Search Results - "Ismail, Roslina"
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1
Sartorial subversion in subculture of Malaysian female Muslim punks
Published in International journal of cultural studies (01-11-2024)“…Punk culture, with its hallmark rebellious aesthetic, often stands in stark contrast to the modesty prescribed by Islamic traditions, particularly regarding…”
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2
Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01-03-2020)“…This paper highlights the advantages of using the nanoindentation approach over the conventional method for the mechanical characterization of components used…”
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3
Identity and cultural allegory amidst the Chinese new era: Analyzing narrative strategies of the Chinese science fiction film
Published in Cogent arts & humanities (31-12-2024)“…AbstractThis paper presents a comprehensive analysis of two Chinese science fiction films, The Wandering Earth and Crazy Alien, shedding light on their…”
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4
Dialect shift and cultural dynamism among Betawi community in urban Jakarta in Palang Pintu and Rebut Dandang traditional ceremonies
Published in Cogent arts & humanities (31-12-2024)“…The Betawi dialects, Betawi Tengahan and Betawi Pinggiran, are crucial to the identity of the Betawi people in Indonesia. Betawi Tengahan, prevalent in central…”
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5
BIODIVERSITY CONSERVATION EFFORTS AMONG MUSLIM COUNTRIES: EVIDENCE FROM THE ORGANIZATION OF ISLAMIC COOPERATION COUNTRIES
Published in Journal of international studies (Sintok, Kedah, Malaysia) (01-04-2024)“…According to mainstream literature, Muslim countries often lag behind in terms of environmental sustainability despite their beingfully compliant with global…”
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6
The invisible community in contemporary China: a visual narrative framework for Chinese lesbian identity
Published in Humanities & social sciences communications (06-10-2024)“…This study employs the photo-elicitation (PE) interview method to explore the social construction of contemporary Chinese lesbian identity. It examines how…”
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7
Scenario modelling of proxy system in the context of Malaysian food flow management
Published in Heliyon (01-12-2022)“…The research on food flow network is unpredictable as the approaches employed are more targeted at specific study points, often excluding spatial and temporal…”
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8
Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures
Published in Journal of electronic materials (01-05-2019)“…A characterization of mechanical and micromechanical properties of SAC305 solder wire under varied strain rates and temperatures was performed using tensile…”
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9
The Resilience of University Youth While Undergoing Digital Learning During the COVID-19 Pandemic
Published in European journal of educational research (15-01-2024)“…The outbreak of COVID-19 has affected the educational sector globally. One of the impacts of this outbreak is observed in the implementation of digital…”
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10
IMPROVING ENVIRONMENTAL PERFORMANCE OF THE MUSLIM WORLD: EVIDENCE FROM AFFLUENT COUNTRIES
Published in International journal of energy economics and policy (2019)“…Both the Muslim and non-Muslim worlds have a shared commitment to mitigate environmental degradation and repair already degraded areas. However, not much has…”
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11
Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates
Published in Soldering & surface mount technology (03-04-2017)“…Purpose The purpose of this paper is to investigate the relationship between microstructure and varied strain rates towards the mechanical properties and…”
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12
The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging
Published in Journal of electronic materials (01-07-2015)“…Wire bonding processes has been widely adopted in micro-electromechanical systems (MEMS) packaging especially in biomedical devices for the integration of…”
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13
Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu
Published in Soldering & surface mount technology (23-04-2020)“…Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint…”
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14
Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
Published in Journal of materials science. Materials in electronics (01-08-2018)“…The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used…”
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15
SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
Published in Soldering & surface mount technology (01-01-2018)“…Purpose This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly…”
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16
Microstructural evolution and micromechanical properties of gamma-irradiated Au ball bonds
Published in Materials characterization (01-07-2014)“…The effect of gamma radiation on the mechanical and structural properties of gold ball bonds was investigated. Gold wires from thermosonic wire bonding were…”
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17
Effect of wire diameter and hook location on second bond failure modes
Published in Microelectronics international (05-01-2015)“…Purpose – This paper aims to analyze the effect of Au wire size and location of hook during wire pulling test to identify the variation of results obtained…”
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18
The influence of temperature on the inhibition of carbon steel corrosion in acidic lignin
Published in Anti-corrosion methods and materials (07-09-2015)“…Purpose – This paper aims to investigate the influence of temperature and lignin concentration on the inhibition of carbon steel corrosion in 1 M HCl…”
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19
SAC–xTiO 2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
Published in Soldering & surface mount technology (05-02-2018)“…Purpose This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO 2 nanoparticles in an electronic assembly…”
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20
Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium-Gold-Silver Metallization
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-10-2015)“…Several types of metallization have been used in order to enhance the bondability of wire bond. The introduction of copper (Cu) wire bond further increases the…”
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