Search Results - "Jie-Wei Lai"

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  1. 1

    Design of variable gain amplifier with gain-bandwidth product up to 354 GHz implemented in InP-InGaAs DHBT technology by Jie-Wei Lai, Yu-Ju Chuang, Cimino, K., Milton Feng

    “…A high-gain and wide-band variable gain amplifier (VGA) is developed using 300-GHz InP-InGaAs double-heterojunction bipolar transistor (DHBT). Negative-R/sub…”
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    Journal Article
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    Hydroxyethyl cellulose-grafted loofa sponge-based metal affinity adsorbents for protein purification and enzyme immobilization by Lai, Wei-Jie, Lin, Sung-Chyr

    Published in Process biochemistry (1991) (01-11-2018)
    “…[Display omitted] •Loofa sponge-based IMAC adsorbents for protein purification was prepared.•Grafting of hydroxyl ethylcellulose (HEC) increased the capacity…”
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    Journal Article
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    A World-Band Triple-Mode 802.11a/b/g SOC in 130-nm CMOS by LAI, Jie-Wei, WU, Chia-Hsin, LIN, Anson, HONG, Wei-Kai, WANG, Cheng-Yu, SHEN, Chih-Hsien, LIN, Yu-Hsin, CHO, Yi-Hsien, CHEN, Yang-Chuan, CHUNG, Yuan-Hung

    Published in IEEE journal of solid-state circuits (01-11-2009)
    “…A fully integrated system-on-a-chip (SOC) in 130-nm CMOS technology compliant with world-band 802.11a/b/g is presented. This SOC integrates all blocks…”
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    Journal Article Conference Proceeding
  4. 4

    A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications by Valdes-Garcia, Alberto, Floyd, Brian, Nicolson, Sean T., Lai, Jie-Wei, Natarajan, Arun, Chen, Ping-Yu, Reynolds, Scott K., Zhan, Jing-Hong Conan, Kam, Dong G., Liu, Duixian

    Published in IEEE journal of solid-state circuits (01-12-2010)
    “…A phased-array transmitter (TX) for multi-Gb/s non-line-of-sight links in the four frequency channels of the IEEE 802.15.3c standard (58.32 to 64.8 GHz) is…”
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    Journal Article Conference Proceeding
  5. 5

    A 1V 17.9dBm 60GHz power amplifier in standard 65nm CMOS by Jie-Wei Lai, Valdes-Garcia, A.

    “…A CMOS PA integrating a power detector for all IEEE 802.15.3c bands is demonstrated. A fully synchronous power combiner removes design trade-offs between…”
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    Conference Proceeding
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    Submicron InP-InGaAs single heterojunction bipolar transistors with fT of 377 GHz by Hafez, W., Jie-Wei Lai, Feng, M.

    Published in IEEE electron device letters (01-05-2003)
    “…Submicron InP-InGaAs-based single heterojunction bipolar transistors (SHBTs) are fabricated to achieve record-breaking speed performance using an aggressively…”
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    Journal Article
  7. 7

    Low-power high-speed operation of submicron InP-InGaAs SHBTs at 1 mA by Hafez, W., Jie-Wei Lai, Feng, M.

    Published in IEEE electron device letters (01-07-2003)
    “…Scaling of submicron InP-InGaAs HBTs is investigated for low-power high-speed applications in mixed signal circuits. Device performance for transistors…”
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    Journal Article
  8. 8

    A SiGe BiCMOS 16-element phased-array transmitter for 60GHz communications by Valdes-Garcia, A., Nicolson, S., Jie-Wei Lai, Natarajan, A., Ping-Yu Chen, Reynolds, S., Zhan, J.-H.C., Floyd, B.

    “…A 60 GHz phased-array transmitter for multi-Gb/s non-line-of-sight links is fully integrated in a 0.12 ¿m SiGe BiCMOS process. It consists of an up-conversion…”
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    Conference Proceeding
  9. 9

    Carrier diffusion effect in tapered semiconductor-laser amplifier by LAI, J.-W, LIN, C.-F

    Published in IEEE journal of quantum electronics (01-07-1998)
    “…This paper proposes a theoretical model to study the beam amplification and the influence of the lateral drift and diffusion on the tapered semiconductor-laser…”
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    Journal Article
  10. 10

    Opportunity and Challenge of Chiplet-Based HPC and AIoT by Lai, Jie-Wei

    “…High-performance computing and AI tremendously drive technology innovations on architecture, algorithm, memory, and semiconductor design, and continuously…”
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    Conference Proceeding
  11. 11

    Vertical scaling of 0.25-μm emitter InP/InGaAs single heterojunction bipolar transistors with fT of 452 GHz by Hafez, W., Jie-Wei Lai, Feng, M.

    Published in IEEE electron device letters (01-07-2003)
    “…Vertical scaling of the epitaxial structure has allowed submicron InP/InGaAs-based single heterojunction bipolar transistors (SHBTs) to achieve record…”
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    Journal Article
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    A visualization tool for observing metaheuristic algorithm: Epanel by Yao-Hsin Chou, Shu-Yu Kuo, Wei-Jie Lai, Wang-Bin Lai

    “…Metaheuristic algorithms are important methods to solve many complicated optimization problems. However, there are no significant studies that present an…”
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    Conference Proceeding
  14. 14

    Over 500 GHz InP heterojunction bipolar transistors by Feng, M., Hafez, W., Jie-Wie Lai

    “…Single heterojunction bipolar transistors (SHBTs) with cutoff frequencies as high as 520 GHz operating at current densities over 1400 kA/cm/sup 2/ have been…”
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    Conference Proceeding
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    An initial edge point selection and segmental contour following for object contour extraction by Hsu, R C, Ping-Wen Kao, Wei-Jie Lai, Cheng-Ting Liu

    “…Image segmentation is a technique used to segment region of interest (ROI) in the image for further image processing applications. Contour extraction is one of…”
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    Conference Proceeding
  17. 17

    Single-element and phased-array transceiver chipsets for 60-ghz Gb/s communications by Valdes-Garcia, Alberto, Zhan, Jing-Hong Conan, Nicolson, Sean, Floyd, Brian, Reynolds, Scott, Natarajan, Arun, Kam, Dong, Liu, Duixian, Lai, Jie-Wei, Huang, Yen-Lin Oscar, Chen, Ping-Yu, Tsai, Ming-Da

    Published in IEEE communications magazine (01-04-2011)
    “…This article summarizes the development of mature and highly integrated SiGe BiCMOS ICs for gigabit-per-second communications according to the requirements of…”
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    Magazine Article
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    A world-band triple-mode 802.11a/b/g SOC in 0.13um CMOS by Chia-Hsin Wu, Yuan-Hung Chung, Anson Lin, Wei-Kai Hong, Jie-Wei Lai, Cheng-Yu Wang, Chih-Hsien Shen, Yu-Hsin Lin, Yi-Hsien Cho, Yang-Chuan Chen

    “…A world-band triple-mode SOC compliant with 802.11a/b/g is realized in 0.13 mum CMOS technology. This SOC features multiple integrated capless LDOs to be…”
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    Conference Proceeding
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