Search Results - "Jiu, JinTing"

Metallic Nanowires and Their Application by Jinting Jiu, Suganuma, Katsuaki

“…Metallic nanowire films, especially silver nano-wires (AgNWs) and copper nanowires (CuNWs), with a random mesh structure have attracted considerable attention…”
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Fabrication of Silver Nanowire Transparent Electrodes at Room Temperature by Tokuno, Takehiro, Nogi, Masaya, Karakawa, Makoto, Jiu, Jinting, Nge, Thi Thi, Aso, Yoshio, Suganuma, Katsuaki

“…Silver nanowires （AgNWs） surrounded by insulating poly（vinylpyrrolidone） have been synthesized by a polyol process and employed as transparent electrodes. The…”
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Determination of Parameters of Electron Transport in Dye-Sensitized Solar Cells Using Electrochemical Impedance Spectroscopy by Adachi, Motonari, Sakamoto, Masaru, Jiu, Jinting, Ogata, Yukio, Isoda, Seiji

“…The same equation was derived from two different impedance models based on the quite different physical descriptions proposed by Kern et al. and by Bisquert. ,…”
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Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light by Yang, Yang, Ding, Su, Araki, Teppei, Jiu, Jinting, Sugahara, Tohru, Wang, Jun, Vanfleteren, Jan, Sekitani, Tsuyoshi, Suganuma, Katsuaki

“…Silver nanowires （AgNWs） have emerged as a promising nanomaterial for next generation stretchable electronics. However, until now, the fabrication of AgNW-…”
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In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste by Zhang, Hao, Gao, Yue, Jiu, Jinting, Suganuma, Katsuaki

“…Silver sintering joining technology provides lead-free die attachment with excellent thermal conductivity and compatibility with high-temperature (≥300 °C)…”
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Efficient assembly of high-performance reduced graphene oxide/silver nanowire transparent conductive film based on in situ light-induced reduction technology by Li, Lingying, Li, Wanli, Jiu, Jinting, Suganuma, Katsuaki

“…[Display omitted] •A rGO/AgNW TCF has been realized by a facile coating-irradiation process.•The light absorption property of AgNW is utilized rationally to…”
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Bonding technology based on solid porous Ag for large area chips by Chen, Chuantong, Noh, Seungjun, Zhang, Hao, Choe, Chanyang, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

“…A bonding technology is introduced by using surface polished porous Ag in die-attachment structure. Bonding strength did not change much as the chip size…”
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High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device by Zhang, Hao, Chen, Chuantong, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

“…Micron Ag paste had a more affordable price, feasible large-scale synthesis, and longer storage life compared to nano Ag paste, thus it attracts much…”
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Highly conductive and transparent copper nanowire electrodes on surface coated flexible and heat-sensitive substrates by Ding, Su, Tian, Yanhong, Jiu, Jinting, Suganuma, Katsuaki

“…Copper nanowire (CuNW) based flexible transparent electrodes have been extensively investigated due to their outstanding performances and low price. However,…”
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Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere by Gao, Yue, Li, Wanli, Chen, Chuantong, Zhang, Hao, Jiu, Jinting, Li, Cai-Fu, Nagao, Shijo, Suganuma, Katsuaki

“…A novel die-attach material, Cu particle paste with self-reduction and self-protection characteristics, was designed by simply adding ascorbic acid (AA) into…”
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Low haze transparent electrodes and highly conducting air dried films with ultra-long silver nanowires synthesized by one-step polyol method by Araki, Teppei, Jiu, Jinting, Nogi, Masaya, Koga, Hirotaka, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

“…Transparent electrodes made of silver nanowires （AgNWs） exhibit higher flexibility when compared to those made of tin doped indium oxide （ITO） and are expected…”
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Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices by Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Jiu, Jinting, Sugahara, Tohru, Zhang, Hao, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

“…The application of microporous sintered silver (Ag) as a bonding material to replace conventional die-bonding materials in power electronic devices has…”
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Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres by Gao, Yue, Zhang, Hao, Li, Wanli, Jiu, Jinting, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

“…A one-step polyol method was employed to synthesize bimodal Cu particles with average diameters around 200 nm and 1000 nm, respectively. The bimodal Cu…”
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One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices by Ding, Su, Jiu, Jinting, Gao, Yue, Tian, Yanhong, Araki, Teppei, Sugahara, Tohru, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Suganuma, Katsuaki, Uchida, Hiroshi

“…Copper nanowire (CuNW) conductors have been considered to have a promising perspective in the area of stretchable electronics due to the low price and high…”
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Intense pulsed light-induced structure-transformed ultrathin Ni shell for improving the chemical, thermal, and electrical reliability of metal nanowire electrodes without transmittance loss by Li, Lingying, Li, Wanli, Tong, Ke, Jiu, Jinting, Suganuma, Katsuaki

“…[Display omitted] •IPL enables the structural transformation from scattered Ni crumbs to a Ni shell.•The transformation causes no damage to AgNW networks and…”
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The rise of conductive copper inks: challenges and perspectives by Li, Wanli, Sun, Qingqing, Li, Lingying, Jiu, Jinting, Liu, Xu-Ying, Kanehara, Masayuki, Minari, Takeo, Suganuma, Katsuaki

“…[Display omitted] •Mainstream strategies for avoiding oxidation of Cu inks are reviewed.•Cu precursor inks are elaborated as an effective strategy.•Efficient…”
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Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability by Li, Wanli, Li, Lingying, Gao, Yue, Hu, Dawei, Li, Cai-Fu, Zhang, Hao, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

“…Submicron Cu particles mixed with Cu complex are used successfully to fabricate highly conductive Cu films for printed electronics. This study investigates the…”
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Direct fabrication of high-resolution and high-performance flexible electronics via surface-activation-localized electroless plating by Li, Wanli, Li, Lingying, Sun, Qingqing, Liu, Xuying, Kanehara, Masayuki, Nakayama, Tomonobu, Jiu, Jinting, Sakamoto, Kenji, Minari, Takeo

“…[Display omitted] •Surface-activation-localized electroless plating enables high resolution electronics.•1 µm resolution multi-metal patterns are realized on…”
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Self-healing of cracks in Ag joining layer for die-attachment in power devices by Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Jiu, Jinting, Zhang, Hao, Sugahara, Tohru, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

“…Sintered silver (Ag) joining has attracted significant interest in power devices modules for its ability to form stable joints with a porous interconnection…”
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Hybrid transparent electrodes of silver nanowires and carbon nanotubes: a low-temperature solution process by Tokuno, Takehiro, Nogi, Masaya, Jiu, Jinting, Suganuma, Katsuaki

“…Hybrid transparent electrodes with silver nanowires (AgNWs) and single-walled carbon nanotubes (SWCNTs) were fabricated on plastic films by a low-temperature…”
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