Search Results - "Jen-Chou Tseng"
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1
ESD and Latchup Optimization of an Embedded-Floating-pMOS SCR-Incorporated BJT
Published in IEEE transactions on electron devices (01-08-2016)“…This paper develops optimization between electrostatic discharge (ESD) and latchup characteristics for a silicon-controlled rectifier (SCR)-incorporated…”
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Journal Article -
2
Lateral Nonuniformity Effects of Border Traps on the Characteristics of Metal-Oxide-Semiconductor Field-Effect Transistors Subjected to High-Field Stresses
Published in IEEE transactions on electron devices (01-06-2008)“…The lateral nonuniformity (LNU) effects of border traps are studied by exploring both the high- and low-frequency characteristics in N-type channel…”
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Journal Article -
3
Oxide-Trapped Charges Induced by Electrostatic Discharge Impulse Stress
Published in IEEE transactions on electron devices (01-07-2007)“…The characteristics of oxide-trapped charges Q ot induced by electrostatic discharge high-field current impulse stress, i.e., transmission line pulsing (TLP),…”
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Journal Article -
4
Improving ESD robustness of stacked diodes with embedded SCR for RF applications in 65-nm CMOS
Published in 2014 IEEE International Reliability Physics Symposium (01-06-2014)“…To protect the radio-frequency (RF) integrated circuits from the electrostatic discharge (ESD) damage in nanoscale CMOS process, the ESD protection circuit…”
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Conference Proceeding -
5
ESD protection design for wideband RF applications in 65-nm CMOS process
Published in 2014 IEEE International Symposium on Circuits and Systems (ISCAS) (01-06-2014)“…All wireless communication products must meet the reliability specifications during mass production. To prevent from electrostatic discharge (ESD) damages, the…”
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Conference Proceeding -
6
Characterization of the electrostatic discharge induced interface traps in metal-oxide-semiconductor field-effect transistors
Published in 2009 IEEE International Reliability Physics Symposium (01-04-2009)“…The interface trap's characteristics in silicon dioxide induced by electrostatic discharge current impulse were studied using the transmission line pulsing…”
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7
Compact and low-loss ESD protection design for V-band RF applications in a 65-nm CMOS technology
Published in 2012 IEEE International Symposium on Circuits and Systems (ISCAS) (01-05-2012)“…Nanoscale CMOS technologies have been widely used to implement radio-frequency (RF) integrated circuits. However, the thinner gate oxide and silicided…”
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Conference Proceeding -
8
A 6.5kV ESD-protected low noise amplifier in 65-nm CMOS
Published in 2010 IEEE MTT-S International Microwave Symposium (01-05-2010)“…A new ESD topology is proposed for RF low-noise amplifier (LNA). By using the modified silicon-controlled rectifier (MSCR) in conjunction with a P + /N-well…”
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Conference Proceeding -
9
Mechanism of snapback failure induced by the latch-up test in high-voltage CMOS integrated circuits
Published in 2008 IEEE International Reliability Physics Symposium (01-04-2008)“…An electrical overstress failure induced by a latch-up test is studied in high-voltage integrated cricuits. The latchup test resulted in damage to the output…”
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Conference Proceeding -
10
An on-chip combo clamp for surge and universal ESD protection in bulk FinFET technology
Published in 2016 38th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) (01-09-2016)“…A surge protection consisted of the ready-made ESD clamp transistors has been designed and characterized in FINFET technology. It can endure all the stresses…”
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Conference Proceeding -
11
Investigation and solution to the early failure of parasitic NPN triggered by the adjacent PNP ESD clamps
Published in 2015 37th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) (01-09-2015)“…The mechanism of PNP-triggered parasitic NPN's early failure during ESD stress has been clarified for the first time. We proposed two solutions for the high…”
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Conference Proceeding -
12
A high latchup - Immune ESD protection SCR-incorporated BJT in deep submicron technology
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01-07-2013)“…An SCR-incorporated BJT for latchup and ESD optimization is developed in a 0.18μm-3.3V process. This device simply consists of a floating P + region in a…”
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Conference Proceeding -
13
ESD protection design for radio-frequency integrated circuits in nanoscale CMOS technology
Published in 2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013) (01-08-2013)“…Nanoscale CMOS technologies have been used to implement the radio-frequency integrated circuits. However, the thinner gate oxide in nanoscale CMOS technology…”
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Conference Proceeding Journal Article -
14
ESD protection structure with inductor-triggered SCR for RF applications in 65-nm CMOS process
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01-04-2012)“…To protect radio-frequency (RF) integrated circuits from electrostatic discharge (ESD) damages, silicon-controlled rectifier (SCR) devices have been used as…”
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Conference Proceeding -
15
An ultra-low power K-band low-noise amplifier co-designed with ESD protection in 40-nm CMOS
Published in 2011 IEEE International Conference on IC Design & Technology (01-05-2011)“…This paper presents a K-band low noise amplifier (LNA) co-designed with ESD protection circuit in 40-nm CMOS technology. By treating ESD devices as a part of…”
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Conference Proceeding -
16
Design of ESD protection cell for dual-band RF applications in a 65-nm CMOS process
Published in Electrical Overstress / Electrostatic Discharge Symposium Proceedings 2012 (01-09-2012)“…An ESD protection cell consisted of a diode, a silicon-controlled rectifier (SCR), a PMOS, and inductors was proposed for dual-band radio-frequency (RF) ESD…”
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Conference Proceeding -
17
An efficient full-chip ESD paths resistance value verification flow for large scale designs
Published in 2013 35th Electrical Overstress/Electrostatic Discharge Symposium (01-09-2013)“…Commercial EDA tools are available to verify resistance values of ESD paths. However, since ESD paths relate to whole-chip power/ground (P/G) nets,…”
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Conference Proceeding -
18
High CDM resistant low-cap SCR for 0.9V advanced CMOS technology
Published in 2013 35th Electrical Overstress/Electrostatic Discharge Symposium (01-09-2013)“…A novel SCR is proposed using a scrambling structure with a Schottky junction. It has ultra low capacitance, high holding voltage and superb CDM performance…”
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Conference Proceeding -
19
60 GHz low noise amplifiers with 1 kV CDM protection in 40 nm LP CMOS
Published in 2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (01-01-2012)“…This paper describes a set of miniature, three-stage 60 GHz LNAs designed in 40 nm LP CMOS. The designs prove effectiveness and ease of use of inductor-based…”
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Conference Proceeding -
20
High-k metal gate-bounded Silicon Controlled Rectifier for ESD protection
Published in Electrical Overstress / Electrostatic Discharge Symposium Proceedings 2012 (01-09-2012)“…An ultra-low trigger gate-bounded SCR using a high-k metal gate process is proposed, which has a superb immunity to protect thin oxide against CDM-like…”
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Conference Proceeding