Search Results - "Ismail, Roslina"

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  1. 1

    Sartorial subversion in subculture of Malaysian female Muslim punks by Ismail, Roslina, Liu, Mengye

    Published in International journal of cultural studies (01-11-2024)
    “…Punk culture, with its hallmark rebellious aesthetic, often stands in stark contrast to the modesty prescribed by Islamic traditions, particularly regarding…”
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    Journal Article
  2. 2

    Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach by Jalar, Azman, Bakar, Maria Abu, Ismail, Roslina

    “…This paper highlights the advantages of using the nanoindentation approach over the conventional method for the mechanical characterization of components used…”
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  3. 3

    Identity and cultural allegory amidst the Chinese new era: Analyzing narrative strategies of the Chinese science fiction film by Hu, Zhaokai, Ismail, Roslina, Wang, Changsong

    Published in Cogent arts & humanities (31-12-2024)
    “…AbstractThis paper presents a comprehensive analysis of two Chinese science fiction films, The Wandering Earth and Crazy Alien, shedding light on their…”
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  4. 4

    Dialect shift and cultural dynamism among Betawi community in urban Jakarta in Palang Pintu and Rebut Dandang traditional ceremonies by Reza, Fahrani, Rohmah, Zuliati, Ismail, Roslina

    Published in Cogent arts & humanities (31-12-2024)
    “…The Betawi dialects, Betawi Tengahan and Betawi Pinggiran, are crucial to the identity of the Betawi people in Indonesia. Betawi Tengahan, prevalent in central…”
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  5. 5

    BIODIVERSITY CONSERVATION EFFORTS AMONG MUSLIM COUNTRIES: EVIDENCE FROM THE ORGANIZATION OF ISLAMIC COOPERATION COUNTRIES by Ismail, Roslina, Abdullah, Mohd Kamarulnizam, Abd Ghani, Latifah

    “…According to mainstream literature, Muslim countries often lag behind in terms of environmental sustainability despite their beingfully compliant with global…”
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  6. 6

    The invisible community in contemporary China: a visual narrative framework for Chinese lesbian identity by Zhang, Jia, Roslina, Ismail, Ramadan, Khaled, Md Isa, Wahyuni Masyidah

    “…This study employs the photo-elicitation (PE) interview method to explore the social construction of contemporary Chinese lesbian identity. It examines how…”
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  7. 7

    Scenario modelling of proxy system in the context of Malaysian food flow management by Ghani, Latifah Abdul, Mahmood, Noor Zalina, Ismail, Roslina, Sa'at, Siti Aisyah, Ali, Nora'aini, Mohd Zakuan, Siti Aishah

    Published in Heliyon (01-12-2022)
    “…The research on food flow network is unpredictable as the approaches employed are more targeted at specific study points, often excluding spatial and temporal…”
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  8. 8

    Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures by Abdullah, Izhan, Zulkifli, Muhammad Nubli, Jalar, Azman, Ismail, Roslina, Ambak, Mohd Arrifin

    Published in Journal of electronic materials (01-05-2019)
    “…A characterization of mechanical and micromechanical properties of SAC305 solder wire under varied strain rates and temperatures was performed using tensile…”
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  9. 9

    The Resilience of University Youth While Undergoing Digital Learning During the COVID-19 Pandemic by Yusrisham, Nur Amirrah, Kamaruddin, Siti Hajar, Mauzud, Siti Munirah, Ismail, Roslina

    Published in European journal of educational research (15-01-2024)
    “…The outbreak of COVID-19 has affected the educational sector globally. One of the impacts of this outbreak is observed in the implementation of digital…”
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  10. 10

    IMPROVING ENVIRONMENTAL PERFORMANCE OF THE MUSLIM WORLD: EVIDENCE FROM AFFLUENT COUNTRIES by Ismail, Roslina, Saputra, Jumadil, Aziz, Azlina Abdul

    “…Both the Muslim and non-Muslim worlds have a shared commitment to mitigate environmental degradation and repair already degraded areas. However, not much has…”
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  11. 11

    Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates by Abdullah, Izhan, Zulkifli, Muhammad Nubli, Jalar, Azman, Ismail, Roslina

    Published in Soldering & surface mount technology (03-04-2017)
    “…Purpose The purpose of this paper is to investigate the relationship between microstructure and varied strain rates towards the mechanical properties and…”
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  12. 12

    The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging by Ismail, Roslina, Omar, Ghazali, Jalar, Azman, Majlis, Burhanuddin Yeop

    Published in Journal of electronic materials (01-07-2015)
    “…Wire bonding processes has been widely adopted in micro-electromechanical systems (MEMS) packaging especially in biomedical devices for the integration of…”
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  13. 13

    Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu by Ismail, Norliza, Jalar, Azman, Abu Bakar, Maria, Ismail, Roslina, Saedi Ibrahim, Najib

    Published in Soldering & surface mount technology (23-04-2020)
    “…Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint…”
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  14. 14

    Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability by Ismail, Norliza, Ismail, Roslina, Jalar, Azman, Omar, Ghazali, Salleh, Emee Marina, Kamil, Norinsan, Rahman, Irman Abdul

    “…The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used…”
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  15. 15

    SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly by Che Ani, Fakhrozi, Jalar, Azman, Saad, Abdullah Aziz, Khor, Chu Yee, Ismail, Roslina, Bachok, Zuraihana, Abas, Mohamad Aizat, Othman, Norinsan Kamil

    Published in Soldering & surface mount technology (01-01-2018)
    “…Purpose This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly…”
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  16. 16

    Microstructural evolution and micromechanical properties of gamma-irradiated Au ball bonds by Yusoff, Wan Yusmawati Wan, Ismail, Roslina, Jalar, Azman, Othman, Norinsan Kamil, Abdul Rahman, Irman

    Published in Materials characterization (01-07-2014)
    “…The effect of gamma radiation on the mechanical and structural properties of gold ball bonds was investigated. Gold wires from thermosonic wire bonding were…”
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  17. 17

    Effect of wire diameter and hook location on second bond failure modes by Harun, Fuaida, Ismail, Roslina, Jalar, Azman, Abdullah, Shahrum

    Published in Microelectronics international (05-01-2015)
    “…Purpose – This paper aims to analyze the effect of Au wire size and location of hook during wire pulling test to identify the variation of results obtained…”
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  18. 18

    The influence of temperature on the inhibition of carbon steel corrosion in acidic lignin by Yahya, Solhan, Othman, Norinsan Kamil, Daud, Abdul Razak, Jalar, Azman, Ismail, Roslina

    Published in Anti-corrosion methods and materials (07-09-2015)
    “…Purpose – This paper aims to investigate the influence of temperature and lignin concentration on the inhibition of carbon steel corrosion in 1 M HCl…”
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  19. 19

    SAC–xTiO 2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly by Che Ani, Fakhrozi, Jalar, Azman, Saad, Abdullah Aziz, Khor, Chu Yee, Ismail, Roslina, Bachok, Zuraihana, Abas, Mohamad Aizat, Othman, Norinsan Kamil

    Published in Soldering & surface mount technology (05-02-2018)
    “…Purpose This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO 2 nanoparticles in an electronic assembly…”
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  20. 20

    Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium-Gold-Silver Metallization by Ismail, Roslina, Harun, Fuaida, Zulkifli, Muhammad Nubli, Jalar, Azman, Abu Bakar, Maria, Abdullah, Shahrum

    “…Several types of metallization have been used in order to enhance the bondability of wire bond. The introduction of copper (Cu) wire bond further increases the…”
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