Design space exploration (DSE) for over-136GB/s IO bandwidth with LPDDR5X SDRAM packages on SOC package in 200mm3

136 GB/s bandwidth system including LPDDR5X DRAM packages and SOC package will be presented. A new thermally enhanced configuration and structure with redistribution layer (RDL) based fan-out (FO) package is utilized to achieve small form-factor (SFF) interconnect system including LPDDR5 DRAM packag...

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Bibliographic Details

Published in:	2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) pp. 19 - 23
Main Authors:	Lee, Heeseok, Jeong, James, Pak, Jun So, Yoo, Jongkyu, Jung, Woobin, Cho, Young-Sang, Jo, Hyungyung, Joo, Kisu, Hwang, Jisoo, Jang, Jaegwon
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-05-2023
Subjects:	Bandwidth Electronic components Electronic packaging thermal management Fan-out package (FoPKG) fan-out panel-level package (FoPLP) fan-out wafer-level package (FoWLP) package on package (POP) SDRAM small form-factor (SFF) Space exploration system in package (SIP)
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