Search Results - "Jaafar, Norhanani Binte"

CPI Parametric Investigation of UBM-Al Interface for Cu Pillar Flip-Chip Application by Lianto, Prayudi, Hong Yu Li, Balamurugan, R., Junqi Wei, Binte Jaafar, Norhanani, Wai, Leong Ching Eva, Sundarrajan, Arvind

“…Under bump metallization (UBM)-Al delamination is a high-value chip-package interaction reliability problem in flip-chip Cu pillar packaging. We devised a test…”
Get full text

Challenges of wirebonding with polyimide flexible printed circuit board (FPCB) by Binte Jaafar, Norhanani, Damalerio, Ramona

“…Wire bonding is still popular and leading interconnect technologies due to its reliability, reputation for versatility and performance. Increased demand for…”
Get full text

Comparison of Au/Al, Cu/Al and Ag/Al in wirebonding assembly and IMC growth behavior by Binte Jaafar, Norhanani, Ching, Eva Wai Leong

“…Currently, semiconductor packaging is using Gold (Au) wirebonding as the main connection from chip to the lead frame or substrate. Increases in Au price,…”
Get full text

Study on ultra low loop copper wire bonding process using 0.8mils Cu wire for low profile package applications by Binte Jaafar, Norhanani, Ching, Eva Wai Leong

“…In recent years, as IC packaging development has moved towards higher power, smaller size, thinner dimensions, denser circuits and higher reliability, wire…”
Get full text

Isolate micro-bump process development and improvement by Li, H. Y., Leong Yew Wing, Hwang Gilho, Chong Kok Piau, Binte Jaafar, Norhanani, Chungpaiboonpatana, Surasit

“…Low density micro-bumps were required for assembly of different technologies connection within 3D and 2.5D packaging. 6μm and 8um bump heights after reflow are…”
Get full text

Study of barrier layer thickness effect for the micro-bump by Li, H. Y., Binte Jaafar, Norhanani, Sam, Mohamad Iskandar B. Es, Shee, Kalyn Lim Tien, Wong Lai Yin, Chui King Jien

“…With the semiconductor development, more and more different devices need be integrated to achieve faster and more functionalities. Micro-bump is an important…”
Get full text

Challenges and optimization of 2nd bond process for reliable QFN packages by Binte Jaafar, Norhanani, Ching, Eva Wai Leong, Bi-Rong, Michelle Chew, Rao, Vempati Srinivasa, Minwoo, Daniel Rhee

“…As device technology is moving towards nano-IC technologies and consumer market are aggressively demands for the miniaturization of electronic products with…”
Get full text

Establishment of Highly Dense Wire Bonding with Insulated Au Wire by Jaafar, Norhanani Binte, Choong, Chong Ser

“…The most popular first - level interconnection technologies used for the connection of chip to chip and chip to substrate are Wire Bonding and Flip Chip. As…”
Get full text

In Situ Measurement and Stress Evaluation for Wire Bonding Using Embedded Piezoresistive Stress Sensors by Woon Yik Yong, Xiaowu Zhang, Tai Chong Chai, Trigg, A., Jaafar, N. B., Guo-Qiang Lo

“…A ball bonding process in wire bonding generally involves impact followed by ultrasonic (US) bonding prior to wedge bonding. During the ball bonding process,…”
Get full text

Comprehensive Study of Tin-Silver-Copper Lead-Free Alloys on Various Bond Pad Metallisation by Jaafar, Norhanani Binte, Choong, Chong Ser

“…SnAgCu305 (SAC305) solder alloy is extensively used as solder bump interconnects in industry due to their high strength and good reliability performance…”
Get full text

Effect of Bond Pad Surface Finish on AuSn Solder Bumping Using Laser Solder Jetting by Jaafar, Norhanani Binte, Choong, Chong Ser

“…Laser solder ball jetting is tremendously flexibility along with its advantages of no mechanical stress and low thermal on the processes packages during the…”
Get full text

Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders by Jaafar, Norhanani Binte, Choong, Chong Ser, Siang, Sharon Lim Pei, Chong, Chai Tai

“…Ball Grid Array (BGA) is a surface mount chip package commonly used in many microelectronics products. It has solder balls array underneath the package provide…”
Get full text

Investigation of SnAg Superconductivity as Solder Material for Cryogenic Packaging by Ng, Yong Chyn, Li, Hongyu, Jaafar, Norhanani Binte, Cheow Siong Lee, Rainer, Huang, Ding, Lau, Chit Siong, Eng Johnson Goh, Kuan, Chui, King-Jien

“…The drive towards quantum computing has prompted a need for advanced packaging technologies capable of withstanding the harsh cryogenic environments in which…”
Get full text

Indium-based Flip-chip Interconnect for Cryogenic Packaging by Jaafar, Norhanani Binte, Hongyu, Li, Choong, Chong Ser, Yong Chyn, Ng, Huang, Ding, Lau, Chit Siong, Goh, Kuan Eng Johnson, Chui, King-Jien

“…Flip-chip die attachment manufacturing has seen a dramatic increase in recent years due to improvements in electrical performance and reduced form-factor…”
Get full text

Thermal Aging and Ball Shear Characterization of SAC-X Solders for Wafer Level Packaging by Jaafar, Norhanani Binte, Choong, Chong Ser, Siang, Sharon Lim Pei, Chong, Chai Tai

“…Current industry trends in the microelectronics packaging is going towards increasing in I/O density and small size packaging. Common use of solder material in…”
Get full text

Fine pitch copper wire bonding on 45nm tech Cu/low-k chip with different bond pad metallurgy by Leong Ching Wai, Jaafar, N. B., Chew, M., Sivakumar, S., Gunasekaran, G., Kanchet, K., Witarsa, D., Tan Juan Boon, Srinivasa, V. R., Chai, T. C., Alastair, A., Woo, J.

“…Wire bonding technology has been widely used in the semiconductor industry for interconnection between device and substrate. Gold wire has been used in…”
Get full text