Search Results - "Ingelsson, Urban"
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1
Test Planning for Core-based Integrated Circuits under Power Constraints
Published in Journal of electronic testing (01-02-2017)“…This paper addresses reduction of test cost for core-based non-stacked integrated circuits (ICs) and stacked integrated circuits (SICs) by test planning, under…”
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2
Abort-on-Fail Test Scheduling for Modular SOCs without and with Preemption
Published in IEEE transactions on computers (01-12-2015)“…System-on-chips (SOCs) and 3D stacked ICs are often tested for manufacturing defects in a modular fashion, enabling us to record the module test pass…”
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3
Evaluation of Level of Confidence and Optimization of Roll-back Recovery with Checkpointing for Real-Time Systems
Published in Microelectronics and reliability (01-05-2014)“…•Use Level Of Confidence (LoC) as metric to evaluate to what extent a deadline is met.•Use LoC to evaluate both hard and soft real-time systems (RTS).•Optimize…”
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Journal Article -
4
Access Time Analysis for IEEE P1687
Published in IEEE transactions on computers (01-10-2012)“…The IEEE P1687 (IJTAG) standard proposal aims at providing a standardized interface between the IEEE Standard 1149.1 test access port (TAP) and on-chip…”
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Journal Article -
5
Scheduling Tests for 3D Stacked Chips under Power Constraints
Published in Journal of electronic testing (01-02-2012)“…This paper addresses Test Application Time ( TAT ) reduction under power constraints for core-based 3D Stacked ICs (SICs) connected by Through Silicon Vias…”
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6
Bridging Fault Test Method With Adaptive Power Management Awareness
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01-06-2008)“…A key design constraint of circuits used in hand-held devices is the power consumption, mainly due to battery-life limitations. Adaptive power management (APM)…”
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7
Process Variation-Aware Test for Resistive Bridges
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01-08-2009)“…This paper analyzes the behavior of resistive bridging faults under process variation and shows that process variation has a detrimental impact on test quality…”
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Test Scheduling in an IEEE P1687 Environment with Resource and Power Constraints
Published in 2011 Asian Test Symposium (01-11-2011)“…In contrast to IEEE 1149.1, IEEE P1687 allows, through segment insertion bits, flexible scan paths for accessing on-chip instruments, such as test, debug,…”
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Conference Proceeding -
9
Test Time Analysis for IEEE P1687
Published in 2010 19th IEEE Asian Test Symposium (01-12-2010)“…The IEEE P1687 (IJTAG) standard proposal aims at providing a standardized interface between on-chip embedded logic (instruments), such as scan-chains and…”
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10
Investigation into voltage and process variation-aware manufacturing test
Published in 2011 IEEE International Test Conference (01-09-2011)“…Traditional test methods that use abstract fault models potentially results in low defect coverage and test escapes for ICs with multiple supply voltage (Vdd)…”
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Test Planning for Core-based 3D Stacked ICs with Through-Silicon Vias
Published in 2012 25th International Conference on VLSI Design (01-01-2012)“…Test planning for core-based 3D stacked ICs with trough-silicon vias (3D TSV-SIC) is different from test planning for non-stacked ICs as the same test schedule…”
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12
Efficient Embedding of Deterministic Test Data
Published in 19th IEEE Asian Test Symposium (ATS10), Shanghai, China, December 1-4, 2010. (01-12-2010)“…Systems with many integrated circuits (ICs), often of the same type, are increasingly common to meet the constant performance demand. However, systems in…”
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Conference Proceeding -
13
Design automation for IEEE P1687
Published in 2011 Design, Automation & Test in Europe (01-03-2011)“…The IEEE P1687 (IJTAG) standard proposal aims at standardizing the access to embedded test and debug logic (instruments) via the JTAG TAP. P1687 specifies a…”
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Conference Proceeding -
14
Variation Aware Analysis of Bridging Fault Testing
Published in 2008 17th Asian Test Symposium (01-11-2008)“…This paper investigates the impact of process variation on test quality with regard to resistive bridging faults. The input logic threshold voltage and gate…”
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15
Resistive Bridging Faults DFT with Adaptive Power Management Awareness
Published in 16th Asian Test Symposium (ATS 2007) (01-10-2007)“…A key design constraint of circuits used in handheld devices is the power consumption, due mainly to the limitations of battery life. The employment of…”
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Addressing model complexity in automotive system development: Selection of system model elements for allocation of requirements
Published in 2016 4th International Conference on Model-Driven Engineering and Software Development (MODELSWARD) (01-02-2016)“…Modern automotive embedded systems are developed by Original Equipment Manufacturers (OEM) together with multiple suppliers. A key problem for a supplier is to…”
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17
Fault injection and fault handling: An MPSoC demonstrator using IEEE P1687
Published in 2014 IEEE 20th International On-Line Testing Symposium (IOLTS) (01-07-2014)“…As fault handling in multi-processor system-on-chips (MPSoCs) is a major challenge, we have developed an MPSoC demonstrator that enables experimentation on…”
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18
Reusing and Retargeting On-Chip Instrument Access Procedures in IEEE P1687
Published in IEEE design & test of computers (2012)“…This paper discusses the reuse and retargeting of test instruments and test patterns using the IEEE P1687 standard in an era where reuse of existing functional…”
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Journal Article -
19
Test tool qualification through fault injection
Published in 2012 17th IEEE European Test Symposium (ETS) (01-05-2012)“…According to ISO 26262, a recent automotive functional safety standard, verification tools shall undergo qualification, e.g. to ensure that they do not fail to…”
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Conference Proceeding -
20
Scheduling Tests for 3D Stacked Chips under Power Constraints
Published in 2011 Sixth IEEE International Symposium on Electronic Design, Test and Application (01-01-2011)“…This paper addresses Test Application Time (TAT) reduction for core-based 3D Stacked ICs (SICs). Applying traditional test scheduling methods used for…”
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Conference Proceeding