Search Results - "Hyoung-Sub Kim"
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Novel Approach for the Reduction of Leakage Current Characteristics of 20 nm DRAM Capacitors With ZrO2-Based High-k Dielectrics
Published in IEEE electron device letters (01-11-2017)“…In order to produce a dynamic random access memory (DRAM) of 20 nm or less, the most important concern regarding development is to reduce the leakage current…”
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2.45 e-RMS Low-Random-Noise, 598.5 mW Low-Power, and 1.2 kfps High-Speed 2-Mp Global Shutter CMOS Image Sensor With Pixel-Level ADC and Memory
Published in IEEE journal of solid-state circuits (01-04-2022)“…This article presents a low random noise, a low-power, and a high-speed 2-mega pixels (Mp) global-shutter (GS)-type CMOS image sensor (CIS) using an advanced…”
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Risk factor analysis of postoperative kyphotic change in subaxial cervical alignment after upper cervical fixation
Published in Journal of neurosurgery. Spine (01-08-2019)“…Little is known about the risk factors for postoperative subaxial cervical kyphosis following craniovertebral junction (CVJ) fixation. The object of this study…”
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4
Investigation of transient relaxation under static and dynamic stress in Hf-based gate oxides
Published in IEEE transactions on electron devices (01-05-2006)“…Transient relaxation, which has been addressed as an undesirable issue in high-k alternate gate dielectrics, has been studied systematically. In Hf-based…”
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Hafnium Titanate bilayer structure multimetal dielectric nMOSCAPs
Published in IEEE electron device letters (01-04-2006)“…A novel approach of fabricating laminated TiO/sub 2//HfO/sub 2/ bilayer multimetal oxide dielectric has been developed for high-performance CMOS applications…”
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New Method for Reduction of the Capacitor Leakage Failure Rate Without Changing the Capacitor Structure or Materials in DRAM Mass Production
Published in IEEE transactions on electron devices (01-11-2018)“…In the development of dynamic random access memory (DRAM) with a device size of 20 nm or less, the leakage current of a capacitor with high-k dielectrics is…”
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Metal gate-HfO2 metal-oxide-semiconductor capacitors on n-GaAs substrate with silicon/germanium interfacial passivation layers
Published in Applied physics letters (27-11-2006)“…In this letter, the authors present the capacitance-voltage and current-voltage characteristics of TaN∕HfO2∕n-GaAs metal-oxide-semiconductor capacitors with…”
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Multidimensional ZnO light-emitting diode structures grown by metal organic chemical vapor deposition on p - Si
Published in Applied physics letters (03-12-2007)“…A multidimensional ZnO light-emitting diode (LED) structure comprising film/nanorods/substrate was fabricated on a p -type Si substrate using metal organic…”
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Ultrathin HfO2 (equivalent oxide thickness=1.1nm) metal-oxide-semiconductor capacitors on n-GaAs substrate with germanium passivation
Published in Applied physics letters (19-06-2006)“…We present the capacitance-voltage characteristics of TaN∕HfO2∕n-GaAs metaloxide-semiconductor capacitors, with an equivalent oxide thickness (EOT) of 10.9Å,…”
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Gate-first inversion-type InP metal-oxide-semiconductor field-effect transistors with atomic-layer-deposited Al2O3 gate dielectric
Published in Applied physics letters (09-06-2008)“…We present n-channel enhancement-mode inversion-type indium phosphide (InP) metal-oxide-semiconductor field-effect transistors with atomic-layer-deposited…”
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Gate oxide scaling down in HfO2–GaAs metal-oxide-semiconductor capacitor using germanium interfacial passivation layer
Published in Applied physics letters (23-07-2007)“…The primary goal of this work is to investigate the capability of gate oxide scaling down in HfO2-based GaAs metal-oxide-semiconductor capacitor (MOSCAP) using…”
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Metal Gate-HfO2 MOS structures on GaAs substrate with and without Si interlayer
Published in IEEE electron device letters (01-03-2006)Get full text
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A study of metal-oxide-semiconductor capacitors on GaAs, In0.53Ga0.47As, InAs, and InSb substrates using a germanium interfacial passivation layer
Published in Applied physics letters (11-08-2008)“…In this letter, we present electrical characteristics of HfO2-based metal-oxide-semiconductor capacitors (MOSCAPs) on n- and p-type GaAs, In0.53Ga0.47As, InAs,…”
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14
Extraordinarily Long-Term PosttraumaticCerebrospinal Fluid Fistula
Published in Journal of Korean Neurosurgical Society (01-11-2007)“…Most posttraumatic cerebrospinal fluid (CSF) leakage is noticed by the patients with the first symptom, rhinorrhea. A 38-year-old woman presented with frequent…”
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Flatband voltage instability characteristics of HfO2-based GaAs metal-oxide-semiconductor capacitors with a thin Ge layer
Published in Applied physics letters (10-03-2008)“…This work investigates the flatband voltage instability of HfO2-based GaAs metal-oxide-semiconductor (MOS) capacitor with a thin germanium (Ge) interfacial…”
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Highly reliable polysilicon oxide grown by electron cyclotron resonance nitrous oxide plasma
Published in IEEE electron device letters (01-10-1997)“…Highly reliable inter-polysilicon oxide (polyoxide) for nonvolatile memory applications has been achieved using electron cyclotron resonance (ECR) N/sub…”
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Metal-oxide-semiconductor capacitors on GaAs with germanium nitride passivation layer
Published in Applied physics letters (22-10-2007)“…We present gallium arsenide (GaAs) metal-oxide-semiconductor capacitors (MOSCAPs) with a thin Hf O 2 gate dielectric and a thin germanium nitride ( Ge x N y )…”
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Chip package interaction in micro bump and TSV structure
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01-05-2012)“…The purpose of this paper is chip package interaction(CPI) of fine pitch micro bump and trough silicon via(TSV). We focus on hot temperature storage(HTS) and…”
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Conference Proceeding -
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The formation of Ti-polycide gate structure with high thermal stability using chemical-mechanical polishing (CMP) planarization technology
Published in IEEE electron device letters (01-02-1999)“…A planarized Ti-polycide gate structure with high thermal stability has been developed using a chemical-mechanical polishing (CMP) process for the application…”
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