3-D Resistive Memory Arrays: From Intrinsic Switching Behaviors to Optimization Guidelines
3-D resistive switching random access memory (RRAM) is a promising candidate for high-density nonvolatile memory applications, as well as for monolithic 3-D integration interleaved with logic layers. In this paper, we develop a methodology for assessing and optimizing large-scale 3-D RRAM arrays. A...
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Published in: | IEEE transactions on electron devices Vol. 62; no. 10; pp. 3160 - 3167 |
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Main Authors: | , , , , , , , , , , , , , |
Format: | Journal Article |
Language: | English |
Published: |
New York
IEEE
01-10-2015
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects: | |
Online Access: | Get full text |
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Summary: | 3-D resistive switching random access memory (RRAM) is a promising candidate for high-density nonvolatile memory applications, as well as for monolithic 3-D integration interleaved with logic layers. In this paper, we develop a methodology for assessing and optimizing large-scale 3-D RRAM arrays. A systematic study on the intrinsic switching behaviors and optimization of 3-D RRAM arrays is performed, combining device measurements and 3-D array simulations. The dependence of programming voltage on array size, cell location and pulse parameters, statistical properties of operating 3-D RRAM arrays, and subthreshold disturbance on RRAM cells is experimentally investigated. Optimization guidelines for the performance and reliability of 3-D RRAM arrays from device level to architecture level are presented: 1) an optimized 1/n architecture for 100-kb 3-D RRAM arrays can improve write margin by 69.6% and reduce energy consumption by 75.6% compared with a conventional full-size array design; 2) a strategy of prioritizing storage location for reliable operation is presented; and 3) an optimal hopping barrier of oxygen ions is found to improve array immunity to disturbance. |
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ISSN: | 0018-9383 1557-9646 |
DOI: | 10.1109/TED.2015.2468602 |