ST) 9.5 mm × 5.5 mm × 0.07 mm and larger/thicker (LT)…”
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Journal Article -
6
Dependence of overcurrent failure modes of IGBT modules on interconnect technologies
Published in Microelectronics and reliability (01-12-2015)“…Insulated gate bipolar transistor (IGBT) modules which can fail to short circuit mode have great of applications in electricity network related fields. Single…”
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Journal Article -
7
Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process
Published in Microelectronics and reliability (01-08-2020)“…This study investigates a time-reduced sintering process for die attachment, prepared, within a processing time of several seconds using dry nanosilver film…”
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Journal Article -
8
Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects
Published in IEEE transactions on power electronics (01-05-2015)“…A stacked substrate-chip-bump-chip-substrate assembly has been demonstrated in the construction of power switch modules with high power density and good…”
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Journal Article -
9
Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles
Published in Journal of materials processing technology (01-01-2015)“…•Effects of Ag sintering parameters on shear strength of die attachment are revealed.•Modes of shear failure depending on bonding strength of sintered Ag are…”
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Journal Article -
10
Development and Validation of a Smart Architecture for Thyristor Valves
Published in IEEE journal of emerging and selected topics in power electronics (01-08-2023)“…A high voltage thyristor converter is realized by many valve sections, whose volume is approximately occupied for only the 10% by thyristors and for the 10% by…”
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Journal Article -
11
Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-05-2017)“…Insulated gate bipolar transistor (IGBT) modules, which can fail to stable short-circuit mode, have major applications in electricity network-related fields…”
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Journal Article -
12
Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure
Published in IEEE journal of emerging and selected topics in power electronics (01-03-2018)“…This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in…”
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Journal Article -
13
Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment
Published in Molecular Crystals and Liquid Crystals (22-11-2014)“…The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanoparticles at 240°C and 5 MPa for 3 to 17 minutes. Their…”
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Journal Article -
14
Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling
Published in IEEE transactions on device and materials reliability (01-06-2018)“…13.5 mm <inline-formula> <tex-math notation="LaTeX">{\times }\,\, </tex-math></inline-formula>13.5 mm sintered nano-silver attachments for power devices onto…”
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Magazine Article -
15
Interleukin-2 based therapy for the treatment of Type I diabetes
Published 01-01-2013“…Type I diabetes (T1D) is an autoimmune disease characterized by the destruction of the insulin producing beta cells. Although multiple cell types contribute,…”
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Dissertation -
16
Reciprocal regulation between the prgQ and prgX operons of pCF10, a conjugative plasmid of Enterococcus faecalis
Published 01-01-2011“…Regulation of conjugation of pCF10, a pheromone-response plasmid of Enterococcus faecalis, is a well characterized process that serves as a model for the…”
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Dissertation -
17
Robust Communication in Vehicular Ad Hoc Networks
Published 01-01-2010“…The development of intelligent transportation systems is one of the most important strategies for making roads safer and more efficient. The key technology…”
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Dissertation -
18
Thermal performance and reliability of high temperature SiC power module with direct-cooled stacked Si3N4 substrates
Published in 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) (01-05-2018)“…This work is concerned with the thermal performance and reliability of the SiC power module with direct-cooled stacked Si 3 N 4 substrates for high temperature…”
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Conference Proceeding -
19
A High Performance and Low Cost Half Bridge IGBT Planar Power Module
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01-08-2018)“…This study presents the development and performance of a half bride insulated-gate bipolar transistor planar power module integrated with a turbulent water…”
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Conference Proceeding -
20
Reciprocal regulation between the prgQ and prgX operons of pCF10, a conjugative plasmid of Enterococcus faecalis
Get full text
Dissertation