Search Results - "Ibrahiem, A A"
-
1
Viscoplastic characterization of novel (Fe, Co, Te)/Bi containing Sn–3.0Ag–0.7Cu lead-free solder alloy
Published in Journal of materials science. Materials in electronics (01-04-2020)“…A novel alloying elements of TeFeCoBi have been anticipated to modify Sn–3Ag–0.7Cu SAC(307) alloys in various attributes. This study inspects the influence of…”
Get full text
Journal Article -
2
Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te
Published in Physica scripta (01-06-2024)“…The mechanical characteristics of Sn-1.5Ag-0.5Cu (SAC155) alloy modified with In, Bi, and Te microalloying are investigated in relation to three strengthening…”
Get full text
Journal Article -
3
Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field
Published in Journal of materials science. Materials in electronics (01-03-2021)“…The main scope of this research is to investigate the impact of rotating magnetic field (RMF) on the physical properties of the Sn–0.5Ag–0.5Cu–2.0Sb–0.1Al…”
Get full text
Journal Article -
4
Effect of Cobalt Chloride as Filler and PVP on the Optical Properties of PVA/PEG/PVP Blends
Published in Optics and spectroscopy (01-05-2020)“…Different concentrations of PVA/PEG/PVP blends as well as different composites of cobalt chloride, as filler, embedded in apolymeric blend as a hosting matrix,…”
Get full text
Journal Article -
5
Effects of Radiation Pressure on the Elliptic Restricted Four-Body Problem
Published in Journal of applied mathematics (30-11-2021)“…In this paper, under the effects of the largest primary radiation pressure, the elliptic restricted four-body problem is formulated in Hamiltonian form…”
Get full text
Journal Article -
6
Development of Sn-1.0Ag-0.7Cu composite solder with improved resistivity and strength–ductility synergy through additions of Ni, Te and MWCNT
Published in Journal of materials science. Materials in electronics (01-07-2021)“…Multi-walled carbon nanotubes (MWCNTs) reinforced Sn-1.0Ag-0.7Cu (SAC107) composite solders have fabricated by mechanical mixing method. The effects of small…”
Get full text
Journal Article -
7
Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3Cu alloy
Published in Journal of materials science. Materials in electronics (01-12-2023)“…A substantial advancement has been made in the prospective design strategy of composite alloys Sn–5Sb–0.3Cu (SSC503) containing multi-walled carbon nanotubes…”
Get full text
Journal Article -
8
Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite
Published in Physica scripta (01-09-2023)“…The use of innovative Co–Mg–La ferrite nanoparticles (ferrite) facilitates the production of superior Pb-free solder alloy materials that suffer from the…”
Get full text
Journal Article -
9
Structural, mechanical, and dielectric properties of polyvinylchloride/graphene nano platelets composites
Published in International journal of polymer analysis & characterization (02-01-2021)“…Composites of polyvinylchloride (PVC) embedded with different ratios of graphene nano-platelets (GnP) were prepared by the casting method. Some techniques as…”
Get full text
Journal Article -
10
Viscoplastic characterization and mechanical strength of novel Sn–1.7Ag–0.7Cu lead-free solder alloys with microalloying of Te and Co
Published in Journal of materials science. Materials in electronics (01-07-2019)“…A persistent dream in lead-free Sn–Ag–Cu solder community is to attain both high strength and ductility for the design and reliability of soldered joints…”
Get full text
Journal Article -
11
Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn–Ag–Cu–Sb–Al solder alloy by ultrasonic pulse echo method
Published in Journal of materials science. Materials in electronics (01-06-2020)“…Preventing columnar β-Sn grains forming during manufacture have undoubtedly become major challenges. Columnar grains are commonly considered as unfavorable as…”
Get full text
Journal Article -
12
Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions
Published in Materials in engineering (01-12-2013)“…In this paper, we report a convenient and informative procedure for improving the integrity and reliability of eutectic Sn-9Zn solder using minor alloying…”
Get full text
Journal Article -
13
Parents' Knowledge, Attitude, and Practices toward Methamphetamine Abuse among Youth and its Risk Factors in Saudi Arabia
Published in Journal of pharmacy & bioallied science (01-02-2024)“…The present study aimed to conduct an assessment of parents' knowledge, attitudes, and practices toward methamphetamine "shabu" abuse among youth and its risk…”
Get full text
Journal Article -
14
Influence of triadimefon on the growth and development of banana cultivars
Published in African journal of biotechnology (16-04-2014)“…Triazole fungicide triadimefon (bayletone) is a broad systemic fungicide used in agriculture as screening agent. Triadimefon interferes with plant sterol…”
Get full text
Journal Article -
15
Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications
Published in Journal of materials science. Materials in electronics (2017)“…Sn–Cu alloys were recommended as a promising substitute for traditional Sn–Pb alloy in wave soldering applications. In the present study, the change of…”
Get full text
Journal Article -
16
Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder
Published in Journal of alloys and compounds (05-05-2022)“…Avoiding the weak interface bonding of multi-walled carbon nanotubes MWCNT with Sn-Ag-Cu solder matrix is vital to produce high performance large scale…”
Get full text
Journal Article -
17
Assessment of room-temperature short-term stress relaxation and strain relaxation with recovery in Sn-Bi lead-free solders solidified under rotating magnetic field
Published in Journal of alloys and compounds (05-01-2018)“…In this paper, short-term stress relaxation test (SRT) as well as strain relaxation and recovery test (SRRT) were performed to assessment the minimum creep…”
Get full text
Journal Article -
18
Clinicopathological correlation of endocan expression and survival in epithelial ovarian cancer
Published in Archives of gynecology and obstetrics (01-12-2013)“…Introduction Endothelial-cell-specific molecule-1 or endocan is a proteoglycan with tumorigenic activity through both its glycan and protein cores. Endocan…”
Get full text
Journal Article -
19
Host and viral determinants of the outcome of exposure to HCV infection genotype 4: a large longitudinal study
Published in The American journal of gastroenterology (01-02-2014)“…The objective of this study was to characterize the factors that influence the outcome of exposure to hepatitis C virus (HCV) genotype 4 (HCV-G4) and the…”
Get full text
Journal Article -
20
The role of delayed elasticity and stress relaxation in Sn-Bi-Cu lead-free solders solidified under permanent magnet stirring
Published in Journal of alloys and compounds (05-04-2018)“…This paper develops methods to explore the influence of permanent magnet stirring (PMS) on solidification microstructure, thermal behavior and creep parameters…”
Get full text
Journal Article