Search Results - "Jay Im"

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  1. 1

    A 56-Gb/s PAM4 Wireline Transceiver Using a 32-Way Time-Interleaved SAR ADC in 16-nm FinFET by Frans, Yohan, Jaewook Shin, Lei Zhou, Upadhyaya, Parag, Jay Im, Kireev, Vassili, Elzeftawi, Mohamed, Hedayati, Hiva, Toan Pham, Asuncion, Santiago, Borrelli, Chris, Zhang, Geoff, Hongtao Zhang, Ken Chang

    Published in IEEE journal of solid-state circuits (01-04-2017)
    “…A 56-Gb/s PAM4 wireline transceiver testchip is implemented in 16-nm FinFET. The current mode logic transmitter incorporates an auxiliary current injection at…”
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    Journal Article
  2. 2

    A 40-to-64 Gb/s NRZ Transmitter With Supply-Regulated Front-End in 16 nm FinFET by Frans, Yohan, McLeod, Scott, Hedayati, Hiva, Elzeftawi, Mohamed, Jin Namkoong, Lin, Winson, Jay Im, Upadhyaya, Parag, Ken Chang

    Published in IEEE journal of solid-state circuits (01-12-2016)
    “…A 3-tap 64 Gb/s NRZ transmitter using a quad-rate architecture is designed in 16 nm FinFET. The design incorporates circuit techniques and topologies that take…”
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    Journal Article
  3. 3

    Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique by Ryu, Suk-Kyu, Jiang, Tengfei, Lu, Kuan H., Im, Jay, Son, Ho-Young, Byun, Kwang-Yoo, Huang, Rui, Ho, Paul S.

    Published in Applied physics letters (23-01-2012)
    “…Through-silicon via is a critical element for three-dimensional (3D) integration of devices in multilevel stack structures. Thermally induced stresses in…”
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    Journal Article
  4. 4

    Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias by Jiang, Tengfei, Ryu, Suk-Kyu, Zhao, Qiu, Im, Jay, Huang, Rui, Ho, Paul S.

    Published in Microelectronics and reliability (01-01-2013)
    “…Three-dimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective approach to overcome the wiring limit beyond the 32nm…”
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    Journal Article
  5. 5
  6. 6

    The epidemiology and role of surgery in the treatment of urethral clear cell carcinoma by Patel, Mausam, Im, Jay, Ivy, Austin, Maraboyina, Sanjay, Kim, Thomas

    Published in International urology and nephrology (01-01-2020)
    “…Purpose To perform a retrospective analysis of the epidemiology and role of surgery on survival in patients with urethral clear cell carcinoma (UCCC) using the…”
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    Journal Article
  7. 7

    Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects by Jiang, Tengfei, Wu, Chenglin, Spinella, Laura, Im, Jay, Tamura, Nobumichi, Kunz, Martin, Son, Ho-Young, Gyu Kim, Byoung, Huang, Rui, Ho, Paul S.

    Published in Applied physics letters (18-11-2013)
    “…In this paper, we demonstrated the plasticity mechanism for copper (Cu) extrusion in through-silicon via structures under thermal cycling. The local plasticity…”
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    Journal Article
  8. 8

    Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing by Chao, Brook, Chae, Seung-Hyun, Zhang, Xuefeng, Lu, Kuan-Hsun, Im, Jay, Ho, P.S.

    Published in Acta materialia (01-05-2007)
    “…An efficient numerical method was developed to extract the diffusion and electromigration parameters for multi-phase intermetallic compounds (IMC) formed as a…”
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    Journal Article
  9. 9

    Riboflavin Inhibits Histamine-Dependent Itch by Modulating Transient Receptor Potential Vanilloid 1 (TRPV1) by Lee, Kihwan, Choi, Young In, Im, Sang-Taek, Hwang, Sung-Min, Lee, Han-Kyu, Im, Jay-Zoon, Kim, Yong Ho, Jung, Sung Jun, Park, Chul-Kyu

    Published in Frontiers in molecular neuroscience (18-06-2021)
    “…Riboflavin, also known as vitamin B 2 , isfound in foods and is used as a dietary supplement. Its deficiency (also called ariboflavinosis) results in some skin…”
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    Journal Article
  10. 10

    A 4-to-16GHz inverter-based injection-locked quadrature clock generator with phase interpolators for multi-standard I/Os in 7nm FinFET by Chen, Stanley, Lei Zhou, Zhuang, Ian, Jay Im, Melek, Didem, Jinyung Namkoong, Raj, Mayank, Jaewook Shin, Frans, Yohan, Chang, Ken

    “…As ever-increasing bandwidth demand pushes wireline transceiver data-rates beyond 25Gb/s, the clocking solution for multi-protocol support over a wide range of…”
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    Conference Proceeding
  11. 11

    SUMO proteins are involved in the stress response during spermatogenesis and are localized to DNA double-strand breaks in germ cells by Shrivastava, Vibha, Pekar, Marina, Grosser, Eliana, Im, Jay, Vigodner, Margarita

    Published in Reproduction (Cambridge, England) (01-06-2010)
    “…Small ubiquitin-like modifiers (SUMO) proteins have been implicated in cellular stress response in different tissues, but whether sumoylation has a similar…”
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    Journal Article
  12. 12

    Effects of Sn grain structure on the electromigration of Sn–Ag solder joints by Wang, Yiwei, Lu, Kuan H., Gupta, Vikas, Stiborek, Leon, Shirley, Dwayne, Chae, Seung-Hyun, Im, Jay, Ho, Paul S.

    Published in Journal of materials research (28-04-2012)
    “…In this article, we investigated the effect of Sn grain structure on the electromigration (EM) reliability of Sn–2.5Ag (wt%) solder joints used in flip-chip…”
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    Journal Article
  13. 13

    A Low-Power 0.5-6.6 Gb/s Wireline Transceiver Embedded in Low-Cost 28 nm FPGAs by Savoj, Jafar, Hsieh, Kenny Cheng-Hsiang, Fu-Tai An, Gong, Jason, Jay Im, Xuewen Jiang, Jose, Anup P., Kireev, Vassili, Siok-Wei Lim, Roldan, Arianne, Turker, Didem Z., Upadhyaya, Parag, Wu, Daniel, Ken Chang

    Published in IEEE journal of solid-state circuits (01-11-2013)
    “…This paper describes the design of a 0.5-6.6 Gb/s fully-adaptive low-power quad transceiver embedded in low-leakage 28 nm CMOS FPGAs. Integration techniques…”
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    Journal Article Conference Proceeding
  14. 14

    A kinetic decomposition process for air-gap interconnects and induced deformation instability of a low-k dielectric cap layer by Ryu, Suk-Kyu, Im, Jay, Ho, Paul S., Huang, Rui

    “…During air-gap formation in interconnects, decomposition process of the sacrificial layer induces deformation of a low-k dielectric cap layer. For analysis of…”
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    Journal Article
  15. 15

    Mortgage rates and credit risk: Evidence from mortgage pools by Antinolfi, Gaetano, Brunetti, Celso, Im, Jay

    “…In the 1990s, securitised subprime loans supported the growth of mortgage lending. We study the evolution of initial mortgage rates as a function of loan and…”
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    Journal Article
  16. 16

    Thermo-mechanical reliability of 3-D ICs containing through silicon vias by Lu, K.H., Xuefeng Zhang, Suk-Kyu Ryu, Im, J., Rui Huang, Ho, P.S.

    “…In 3-D interconnect structures, process-induced thermal stresses around through-silicon-vias (TSVs) raise serious reliability issues such as Si cracking and…”
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    Conference Proceeding
  17. 17

    Epidemiology and survival in patients with urethral clear cell carcinoma by Patel, Mausam, Im, Jay, Ivy, Austin, Maraboyina, Sanjay, Kim, Thomas

    Published in Journal of clinical oncology (20-05-2019)
    “…Abstract only 1550 Background: Clear cell carcinoma (CCC) of the urethra is a very rare histologic variant of urethral adenocarcinoma. The majority of studies…”
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    Journal Article
  18. 18
  19. 19

    Optical Molecular Imaging and Spectroscopy of Oxygenation and Metabolism in Tumors by Im, Jay, Rajaram, Narasimhan

    “…There is growing evidence that aerobic glycolysis provides tumors with a growth advantage and could play a role in promoting an aggressive tumor phenotype…”
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    Journal Article
  20. 20

    Essays on Multinationalization and Corporate Investment Policy by Im, Jay

    Published 01-01-2021
    “…U.S. MNEs are dominant producers in the economy, yet they invest considerably less and exhibit lower Tobin's q than domestic firms. Counterintuitively, the MNE…”
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    Dissertation