Search Results - "JEONG, C. O"

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  1. 1

    Low-resistivity indium tantalum oxide films by magnetron sputtering by JU, H, HWANG, S, JEONG, C.-O, PARK, S.-H, CHOI, J.-G, PARK, C

    “…Low-resistivity Ta-doped In2O3 (InTaO) films from ceramic targets of In2O3 doped with 2, 5, and 10 wt{/content/135GR8KPFD2CDN91/xxlarge8201.gif}% Ta2O5 were…”
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    Journal Article
  2. 2

    Feasibility of an Ag-alloy film as a thin-film transistor liquid-crystal display source/drain material by JEONG, C. O, ROH, N. S, HO, Paul S, CHO, B. S, KANG, B. J, YANG, H. J, KO, Y. K, LEE, J. G, KIM, S. G, PARK, H. S, KIM, C. W, SAKONG, D. S, SEOK, J. H, CHUNG, K. H, LEE, W. H, DONGWEN GAN

    Published in Journal of electronic materials (01-06-2002)
    “…The Ag-alloy films have been investigated as source/drain materials applicable to thin-film transistor liquid-crystal displays (TFT-LCDs). The Ag-alloy…”
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    Journal Article
  3. 3

    Fabrication and electrostatic actuation of thin diaphragms by Yang, E H, Yang, S S, Jeong, O C

    “…In this paper, two kinds ofp ^sup +^ diaphragms are fabricated. One is flat, and the other is corrugated to release the residual stress resulted from the…”
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    Journal Article
  4. 4

    Effects of boron depletion on the microstructure evolution of Cu(B) alloys deposited on Ti underlayer by Hong, T.K., Lee, S., Lee, J.G., Kim, C., Bang, H.J., Kang, C.H., Lee, J.H., Kim, D.H., Jeong, C.O., Kim, S.Y., Lim, S.K., Ruh, H.

    Published in Thin solid films (31-07-2007)
    “…This study examined the effects of a Ti underlayer on the microstructure evolution of Cu(B)/Ti/SiO 2 thin films upon annealing. For comparison, Cu(B)/SiO 2 was…”
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    Journal Article
  5. 5

    Eris: A reliability design tool for telecommunication systems by Jeong, M.K., Lee, S.Y., Jeong, C.O., Koh, J.S.

    Published in Computers & industrial engineering (01-07-1996)
    “…This article presents the software tool ERIS (ETRI Reliability Information System) to provide design engineers with a computerized reliability design and…”
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    Journal Article
  6. 6

    Microstructure evolution and resistivity of Cu(B) alloy films on Ti underlayer at the early stage of annealing at 500°C by Hong, T. K., Lee, S., Han, D. M., Lee, J. G., Lee, J. H., Kim, D. H., Jeong, C. O., Ruh, H., Lee, E. G., Kang, C. H.

    “…This study examined the time dependence of the microstructural evolution and resistivity of Cu(B) alloy thin films deposited on a Ti underlayer during rapid…”
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    Journal Article
  7. 7

    A sol-gel integrated dual-readout microarray platform for quantification and identification of prostate-specific antigen by Lee, S W, Lee, J-H, Kwon, H G, Laurell, T, Jeong, O C, Kim, S

    “…Here, we report a sol-gel integrated affinity microarray for on-chip matrix-assisted laser desorption/ionization time-of-flight mass spectrometry…”
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    Conference Proceeding
  8. 8

    Enhanced adhesion and performance of the source/drain electrode using a single-layered Ag(Cu) film for an amorphous silicon thin-film transistor by Hong, S. J., Lee, S., Park, J. B., Yang, H. J., Ko, Y. K., Lee, J. G., Cho, B. S., Jeong, C. O., Chung, K. H.

    Published in Applied physics letters (20-10-2003)
    “…The feasibility of using a Ag(Cu) alloy film as a source/drain electrode for thin-film transistor (TFT) liquid-crystal displays has been investigated. The…”
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    Journal Article
  9. 9

    Advanced four-mask a-Si TFT array fabrication process using improved materials by Song, J. H., Kim, S. G., Park, H. S., Jeong, C. O., Kim, C. W., Chung, K. H.

    “…— In order to achieve higher‐performance and lower‐cost a‐Si TFT array manufacturing, an advanced four‐mask fabrication process using low‐resistant metals, a…”
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    Journal Article Conference Proceeding
  10. 10

    34.1: Advanced Four-Mask Process Architecture for the a-Si TFT Array Manufacturing Method by Song, Jean H., Kwon, D. J., Kim, S. G., Roh, N. S., Park, H. S., Park, Y. B., Kim, D. G., Jeong, C. O., Kong, H. S., Kim, C. W., Chung, K. H.

    “…In order to simplify a‐Si TFT array manufacturing process, advanced 4 mask process of low resistant metal and new pixel electrode with improved unit process…”
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    Journal Article
  11. 11

    Effects of working pressure on the electrical and optical properties of aluminum-doped zinc oxide thin films by Moon, Yeon-Keon, Bang, Borae, Kim, Se-Hyun, Jeong, Chang-Oh, Park, Jong-Wan

    “…Zinc oxide films have been actively investigated as transparent electrode materials for optical displays. We report the effect of the working pressure on the…”
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    Journal Article
  12. 12

    Fabrication of a peristaltic PDMS micropump by Jeong, Ok Chan, Park, Sin Wook, Yang, Sang Sik, Pak, James Jungho

    Published in Sensors and actuators. A. Physical. (23-09-2005)
    “…This paper presents fabrication and drive test of a peristaltic PDMS micropump actuated by the thermopneumatic force. The micropump consists of the three…”
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    Journal Article
  13. 13

    Microstructure Evolution and Resistivity of Cu(B) Alloy Films on Ti Underlayer at the Early Stage of Annealing at 500 deg C by Hong, T K, Lee, S, Han, D M, Lee, J G, Lee, J H, Kim, D H, Jeong, C O, Ruh, H, Lee, E G, Kang, C H

    Published in Metals and materials international (01-10-2008)
    “…This study examined the time dependence of the microstructural evolution and resistivity of Cu(B) alloy thin films deposited on a Ti underlayer during rapid…”
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    Journal Article
  14. 14

    Microstructure Evolution and Resistivity of Cu(B) Alloy Films on Ti Underlayer at the Early Stage of Annealing at 500 by Hong, T. K.

    Published in Metals and materials international (23-10-2008)
    “…This study examined the time dependence of the microstructural evolution and resistivity of Cu(B) alloy thin films deposited on a Ti underlayer during rapid…”
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    Journal Article
  15. 15

    Microstructure evolution and resistivity of Cu(B) alloy films on Ti underlayer at the early stage of annealing at 500 degree C by Hong, T K, Lee, S, Han, D M, Lee, J G, Lee, J H, Kim, D H, Jeong, C O, Ruh, H, Lee, E G, Kang, CH

    Published in Metals and materials international (01-10-2008)
    “…This study examined the time dependence of the microstructural evolution and resistivity of Cu(B) alloy thin films deposited on a Ti underlayer during rapid…”
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    Journal Article
  16. 16

    Fabrication and test of a micro electromagnetic actuator by Kim, Ki Hoon, Yoon, Hyeun Joong, Jeong, Ok Chan, Yang, Sang Sik

    Published in Sensors and actuators. A. Physical. (01-01-2005)
    “…This paper presents the fabrication, test results and the finite element analysis of an electromagnetic micro actuator with three diaphragms that can be driven…”
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    Journal Article
  17. 17

    In situ study of stress relaxation mechanisms of pure Al thin films during isothermal annealing by Hwang, Soo-Jung, Lee, Yong-Duck, Park, Young-Bae, Lee, Je-Hun, Jeong, Chang-Oh, Joo, Young-Chang

    Published in Scripta materialia (01-06-2006)
    “…It is known that the compressive stress relaxation of Al thin films occurs by various deformation mechanisms, such as hillock formation, microstructural…”
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    Journal Article
  18. 18
  19. 19

    Correlation between Residual Stress and Boron Concentration in Boron-Doped Silicon Films by Jeong, Ok Chan, Yang, Sang Sik

    Published in Japanese Journal of Applied Physics (01-01-2005)
    “…This paper represents the correlation between the residual stress and the boron concentration in boron-doped silicon films. Residual stress measurement…”
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    Journal Article
  20. 20

    Fabrication and Drive Test of a Peristaltic Thermopnumatic PDMS Micropump by Jeong, Ok Chan, Park, Sin Wook, Yang, Sang Sik

    “…This paper presenti, fabrication and drive test of a peristaltic PDMS micropump actuated by the thermopneumatic force The micropump consists of the three…”
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    Journal Article