Search Results - "Isaacs, Phil"

Cleanliness Requirements: A Moving Target by Isaacs, Phil, Munson, Terry

“…During the last 25 years, major shifts occurred in the electronic assembly industry, such as the transition to contract manufacturing and reduction or…”
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Understanding Creep Corrosion Field Fails by Isaacs, Phil, Zhang, Jing, Munson, Terry

“…Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling,…”
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What makes no-clean flux residue benign? by Isaacs, Phil, Munson, Terry

“…Since the conversion to lead-free solders, no-clean flux has become the predominate flux used in electronic card assembly and test (ECAT) manufacturing…”
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Evaluation of no-clean flux residues remaining after secondary process operations by Isaacs, Phil, Bennett, Jennifer, Munson, Terry

“…In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these…”
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Selection and Qualification of a Local Rework Supplier by Isaacs, Phil, Gomez, Mauricio Castro, Kosonoy, Luis

“…In the electronics industry there is a drive to reduce the total cost of manufacturing, while maintaining the quality and reliability of the product. The drive…”
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Critical success factors for electronic manufacturing services by Kobeda, Eddie, Isaacs, Phil, Pymento, Larry

“…Ongoing developments in the electronics industry continue to be driven by alternative or disruptive technologies that are discovered in pursuit of satisfying…”
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Comparison of ionic contamination test methods to determine their ability to reliably predict performance risks by Isaacs, Phil, Porto, Jennifer, Braun, Dave, Munson, Terry

“…In the Electronic Manufacturing Services Industry, one of the known failure mechanisms is caused by the presence of ionic contamination. Ionic contamination…”
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Process considerations for lead free assemblies by Isaacs, Phil, Kar Lin Chia, Huat Ing Poh, Truman, Tom

“…Often, challenges occur when transitioning legacy designed products from leaded solder materials to a RoHS compliant material set. The increased process…”
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