Search Results - "Iannotti, Joe"
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Precision Dispensed Die Fillets as Nonconformal Surfaces for Printed Interconnects: Characterization, Optimization, and Mechanical Performance Assessment
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-04-2021)“…The ability to fabricate smooth transitions between surfaces at different levels is critical for the establishment of robust printed interconnections in…”
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Journal Article -
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Development of Multilayer Organic Modules for Hermetic Packaging of RF MEMS Circuits
Published in 2006 IEEE MTT-S International Microwave Symposium Digest (01-06-2006)“…We present the design and development of a multilayer organic module that can integrate microelectromechanical systems (MEMS) into a system-in-a-package (SiP)…”
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Conference Proceeding