Search Results - "Iizuka, Tomonori"

Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites by Huang, Xingyi, Iizuka, Tomonori, Jiang, Pingkai, Ohki, Yoshimichi, Tanaka, Toshikatsu

“…The interface between filler and matrix has long been a critical problem that affects the thermal conductivity of polymer composites. The effects of the…”
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Comparison of partial discharge resistance of several nanocomposites by Iizuka, Tomonori, Tanaka, Toshikatsu

“…Partial discharge (PD) resistance was evaluated for several kinds of nanocomposites. The following experimental results were obtained. Epoxy is stronger in PD…”
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High-temperature-resistant interconnection by using Nickel Nano-particles for power devices packaging by Iizuka, Tomonori, Tanaka, Yasunori, Kamei, Kazuhito, Inagaki, Masakazu, Murakawa, Norihiro, Tatsumi, Kohei

“…The improvement of interconnection technology is becoming a top priority for the operation of high power devices such as SiC at higher temperatures. We…”
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Voltage endurance characteristics of epoxy/silica nanocomposites by Iizuka, Tomonori, Uchida, Katsumi, Tanaka, Toshikatsu

“…Two kinds of epoxy/silica nanocomposites, specifically Aerosil and Nanopox specimens, were prepared to clarify the effect of nano‐filler dispersion and of…”
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High-temperature resistant interconnection using Ni nanoparticles and Al microparticles paste sintered in an atmosphere by Koshiba, Keiko, Iizuka, Tomonori, Tatsumi, Kohei

“…Abstract Next-generation power devices using wide bandgap semiconductors, such as SiC, are expected to operate at higher temperatures than conventional Si…”
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A new method of joining stainless steels using Ni micro-plating bonding and the mechanical properties of the joint by Miyagawa, Mayu, Uchimura, Tetsuya, Koshiba, Keiko, Iizuka, Tomonori, Tatsumi, Kohei

“…Stainless steel is applied in a wide range of fields as a material with high heat and corrosion resistance. Welding, brazing, and solid-phase bonding are the…”
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Improvement in the reliability of crystalline silicon solar cell interconnection by using Nickel Micro-Plating Bonding (NMPB) technology by Yu, Xinguang, Fu, Zhi, Morisako, Isamu, Koshiba, Keiko, Iizuka, Tomonori, Tatsumi, Kohei

“…Abstract It is popular to research promoting the light conversion efficiency of crystalline silicon solar cell photovoltaic (PV) modules. However, excellent…”
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High Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding by Tatsumi, Kohei, Morisako, Isamu, Wada, Keiko, Fukuomori, Minoru, Iizuka, Tomonori, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Hikita, Masayuki, Kamimura, Rikiya, Kawanabe, Naoki, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji

“…New bonding technologies, which can deliver high-temperature thermal resistance that replaces solder bonding or Al wire bonding, have been strongly expected in…”
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Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength part II-breakdown strength by Zengbin Wang, Iizuka, Tomonori, Kozako, Masahiro, Ohki, Yoshimichi, Tanaka, Toshikatsu

“…The aim of this research is to find a way to achieve the epoxy composites with high thermal conductivity and acceptable dielectric breakdown (BD) strength. A…”
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Direct bonding of Ni nanoparticles to a semiconductor Al electrode in air and its form by Tanaka, Yasunori, Koshiba, Keiko, Iizuka, Tomonori, Ito, Mayumi, Higashimine, Koichi, Tatsumi, Kohei

“…This research group evaluated the bondability of sinter bonding using Ni nanoparticles, which have a high melting point and excellent corrosion resistance, as…”
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Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application by Tatsumi, Kohei, Inagaki, Masakazu, Kamei, Kazuhito, Iizuka, Tomonori, Narimatsu, Hiroaki, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Imakiire, Akihiro, Hikita, Masayuki, Kamimura, Rikiya, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji

“…Aiming for application to the inverter system of HEV and EV, we have developed a novel packaging technique for SiC power devices based on Nickel Micro Plating…”
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Electrical properties of epoxy/POSS composites with homogeneous nanostructure by Huang, Xingyi, Li, Yong, Liu, Fei, Jiang, Pingkai, Iizuka, Tomonori, Tatsumi, Kohei, Tanaka, Toshikatsu

“…The knowledge of the structure-property relationship at nanoscale level is important to develop advanced dielectric polymer composites. Herein dielectric…”
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High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles by Tatsumi, Kohei, Tanaka, Yasunori, Iizuka, Tomonori, Wada, Keiko, Fukumori, Minoru, Morisako, Isamu, Jeongbin, Yoon, Murakawa, Norihiro

“…Recently there are high expectations for incorporating silicon carbide (SiC) devices as power modules in hybrid electric vehicles (HEV) and electric vehicles…”
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Filler‐dependent changes in thermal, dielectric, and mechanical properties of epoxy resin nanocomposites by Nagase, Emiri, Iizuka, Tomonori, Tatsumi, Kohei, Hirai, Naoshi, Ohki, Yoshimichi, Yoshida, Shigeyoshi, Umemoto, Takahiro, Muto, Hirotaka

“…We added nanofillers of MgO, Mg(OH)2, SiO2, and TiO2 to epoxy resin by high‐pressure shearing at a content of 1 vol%. The glass transition temperature (Tg),…”
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Characteristics of initial trees of 30 to 60 μm length in epoxy/silica nanocomposite by Jiandong Wu, Iizuka, T., Monden, K., Tanaka, T.

“…Many studies were carried out on breakdown (BD) V-t b characteristics to bring about 1 to 3 mm long trees in the past. Instead, tree initiation V-t i…”
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High temperature resistant packaging for SiC power devices using interconnections formed by Ni micro-electro-plating and Ni nano-particles by Tanaka, Yasunori, Ota, Keito, Miyano, Haruka, Shigenaga, Yoshiaki, IiZuka, Tomonori, Tatsumi, Kohei

“…Ni Micro-Plating and Ni nano-particle bonding were applied for high temperature resistant chip interconnections of power device packaging. During the…”
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Characteristics of initial trees of 30 to 60 [mu]m length in epoxy/silica nanocomposite by Wu, Jiandong, Iizuka, Tomonori, Monden, Kenji, Tanaka, Toshikatsu

“…Many studies were carried out on breakdown (BD) V-tb characteristics to bring about 1 to 3 mm long trees in the past. Instead, tree initiation V-ti…”
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Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength partI - sample preparations and thermal conductivity by Wang, Zengbin, Iizuka, Tomonori, Kozako, Masahiro, Ohki, Yoshimichi, Tanaka, Toshikatsu

“…The aim of this research is to find a way to achieve the epoxy composites with both high thermal conductivity and acceptable dielectric breakdown (BD)…”
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New interconnection technologies based on Ni nano-particle and Ni micro-plating bonding with stress relaxation effect for high-temperature resistant power device packaging by Tanaka, Yasunori, Furuya, Shun, Koshiba, Keiko, Kitaguchi, Yuya, Hino, Yasunari, Miyagawa, Mayu, Iizuka, Tomonori, Tatsumi, Kohei

“…There are high expectations for silicon carbide (SiC) devices as power device modules in electric vehicles (EV). The need for a new bonding method has been…”
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Electroluminescence of Epoxy Resin Nanocomposite Under AC High Field by Tohyama, Kazuyuki, Iizuka, Tomonori, Tatsumi, Kohei, Otake, Yasutomo, Umemoto, Takahiro, Mabuchi, Takahiro, Muto, Hirotaka

“…While it is assumed that aging of electric power equipment for generation will progress, it is necessary to update it sequentially in order to maintain…”
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