Search Results - "Jay Im"
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1
A 56-Gb/s PAM4 Wireline Transceiver Using a 32-Way Time-Interleaved SAR ADC in 16-nm FinFET
Published in IEEE journal of solid-state circuits (01-04-2017)“…A 56-Gb/s PAM4 wireline transceiver testchip is implemented in 16-nm FinFET. The current mode logic transmitter incorporates an auxiliary current injection at…”
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2
A 40-to-64 Gb/s NRZ Transmitter With Supply-Regulated Front-End in 16 nm FinFET
Published in IEEE journal of solid-state circuits (01-12-2016)“…A 3-tap 64 Gb/s NRZ transmitter using a quad-rate architecture is designed in 16 nm FinFET. The design incorporates circuit techniques and topologies that take…”
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3
Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique
Published in Applied physics letters (23-01-2012)“…Through-silicon via is a critical element for three-dimensional (3D) integration of devices in multilevel stack structures. Thermally induced stresses in…”
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4
Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias
Published in Microelectronics and reliability (01-01-2013)“…Three-dimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective approach to overcome the wiring limit beyond the 32nm…”
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5
Role of anticoagulation therapy in modifying stroke risk associated with new-onset atrial fibrillation after non-cardiac surgery
Published in Nature medicine (23-08-2024)“…The role of antithrombotic therapy in the prevention of ischemic stroke after non-cardiac surgery is unclear. In this study, we tested the hypothesis that the…”
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6
The epidemiology and role of surgery in the treatment of urethral clear cell carcinoma
Published in International urology and nephrology (01-01-2020)“…Purpose To perform a retrospective analysis of the epidemiology and role of surgery on survival in patients with urethral clear cell carcinoma (UCCC) using the…”
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7
Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects
Published in Applied physics letters (18-11-2013)“…In this paper, we demonstrated the plasticity mechanism for copper (Cu) extrusion in through-silicon via structures under thermal cycling. The local plasticity…”
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8
Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing
Published in Acta materialia (01-05-2007)“…An efficient numerical method was developed to extract the diffusion and electromigration parameters for multi-phase intermetallic compounds (IMC) formed as a…”
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9
Riboflavin Inhibits Histamine-Dependent Itch by Modulating Transient Receptor Potential Vanilloid 1 (TRPV1)
Published in Frontiers in molecular neuroscience (18-06-2021)“…Riboflavin, also known as vitamin B 2 , isfound in foods and is used as a dietary supplement. Its deficiency (also called ariboflavinosis) results in some skin…”
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10
A 4-to-16GHz inverter-based injection-locked quadrature clock generator with phase interpolators for multi-standard I/Os in 7nm FinFET
Published in 2018 IEEE International Solid - State Circuits Conference - (ISSCC) (01-02-2018)“…As ever-increasing bandwidth demand pushes wireline transceiver data-rates beyond 25Gb/s, the clocking solution for multi-protocol support over a wide range of…”
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Conference Proceeding -
11
SUMO proteins are involved in the stress response during spermatogenesis and are localized to DNA double-strand breaks in germ cells
Published in Reproduction (Cambridge, England) (01-06-2010)“…Small ubiquitin-like modifiers (SUMO) proteins have been implicated in cellular stress response in different tissues, but whether sumoylation has a similar…”
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12
Effects of Sn grain structure on the electromigration of Sn–Ag solder joints
Published in Journal of materials research (28-04-2012)“…In this article, we investigated the effect of Sn grain structure on the electromigration (EM) reliability of Sn–2.5Ag (wt%) solder joints used in flip-chip…”
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13
A Low-Power 0.5-6.6 Gb/s Wireline Transceiver Embedded in Low-Cost 28 nm FPGAs
Published in IEEE journal of solid-state circuits (01-11-2013)“…This paper describes the design of a 0.5-6.6 Gb/s fully-adaptive low-power quad transceiver embedded in low-leakage 28 nm CMOS FPGAs. Integration techniques…”
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Journal Article Conference Proceeding -
14
A kinetic decomposition process for air-gap interconnects and induced deformation instability of a low-k dielectric cap layer
Published in Journal of mechanical science and technology (2014)“…During air-gap formation in interconnects, decomposition process of the sacrificial layer induces deformation of a low-k dielectric cap layer. For analysis of…”
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Journal Article -
15
Mortgage rates and credit risk: Evidence from mortgage pools
Published in European financial management : the journal of the European Financial Management Association (01-11-2024)“…In the 1990s, securitised subprime loans supported the growth of mortgage lending. We study the evolution of initial mortgage rates as a function of loan and…”
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16
Thermo-mechanical reliability of 3-D ICs containing through silicon vias
Published in 2009 59th Electronic Components and Technology Conference (01-05-2009)“…In 3-D interconnect structures, process-induced thermal stresses around through-silicon-vias (TSVs) raise serious reliability issues such as Si cracking and…”
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Conference Proceeding -
17
Epidemiology and survival in patients with urethral clear cell carcinoma
Published in Journal of clinical oncology (20-05-2019)“…Abstract only 1550 Background: Clear cell carcinoma (CCC) of the urethra is a very rare histologic variant of urethral adenocarcinoma. The majority of studies…”
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18
Patient Demographics and Extracorporeal Membranous Oxygenation (ECMO)-Related Complications Associated With Survival to Discharge or 30-Day Survival in Adult Patients Receiving Venoarterial (VA) and Venovenous (VV) ECMO in a Quaternary Care Urban Center
Published in Journal of cardiothoracic and vascular anesthesia (01-04-2019)“…Investigate how a multitude of patient demographics and extracorporeal membranous oxygenation (ECMO)-related complications affect 30-day survival or survival…”
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Journal Article -
19
Optical Molecular Imaging and Spectroscopy of Oxygenation and Metabolism in Tumors
Published in IEEE journal of selected topics in quantum electronics (01-05-2016)“…There is growing evidence that aerobic glycolysis provides tumors with a growth advantage and could play a role in promoting an aggressive tumor phenotype…”
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Journal Article -
20
Essays on Multinationalization and Corporate Investment Policy
Published 01-01-2021“…U.S. MNEs are dominant producers in the economy, yet they invest considerably less and exhibit lower Tobin's q than domestic firms. Counterintuitively, the MNE…”
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Dissertation