Search Results - "Jacqueline, Sebastien"

Silicon based system in package: Improvement of passive integration process to avoid TBMS failure by Gautier, Christian, Ledain, Sophie, Jacqueline, Sébastien, Nongaillard, Matthieu, Georgel, Vincent, Danilo, Karine

“…Because of its large dimension and its high level of integration, the PICS (Passive Integration Connecting Substrate) developed by NXP prone to top to bottom…”
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ESD sensitivity investigation on a wide range of high density embedded capacitors by Barbier, Frederic, Jacqueline, Sebastien

“…This work presents some results from electrical (TDDB, TLP, HBM and MM) measurements and ESD calculations/simulations on passive components such as capacitors…”
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Outstanding reliability performances of Silicon capacitors for 200°C automotive applications by Jacqueline, Sebastien, Bunel, Catherine, Lengignon, Laurent

“…In the race of miniaturization, manufacturers of automotive devices always require smaller electronic components. To save space and in the same time improve…”
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Low profile integrated passive devices with 3D high density capacitors ideal for embedded and die stacking solutions by Bunel, Catherine, Pommier, Mickael, Jacqueline, Sebastien

“…* The low profile IPDIA technology capability is limited by the density of the trench capacitor, more explicitly by the depth of the trench. * The 80μm Low…”
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