Search Results - "Johnson, Christopher Mark"

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  1. 1

    A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module by Jianfeng Li, Castellazzi, Alberto, Eleffendi, Mohd Amir, Gurpinar, Emre, Johnson, Christopher Mark, Mills, Liam

    Published in IEEE transactions on power electronics (01-03-2018)
    “…This paper is concerned with the thermal models which can physically reflect the heat-flow paths in a lightweight three-phase half-bridge two-level SiC power…”
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    Journal Article
  2. 2

    A GaN-HEMT Compact Model Including Dynamic RDSon Effect for Power Electronics Converters by Li, Ke, Evans, Paul Leonard, Johnson, Christopher Mark, Videt, Arnaud, Idir, Nadir

    Published in Energies (Basel) (09-04-2021)
    “…In order to model GaN-HEMT switching transients and determine power losses, a compact model including dynamic RDSon effect is proposed herein. The model…”
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    Journal Article
  3. 3

    Characterisation and Modeling of Gallium Nitride Power Semiconductor Devices Dynamic On-State Resistance by Li, Ke, Evans, Paul Leonard, Johnson, Christopher Mark

    Published in IEEE transactions on power electronics (01-06-2018)
    “…Gallium nitride high-electron-mobility transistors (GaN-HEMTs) suffer from trapping effects that increases device on-state resistance (RDS(on)) above its…”
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    Journal Article
  4. 4

    Accurate Measurement of Dynamic on-State Resistances of GaN Devices Under Reverse and Forward Conduction in High Frequency Power Converter by Li, Ke, Videt, Arnaud, Idir, Nadir, Evans, Paul Leonard, Johnson, Christopher Mark

    Published in IEEE transactions on power electronics (01-09-2020)
    “…Because of trapped charges in GaN transistor structure, device dynamic on -state resistance <inline-formula><tex-math…”
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    Journal Article
  5. 5

    Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints by Li, Jianfeng, Dai, Jingru, Johnson, Christopher Mark

    Published in Microelectronics and reliability (01-05-2018)
    “…The power cycling reliability of flexible printed circuit board (PCB) interconnect smaller/thinner (ST) 9.5 mm × 5.5 mm × 0.07 mm and larger/thicker (LT)…”
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    Journal Article
  6. 6

    Dependence of overcurrent failure modes of IGBT modules on interconnect technologies by Yaqub, Imran, Li, Jianfeng, Johnson, Christopher Mark

    Published in Microelectronics and reliability (01-12-2015)
    “…Insulated gate bipolar transistor (IGBT) modules which can fail to short circuit mode have great of applications in electricity network related fields. Single…”
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    Journal Article
  7. 7

    Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark

    Published in Microelectronics and reliability (01-08-2020)
    “…This study investigates a time-reduced sintering process for die attachment, prepared, within a processing time of several seconds using dry nanosilver film…”
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    Journal Article
  8. 8

    Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects by Jianfeng Li, Castellazzi, Alberto, Tianxiang Dai, Corfield, Martin, Solomon, Adane Kassa, Johnson, Christopher Mark

    Published in IEEE transactions on power electronics (01-05-2015)
    “…A stacked substrate-chip-bump-chip-substrate assembly has been demonstrated in the construction of power switch modules with high power density and good…”
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    Journal Article
  9. 9

    Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles by Li, Jianfeng, Johnson, Christopher Mark, Buttay, Cyril, Sabbah, Wissam, Azzopardi, Stéphane

    Published in Journal of materials processing technology (01-01-2015)
    “…•Effects of Ag sintering parameters on shear strength of die attachment are revealed.•Modes of shear failure depending on bonding strength of sintered Ag are…”
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    Journal Article
  10. 10

    Development and Validation of a Smart Architecture for Thyristor Valves by Sala, G., De Bonis, G., Costabeber, A., Tani, A., Johnson, M., Clare, J.

    “…A high voltage thyristor converter is realized by many valve sections, whose volume is approximately occupied for only the 10% by thyristors and for the 10% by…”
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    Journal Article
  11. 11

    Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior by Jianfeng Li, Yaqub, Imran, Corfield, Martin, Johnson, Christopher Mark

    “…Insulated gate bipolar transistor (IGBT) modules, which can fail to stable short-circuit mode, have major applications in electricity network-related fields…”
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    Journal Article
  12. 12

    Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure by Hui Zhang, Jianfeng Li, Jingru Dai, Corfield, Martin, Xuejian Liu, Yan Liu, Zhengren Huang, Johnson, Christopher Mark

    “…This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in…”
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    Journal Article
  13. 13

    Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment by Wang, Yun, Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark, Li, Shuguang

    Published in Molecular Crystals and Liquid Crystals (22-11-2014)
    “…The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanoparticles at 240°C and 5 MPa for 3 to 17 minutes. Their…”
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    Journal Article
  14. 14

    Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark

    “…13.5 mm <inline-formula> <tex-math notation="LaTeX">{\times }\,\, </tex-math></inline-formula>13.5 mm sintered nano-silver attachments for power devices onto…”
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    Magazine Article
  15. 15

    Interleukin-2 based therapy for the treatment of Type I diabetes by Johnson, Mark Christopher

    Published 01-01-2013
    “…Type I diabetes (T1D) is an autoimmune disease characterized by the destruction of the insulin producing beta cells. Although multiple cell types contribute,…”
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    Dissertation
  16. 16

    Reciprocal regulation between the prgQ and prgX operons of pCF10, a conjugative plasmid of Enterococcus faecalis by Johnson, Christopher Mark

    Published 01-01-2011
    “…Regulation of conjugation of pCF10, a pheromone-response plasmid of Enterococcus faecalis, is a well characterized process that serves as a model for the…”
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    Dissertation
  17. 17

    Robust Communication in Vehicular Ad Hoc Networks by Johnson, Mark Christopher

    Published 01-01-2010
    “…The development of intelligent transportation systems is one of the most important strategies for making roads safer and more efficient. The key technology…”
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    Dissertation
  18. 18

    Thermal performance and reliability of high temperature SiC power module with direct-cooled stacked Si3N4 substrates by Dai, Jingru, Li, Jianfeng, Mouawad, Bassem, Johnson, Christopher Mark

    “…This work is concerned with the thermal performance and reliability of the SiC power module with direct-cooled stacked Si 3 N 4 substrates for high temperature…”
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    Conference Proceeding
  19. 19

    A High Performance and Low Cost Half Bridge IGBT Planar Power Module by Li, Jainfeng, Li, Ke, Dai, Jingru, Johnson, Christopher Mark, Lin, Xi

    “…This study presents the development and performance of a half bride insulated-gate bipolar transistor planar power module integrated with a turbulent water…”
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    Conference Proceeding
  20. 20

    Reciprocal regulation between the prgQ and prgX operons of pCF10, a conjugative plasmid of Enterococcus faecalis by Johnson, Christopher Mark

    “…Regulation of conjugation of pCF10, a pheromone-response plasmid of Enterococcus faecalis, is a well characterized process that serves as a model for the…”
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    Dissertation