Search Results - "Jaafar, Norhanani"

CMOS AlN and ScAlN Pyroelectric Detectors with Optical Enhancement for Detection of CO2 and CH4 Gases by Ng, Doris Keh Ting, Xu, Linfang, Fu, Yuan Hsing, Chen, Weiguo, Ho, Chong Pei, Goh, Jia Sheng, Chung, Wing Wai, Jaafar, Norhanani, Zhang, Qingxin, Lee, Lennon Yao Ting

“…Gas sensors are useful for monitoring of greenhouse gases. As the move toward complementary metal‐oxide‐semiconductor (CMOS) compatible pyroelectric room…”
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CPI Parametric Investigation of UBM-Al Interface for Cu Pillar Flip-Chip Application by Lianto, Prayudi, Hong Yu Li, Balamurugan, R., Junqi Wei, Binte Jaafar, Norhanani, Wai, Leong Ching Eva, Sundarrajan, Arvind

“…Under bump metallization (UBM)-Al delamination is a high-value chip-package interaction reliability problem in flip-chip Cu pillar packaging. We devised a test…”
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Challenges of wirebonding with polyimide flexible printed circuit board (FPCB) by Binte Jaafar, Norhanani, Damalerio, Ramona

“…Wire bonding is still popular and leading interconnect technologies due to its reliability, reputation for versatility and performance. Increased demand for…”
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Comparison of Au/Al, Cu/Al and Ag/Al in wirebonding assembly and IMC growth behavior by Binte Jaafar, Norhanani, Ching, Eva Wai Leong

“…Currently, semiconductor packaging is using Gold (Au) wirebonding as the main connection from chip to the lead frame or substrate. Increases in Au price,…”
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NDIR CO2 gas sensing using CMOS compatible MEMS ScAlN-based pyroelectric detector by Ng, Doris Keh Ting, Ho, Chong Pei, Xu, Linfang, Chen, Weiguo, Fu, Yuan Hsing, Zhang, Tantan, Siow, Li Yan, Jaafar, Norhanani, Ng, Eldwin Jiaqiang, Gao, Yuan, Cai, Hong, Zhang, Qingxin, Lee, Lennon Yao Ting

“…•CMOS-compatible ScAlN-based pyroelectric detector in NDIR CO2 sensing.•8-inch wafer level fabrication with ScAlN film deposited at ∼200 °C.•CO2 gas detection…”
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Study on ultra low loop copper wire bonding process using 0.8mils Cu wire for low profile package applications by Binte Jaafar, Norhanani, Ching, Eva Wai Leong

“…In recent years, as IC packaging development has moved towards higher power, smaller size, thinner dimensions, denser circuits and higher reliability, wire…”
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Isolate micro-bump process development and improvement by Li, H. Y., Leong Yew Wing, Hwang Gilho, Chong Kok Piau, Binte Jaafar, Norhanani, Chungpaiboonpatana, Surasit

“…Low density micro-bumps were required for assembly of different technologies connection within 3D and 2.5D packaging. 6μm and 8um bump heights after reflow are…”
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CMOS AlN and ScAlN Pyroelectric Detectors with Optical Enhancement for Detection of CO 2 and CH 4 Gases by Ng, Doris Keh Ting, Xu, Linfang, Fu, Yuan Hsing, Chen, Weiguo, Ho, Chong Pei, Goh, Jia Sheng, Chung, Wing Wai, Jaafar, Norhanani, Zhang, Qingxin, Lee, Lennon Yao Ting

“…Gas sensors are useful for monitoring of greenhouse gases. As the move toward complementary metal‐oxide‐semiconductor (CMOS) compatible pyroelectric room…”
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Study of barrier layer thickness effect for the micro-bump by Li, H. Y., Binte Jaafar, Norhanani, Sam, Mohamad Iskandar B. Es, Shee, Kalyn Lim Tien, Wong Lai Yin, Chui King Jien

“…With the semiconductor development, more and more different devices need be integrated to achieve faster and more functionalities. Micro-bump is an important…”
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Challenges and optimization of 2nd bond process for reliable QFN packages by Binte Jaafar, Norhanani, Ching, Eva Wai Leong, Bi-Rong, Michelle Chew, Rao, Vempati Srinivasa, Minwoo, Daniel Rhee

“…As device technology is moving towards nano-IC technologies and consumer market are aggressively demands for the miniaturization of electronic products with…”
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Miniaturized CO 2 Gas Sensor Using 20% ScAlN-Based Pyroelectric Detector by Ng, Doris Keh Ting, Xu, Linfang, Chen, Weiguo, Wang, Huanhuan, Gu, Zhonghua, Chia, Xavier Xujie, Fu, Yuan Hsing, Jaafar, Norhanani, Ho, Chong Pei, Zhang, Tantan, Zhang, Qingxin, Lee, Lennon Yao Ting

“…NDIR CO gas sensors using a 10-cm-long gas channel and CMOS-compatible 12% doped ScAlN pyroelectric detector have previously demonstrated detection limits down…”
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Miniaturized CO2 Gas Sensor Using 20% ScAlN-Based Pyroelectric Detector by Ng, Doris Keh Ting, Xu, Linfang, Chen, Weiguo, Wang, Huanhuan, Gu, Zhonghua, Chia, Xavier Xujie, Fu, Yuan Hsing, Jaafar, Norhanani, Ho, Chong Pei, Zhang, Tantan, Zhang, Qingxin, Lee, Lennon Yao Ting

“…NDIR CO2 gas sensors using a 10-cm-long gas channel and CMOS-compatible 12% doped ScAlN pyroelectric detector have previously demonstrated detection limits…”
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Establishment of Highly Dense Wire Bonding with Insulated Au Wire by Jaafar, Norhanani Binte, Choong, Chong Ser

“…The most popular first - level interconnection technologies used for the connection of chip to chip and chip to substrate are Wire Bonding and Flip Chip. As…”
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In Situ Measurement and Stress Evaluation for Wire Bonding Using Embedded Piezoresistive Stress Sensors by Woon Yik Yong, Xiaowu Zhang, Tai Chong Chai, Trigg, A., Jaafar, N. B., Guo-Qiang Lo

“…A ball bonding process in wire bonding generally involves impact followed by ultrasonic (US) bonding prior to wedge bonding. During the ball bonding process,…”
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Comprehensive Study of Tin-Silver-Copper Lead-Free Alloys on Various Bond Pad Metallisation by Jaafar, Norhanani Binte, Choong, Chong Ser

“…SnAgCu305 (SAC305) solder alloy is extensively used as solder bump interconnects in industry due to their high strength and good reliability performance…”
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Through Mold Vertical Interconnect Formation in FOWLP using conductive paste by Siew Boon, Serine Soh, David Ho, Soon Wee, Jaafar, Norhanani

“…Through-Mold Interconnects (TMI) have been widely adopted and integrated into Fan-out Wafer Level Packaging (FOWLP) for semiconductor packaging technology…”
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Effect of Bond Pad Surface Finish on AuSn Solder Bumping Using Laser Solder Jetting by Jaafar, Norhanani Binte, Choong, Chong Ser

“…Laser solder ball jetting is tremendously flexibility along with its advantages of no mechanical stress and low thermal on the processes packages during the…”
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Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging by Long, Lau Boon, Ho, David, Guan, Lim Teck, Yao, Hsiao Hsiang, Siang, Lim Pei, Jaafar, Norhanani

“…In this paper, the fabrication process flow and results of Antenna-in-Package through fan-out wafer level packaging process were presented. This package at…”
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Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders by Jaafar, Norhanani Binte, Choong, Chong Ser, Siang, Sharon Lim Pei, Chong, Chai Tai

“…Ball Grid Array (BGA) is a surface mount chip package commonly used in many microelectronics products. It has solder balls array underneath the package provide…”
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Development of 2.5D high density device on large ultra-thin active interposer by Lim, Sharon Pei Siang, Chidambaram, Vivek, Jaafar, Norhanani, Seit, Wenwei

“…In the recent years, the industry is moving towards finer, higher density interconnections and better electrical performance from the die to the substrate. The…”
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