Search Results - "Jaechoon Kim"

Application of Convolutional Neural Network to Predict Anisotropic Effective Thermal Conductivity of Semiconductor Package by Kim, Tae-Hyun, Park, Jeong-Hyeon, Jung, Ki Wook, Kim, Jaechoon, Lee, Eun-Ho

“…With increasing complexity of design patterns in semiconductor package substrates caused by demand for high-power semiconductors, it is necessary to be able to…”
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Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials by Ki, Seokkan, Shim, Jaehwan, Oh, Seungtae, Koh, Eunjoo, Seo, Donghyun, Ryu, Seunggeol, Kim, Jaechoon, Nam, Youngsuk

“…•An oxide-free copper nanoparticle incorporation method was developed for gallium-based liquid metal matrix.•Liquid metal-copper nanoparticles composite shows…”
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Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages by Se-Ho You, Seonghwan Jeon, Dan Oh, Kilsoo Kim, Jaechoon Kim, Seung-Yong Cha, GyoungBum Kim

“…As 4th industry revolution becomes realization, more sophisticated mobile sets and servers are demanded that, in turn, necessitates advanced package…”
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Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs) by Lee, Jooyoung, Ki, Seokkan, Seo, Donghyun, Kim, Jaechoon, Nam, Youngsuk

“…•The IGBT liquid cooling system incorporating a porous medium was investigated.•The optimal porosity exists due to the conflict between the convective and…”
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Study of Advanced Fan-Out Packages for Mobile Applications by Taejoo Hwang, Dan Oh, Eunseok Song, Kilsoo Kim, Jaechoon Kim, Seokwon Lee

“…As artificial intelligence technologies has been rapidly applied for mobile devices, the demand is increasing to improve the performance of neural network…”
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Artificial neural network (ANN)-based multi-objective optimization of the vapor chamber with liquid supply layer for high heat flux applications by Bang, Soosik, Kim, Seungwoo, Ki, Seokkan, Seo, Junyong, Kim, Jaechoon, Lee, Bong Jae, Nam, Youngsuk

“…We developed a multi-objective optimization process using artificial neural networks (ANN) to estimate and enhance the thermal-hydraulic performance of vapor…”
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Numerical analysis of thermal and mechanical characteristics with property maps in complex semiconductor package designs by Park, Jeong-Hyeon, Park, Hwanjoo, Kim, Taehwan, Kim, Jaechoon, Lee, Eun-Ho

“…•A model to explore the multiphysics characteristic of semiconductors is presented.•The model determines the thermal and mechanical properties of complex…”
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A Rare Presentation of Occipital Dermoid Cyst with Intracranial Extension and Secondary Infection: Case Report and Follow-Up by Li, Guyu, Kim, Jaechoon, Garcia, Matthew, Reyes-McChesney, Ivy, Hanna, Ashley, Bhalala, Utpal

“…Craniofacial dermoid cysts are congenital anomalies that rarely have intracranial extension and can be associated with other anomalies. Common sites of these…”
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Optimizing the vapor chamber with liquid supply layers for high heat flux applications using an ANN-based multi-objective genetic algorithm by Bang, Soosik, Kim, Seungwoo, Ki, Seokkan, Seo, Junyong, Kim, Jaechoon, Lee, Bong Jae, Nam, Youngsuk

“…We developed ANN-based multi-objective optimization process to predict the performance of the vapor chamber (VC) with liquid supply layer (LSL), designed for…”
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Thermal Modeling and Analysis of High Bandwidth Memory in 2.5D Si-interposer Systems by Kim, Taehwan, Lee, Jonggyu, Kim, Jaechoon, Lee, Eung-Chang, Hwang, Heejung, Kim, Youngdeuk, Oh, Dan Kyung Suk

“…As market for High-Performance Computing (HPC) grows and demands for high performance memory device increases, it is becoming more important to predict the…”
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Thermal and mechanical simulations of 3D packages with custom high bandwidth memory (HBM) by Chatterjee, Kamalika, Li, Yan, Chang, Hochan, Damadam, Mohsen, Asrar, Pouya, Kim, Jaechoon, Jeong, Glen, Kim, WooPoung

“…Custom high bandwidth memory (HBM) directly connects the DRAM die stacks to the logic die vertically. The bottom logic die functions as both the logic and the…”
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Enhancement of Thermal Transient Prediction Accuracy for Mobile AP Package by Park, Hwanjoo, Kim, Taehwan, Kang, Sunggu, Lee, Jonggyu, Mun, Sungho, Kim, Jaechoon, Jung, Hangi, Kim, Dongwook

“…As the demand for high performance of the mobile application processor (AP) grows gradually, the power consumption increases so that the precise estimation of…”
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Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond by Kim, Taehwan, Lee, Jonggyu, Kim, Youngdeuk, Park, Hwanjoo, Hwang, Heejung, Kim, Jaechoon, Jung, Hangi, Kim, Dong Wook

“…As the demands for implementing High Performance Computing (HPC) increase rapidly, the bandwidth and capacity required for High Bandwidth Memory (HBM) are…”
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Rapid Enhancement of Thermal Conductivity by Incorporating Oxide-Free Copper Nanoparticle Clusters for Highly Conductive Liquid Metal-based Thermal Interface Materials by Ki, Seokkan, Shim, Jaehwan, Oh, Seungtae, Ryu, Seunggeol, Kim, Jaechoon, Nam, Youngsuk

“…Enhancing thermo-physical properties of thermal interface materials (TIMs) is important for efficient cooling of electronic devices. To eliminate air pockets…”
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Assessment of Thermal-aware Floorplans in a 3D IC for Server Applications by Jung, Ki Wook, Cho, Eunho, Jo, Sungeun, Ryu, Seunggeol, Kim, Jaechoon, Oh, Dan Kyung Suk

“…Three-dimensional (3D) interconnection technology has been introduced to reduce signal delay and interconnect power loss in various modern electronics…”
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A Rare Presentation of Occipital Dermoid Cyst with Intracranial Extension and Secondary Infection: Case Report and Follow-Up by Li, Guyu, Kim, Jaechoon, Garcia, Matthew, Reyes-McChesney, Ivy, Hanna, Ashley, Bhalala, Utpal

“…Craniofacial dermoid cysts are congenital anomalies that rarely have intracranial extension and can be associated with other anomalies. Common sites of these…”
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The Thermal Dissipation Characteristics of The Novel System-In-Package Technology (ICE-SiP) for Mobile and 3D High-end Packages by Hwang, Taejoo, Oh, Dan, Kim, Jaechoon, Song, Euseok, Kim, Taehun, Kim, Kilsoo, Lee, Joungphil, Kim, Taehwan

“…As information technologies evolve with the 4th industry revolution, such as artificial intelligence and 5G mobile communication, much more computing power and…”
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