Search Results - "JUSO, H"
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World's highest efficiency triple-junction solar cells fabricated by inverted layers transfer process
Published in 2010 35th IEEE Photovoltaic Specialists Conference (01-01-2010)“…A world record-setting efficiency of 35.8% at AM1.5G (x1) has been demonstrated by an InGaP (1.88 eV)/GaAs/InGaAs (0.97 eV) triple-junction solar cell…”
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Conference Proceeding -
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Three-dimensional very thin stacked packaging technology for SiP
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)“…In order to achieve the greater compactness, lightness, high- and multi-functionality required of mobile equipment and other electronic devices, we have…”
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Conference Proceeding -
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Board level reliability of CSP
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)“…Companies are pushing the development of CSP (chip size package or chip scale package), which has almost no limit to LSI chip size. Sharp has developed a CSP,…”
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Conference Proceeding Journal Article -
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Triple-chip stacked CSP
Published in 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) (2000)“…As electronic devices, particularly cellular telephones, become more compact, lighter in weight and more functional, it is becoming necessary to decrease the…”
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Conference Proceeding -
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Board level reliability of three-dimensional systems in package (SIPs)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)Get full text
Conference Proceeding -
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Development of highly reliable CSP
Published in 1997 Proceedings 47th Electronic Components and Technology Conference (1997)“…High density packages are demanded due to recent miniaturization for personal tools. In order to satisfy these demands, development is being done in various…”
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Conference Proceeding -
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Characteristics of Concentrator Triple Junction Cell Optimized for Current Matching
Published in 2006 IEEE 4th World Conference on Photovoltaic Energy Conference (01-05-2006)“…In the case of the triple-junction cell, in order to get maximum photo-current, current-matching for incident light by optimization of subcell thickness is…”
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Conference Proceeding -
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Effect of Hf addition (0.24 w/o) on the oxidation behavior of TiAl at high temperatures
Published in Oxidation of metals (01-10-1994)“…The isothermal oxidation behavior of TiAl coupons containing 0.24 wt.% Hf has been studied in the temperature range 1100 to 1400 K in a flow of purified oxygen…”
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Journal Article -
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Effect of Hf additions on the isothermal-oxidation behavior of TiAl at high temperatures
Published in Oxidation of metals (01-04-1998)Get full text
Journal Article