Search Results - "Jin, SangHyun"

Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV) by Kim, Youjung, Jin, Sanghyun, Park, Kimoon, Lee, Jinhyun, Lim, Jae-Hong, Yoo, Bongyoung

“…Thermal stress induced by annealing the Cu filling of through-silicon vias (TSVs) requires further investigation as it can inhibit the performance of…”
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Through-silicon-via (TSV) filling by electrodeposition with pulse-reverse current by Jin, Sanghyun, Seo, Sungho, Park, Sangwo, Yoo, Bongyoung

“…The through-Si-via (TSV) interconnection provides the ideal 3D interconnection in a next generation semiconductor device which has significantly innovated…”
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Cortical activation pattern during shoulder simple versus vibration exercises： a functional near infrared spectroscopy study by Jang, Sung Ho, Yeo, Sang Seok, Lee, Seung Hyun, Jin, Sang Hyun, Lee, Mi Young

“…To date, the cortical effect of exercise has not been fully elucidated. Using the functional near infrared spectroscopy, we attempted to compare the cortical…”
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Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT®) Packaging with Fine Pitch Embedded Trace RDL by Jin, SangHyun, Do, WonChul, Jeong, JinSuk, Cha, HyunGoo, Jeong, YunKyung, Khim, JinYoung

“…This paper presents an advanced redistribution layer (RDL) technology called embedded trace RDL (ETR) for use in the substrate Silicon Wafer Integrated Fan-out…”
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