Search Results - "Ishizaki, Toshitaka"

Structural and magnetic properties of size-controlled Fe–Ni nanoparticles synthesized by diffusing Fe atoms into preformed Ni nanoparticles by Akedo, Kunio, Ishizaki, Toshitaka, Yatsugi, Kenichi

“…Fe–Ni nanoparticles are attractive candidates for magnetic cores of transformers and inductors that are operated at high frequencies. When applying Fe–Ni…”
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Nanoparticle/solder hybrid joints for next-generation power semiconductor modules by Satoh, Toshikazu, Ishizaki, Toshitaka, Usui, Masanori

“…The properties of hybrid joints between SiC chips and direct-bond Cu (DBC) plates, which were composed of Cu nanoparticles and eutectic Bi-Sn solder particles,…”
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Enhanced pressure-free bonding using mixture of Cu and NiO nanoparticles by Satoh, Toshikazu, Ishizaki, Toshitaka

“…•The pressure-free bonding of mixed Cu–NiO nanoparticles was examined.•The effect of improved bonding strength was identified.•The bonding layer in the…”
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Effect of Particle Size on the Magnetic Properties of Ni Nanoparticles Synthesized with Trioctylphosphine as the Capping Agent by Ishizaki, Toshitaka, Yatsugi, Kenichi, Akedo, Kunio

“…Magnetic cores of passive components are required to have low hysteresis loss, which is dependent on the coercive force. Since it is well known that the…”
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Size- and Shape-Controlled Syntheses of Colloidal Sn, Te, and Bi Nanocrystals by Watanabe, Ryota, Ishizaki, Toshitaka

“…We report the synthesis of monodisperse spherical Sn nanocrystals 9.0 nm in size by reduction of SnCl2 using tetrabutylammonium borohydride (TBBH, N(C4H9)4BH4)…”
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Improving Powder Magnetic Core Properties via Application of Thin, Insulating Silica-Nanosheet Layers on Iron Powder Particles by Ishizaki, Toshitaka, Nakano, Hideyuki, Tajima, Shin, Takahashi, Naoko

“…A thin, insulating layer with high electrical resistivity is vital to achieving high performance of powder magnetic cores. Using layer-by-layer deposition of…”
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The Recovery of Gas-Vacancy-Complexes in Fe Irradiated with High Energy H or He Ions by Ishizaki, Toshitaka, Xu, Qiu, Yoshiie, Toshimasa, Nagata, Shinji

“…Isochronal annealing experiments for Fe irradiated with H or He ions were carried out to study interactions between gas atoms and vacancy clusters. The…”
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Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles by Ishizaki, Toshitaka, Watanabe, Ryota

“…Because of high thermal and electrical conductivity, high melting point, and low cost, bonding by sintering of Cu nanoparticles is promising as a new method to…”
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Thermal treatment to enhance saturation magnetization of superparamagnetic Ni nanoparticles while maintaining low coercive force by Ishizaki, Toshitaka, Yatsugi, Kenichi, Akedo, Kunio

“…Superparamagnetic nanoparticles capped by insulators have the potential to decrease eddy current and hysteresis losses. However, the saturation magnetization (…”
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Behavior of thin copper oxide on silver as an analogue for copper nanoparticles by Satoh, Toshikazu, Ishizaki, Toshitaka, Akedo, Kunio

“…The behavior of a thin copper oxide (CuOx) layer deposited on silver (Ag) was examined in order to clarify the process by which an interface is formed when Cu…”
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Effect of bismuth–tin alloy particle diameter on bonding strength of copper nanoparticles/bismuth–tin solder hybrid joints by Satoh, Toshikazu, Ishizaki, Toshitaka, Usui, Masanori

“…The effect of the diameter of Bi–Sn alloy particles on the bonding strength of hybrid joints formed between SiC chips and direct-bonded copper (DBC) plates…”
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Silver Adhesive Layer for Enhanced Pressure-Free Bonding Using Copper Nanoparticles by Satoh, Toshikazu, Ishizaki, Toshitaka, Akedo, Kunio

“…Pressure-free Cu nanoparticle bonding between two Cu plates with an Ag adhesive layer was examined. Insertion of the Ag adhesive layer considerably enhanced…”
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Composition-controlled synthesis of solid-solution Fe–Ni nanoalloys and their application in screen-printed magnetic films by Yatsugi, Kenichi, Ishizaki, Toshitaka, Akedo, Kunio, Yamauchi, Miho

“…Screen printing is attracting attention as a method for manufacturing magnetic components such as on-chip transformers and inductors. Fe–Ni alloys, which have…”
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High-Strength Pressure-Free Bonding Using Cu and Ni-Sn Nanoparticles by Watanabe, Ryota, Ishizaki, Toshitaka

“…High‐strength pressure‐free bonding is investigated using Cu nanoparticles as an alternative to conventional solders. Focus is placed on the morphology of…”
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X-ray photoelectron spectroscopic study of the formation of Cu/Ni interface mediated by oxide phase by Satoh, Toshikazu, Akedo, Kunio, Ishizaki, Toshitaka

“…•We report the interfacial reactions between Cu2O and Ni by the annealing.•The solid solution of Cu2O interacted with the surface oxide of Ni were…”
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Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES by ISHIZAKI, Toshitaka, WATANABE, Ryota

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Pressure-Free Bonding of Metallic Plates with Ni Affinity Layers Using Cu Nanoparticles by Ishizaki, Toshitaka, Akedo, Kunio, Satoh, Toshikazu, Watanabe, Ryota

“…This study investigated the pressure-free bonding of metallic plates using Cu nanoparticles capped by fatty acid and amine as the bonding material. The…”
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Nanodisturbances in deformed Gum Metal by Gutkin, Mikhail Yu, Ishizaki, Toshitaka, Kuramoto, Shigeru, Ovid’ko, Ilya A.

“…Systematic experiments have been performed to characterize defect structures in deformed Gum Metal, a special titanium alloy with high strength, low Young’s…”
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Behavior of vacancies near edge dislocations in Ni and α − Fe : Positron annihilation experiments and rate theory calculations by Sato, Koichi, Yoshiie, Toshimasa, Ishizaki, Toshitaka, Xu, Qiu

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Effect of Particle Size on the Magnetic Properties of Ni Nanoparticles Synthesized with Trioctylphosphine as the Capping Agent by Ishizaki, Toshitaka, Yatsugi, Kenichi, Akedo, Kunio

“…Magnetic cores of passive components are required to have low hysteresis loss, which is dependent on the coercive force. Since it is well known that the…”
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