Search Results - "Im, Yunhyeok"

Fast and Real-Time Thermal-Aware Floorplan Methodology for SoC by Cho, Youngsang, Kim, Heonwoo, Lee, Kyoungmin, Jo, Hyungyung, Lee, Heeseok, Kim, Minkyu, Im, Yunhyeok

“…When designing system on chip (SoC), it is crucial to ensure that the temperature stays as lowest as possible during scenario operation. For that, the…”
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Thermal Modeling and Optimization of Mobile Device using modified LPV ROM by Im, Yunhyeok, Jung, Gyuick, Lee, Myunghoon, Gangrade, Akashdeep, Kim, Seungjoo

“…As computing power increases rapidly, thermal limit becomes the bottleneck of device performance. Therefore, performance estimation and design optimization…”
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Development of Junction Temperature Decision (JTD) Map for Thermal Design of Nano-scale Devices Considering Leakage Power by Yunhyeok Im, Eun Seok Cho, Kiwon Choi, Sayoon Kang

“…As semiconductor technology keeps scaling down, leakage power grows significantly due to the reduction in threshold voltage, channel length, and gate oxide…”
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Pattern Continuity Check Approach to Model Effective Thermal Conductivity of PCB by Cho, Youngsang, Hyun, Younghoon, Im, Yunhyeok, Shin, Youngmin

“…The size of semiconductor chip is getting smaller, and the power density is also increasing due to reduction of heat source size. Accurate thermal modeling of…”
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Thermal Aware Floorplan Optimization of SoC in Mobile Phone by Cho, Youngsang, Kim, Heonwoo, Lee, Kyoungmin, Im, Yunhyeok, Lee, Heeseok, Kim, Minkyu

“…Mobile phone functions are evolving towards high-end cameras, AI functions, and high-performance gaming environments. To implement these functions, the System…”
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Flower-Like CuO Nanostructures for Enhanced Boiling by Im, Yunhyeok, Dietz, Carter, Lee, Seung S., Joshi, Yogendra

“…Flower-like CuO nanostructures were fabricated to enhance nucleate pool boiling. These nanostructures enhance boiling due to capillary wicking induced by their…”
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Thermal-Aware Optimization of SoC Floorplan with Heterogenous Multi-Cores by Yoo, Jongkyu, An, Taekeun, Oh, Chigwan, Cho, Youngsang, Lee, Heeseok, Im, Yunhyeok, Kim, Minkyu, Kim, Minsu

“…As the performance required by System on Chip (SoC) IPs has increased, power consumption and power density have been increased. Since the SoC temperature is…”
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Thermal perspective design Analysis of 3D stacked chip integrated by TSV, Micro-bump and TMV with SOC by Cho, Youngsang, Lee, Kyoungmin, Hwang, Kyojin, Lee, Heeseok, Im, Yunhyeok, Kim, Minkyu

“…In this paper, a design analysis considering the thermal characteristics of SOC (system on chip) 3DIC (three dimensional integrated circuit) structure is…”
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Equivalent thermal conductivity of a composite structure considering heat spreading on neighboring layers by Hyun, Younghoon, Lee, Bruce Weon, Wook Jung, Ki, Cho, Byeong Yeon, Im, Yunhyeok, Oh, Dan Kyung Suk

“…A novel method for the equivalent thermal conductivities (K eq ) extraction of a composite structure is proposed and analyzed by theoretical calculation and…”
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Optimization of hotspot location on multi stacked board of mobile phone by Cho, Youngsang, Yoo, Jongkyu, Im, Yunhyeok, An, Taekeun, Lee, Heeseok, Heo, Yun

“…As the performance of smartphones increases rapidly, the power required by major components has increased. To maximize usage time in power demanding scenario,…”
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Methodology for Accurate Hotspot Prediction by Upscale Spatiotemporal Resolution of Temperature Sensing using a Power Meter and Resistor-Capacitor Thermal Model by An, Taekeun, Im, Yunhyeok, Yoo, Jongkyu, Cho, Youngsang, Lee, Heeseok, Heo, Yun

“…Accurate temperature monitoring for the entire area of a die with fine time resolution is crucial for maximizing device performance. For mobile devices in…”
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Finding the minimum quantity and the optimum placement of on-die temperature sensor in SOC design based on rank analysis by Lee, Heeseok, Im, Yunhyeok, An, Taekeun, Cho, Young-Sang, Yoo, Jongkyu

“…Accurate reading of on-die temperature sensor (OD-TS) has been more and more important in the advanced techniques for dynamic thermal management, on which high…”
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Thermal Model Simplification of Mobile Device with Adaptive Metamodel of Optimal Prognosis (AMOP) by Im, Yunhyeok, Jo, Hyungyung, Oh, Chigwan, Cho, Young-Sang, Yoo, Jongkyu, Lee, Heeseok, Lee, Myunghoon, Yaddanapudi, Vamsi Krishna

“…The effective performance of system on chip (SOC) is tightly coupled with transient thermal behavior. To consider multiple design parameters in the limited…”
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Methodology for accurate junction temperature estimation of SIP(System in Package) by IM, Yunhyeok, KWON, Heunghyu, KIM, Senyun, KIM, Tongsuk, CHO, Taeje, OH, Seyong

“…As the mobile products have been developed, lots of devices of various functions should be packaged into the limited space. Therefore, as many as possible…”
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Thermal characterization of high speed DDR devices in system environments [DRAM modules] by Joonghyun Baek, Byungse So, Taekoo Lee, Yunhyeok Im, Seyong Oh

“…This paper studies the thermal characteristics of various memory modules for desktop and server systems. Using a CFD (computational fluid dynamics) simulator,…”
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Impact of Chip, Package, and Set Design on Transient Temperature in Mobile Application by Yoo, Jongkyu, Im, Yunhyeok, Lee, Heeseok, Cho, Young-Sang, An, Taekeun, Lee, Hoi-Jin, Shin, Youngmin

“…Recently, the power density has been increasing due to the high bandwidth of 5G mobile devices and it leads to temperature rise. Increased temperature reduces…”
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Thermal Sensor Placement based on Meta-Model Enhancing Observability and Controllability by Im, Yunhyeok, Kim, Wook, An, Taekeun, Lee, Heeseok, Cho, Young-Sang, Yoo, Jongkyu, Lee, Hoi-Jin, Shin, Youngmin, Lee, Myunghoon, Yaddanapudi, Vamsi Krishna

“…On-chip thermal sensor (TS) is essential to prevent a chip from burn out and to increase its reliability. In addition, accuracy of temperature reading can…”
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Micro cooling application on high density memory module by Yunhyeok Im, Hyejung Cho, Minha Kim, Joonghyun Baek

“…A numerical simulation and two kinds of experiments are conducted to investigate the thermal performance of several kinds of heat spreaders for high power…”
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Thermal Characterization of Multi Stack Packages Using Linear Superposition Method by Jaewook Yoo, Yunhyeok Im, Kiwon Choi, Taeje Cho, Sayoon Kang, Seyong Oh

“…As the mobile products have been developed, many devices of various functions should be packaged into the limited space. Therefore, stacking multi-packages is…”
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Comparative Study Of 3D Package Configurations In Power Delivery And Thermal Perspective by Lee, Heeseok, Im, Yunhyeok, Shin, Youngmin

“…The advanced packaging technologies including POP (package on package), SIP (system in package), embedded substrate, WLP (wafer-level package) and FO (fan-out)…”
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