Search Results - "Hwang, Taejoo"
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Single‐cell RNA Sequencing Reveals Novel Cellular Factors for Response to Immunosuppressive Therapy in Aplastic Anemia
Published in HemaSphere (01-11-2023)“…Aplastic anemia (AA) is a lethal hematological disorder; however, its pathogenesis is not fully understood. Although immunosuppressive therapy (IST) is a major…”
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Journal Article -
2
Cellular plasticity and immune microenvironment of malignant pleural effusion are associated with EGFR-TKI resistance in non–small-cell lung carcinoma
Published in iScience (18-11-2022)“…Malignant pleural effusion (MPE) is a complication of lung cancer that can be used as an alternative method for tissue sampling because it is generally simple…”
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Journal Article -
3
Study of Advanced Fan-Out Packages for Mobile Applications
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01-05-2018)“…As artificial intelligence technologies has been rapidly applied for mobile devices, the demand is increasing to improve the performance of neural network…”
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Conference Proceeding -
4
Experimental systems for the analysis of mutational signatures: no 'one-size-fits-all' solution
Published in Biochemical Society transactions (28-06-2023)“…Cells constantly accumulate mutations, which are caused by replication errors, as well as through the action of endogenous and exogenous DNA-damaging agents…”
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Journal Article -
5
ATAD5 restricts R-loop formation through PCNA unloading and RNA helicase maintenance at the replication fork
Published in Nucleic acids research (27-07-2020)“…Abstract R-loops are formed when replicative forks collide with the transcriptional machinery and can cause genomic instability. However, it is unclear how…”
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Journal Article -
6
Impaired binding affinity of YTHDC1 with METTL3/METTL14 results in R-loop accumulation in myelodysplastic neoplasms with DDX41 mutation
Published in Leukemia (01-06-2024)“…DEAD box helicase 41 (DDX41) mutations are the most prevalent predisposition to familial myelodysplastic syndrome (MDS). However, the precise roles of these…”
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Journal Article -
7
The Future of Advanced Package Solutions
Published in 2019 Symposium on VLSI Technology (01-06-2019)“…As the 4th industry revolution emerges into the semiconductor industry, high computing power and high data bandwidth are required for semiconductor devices…”
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Conference Proceeding -
8
Defining the mutation signatures of DNA polymerase θ in cancer genomes
Published in NAR cancer (01-09-2020)“…DNA polymerase theta (POLQ)-mediated end joining (TMEJ) is a distinct pathway for mediating DNA double-strand break (DSB) repair. TMEJ is required for the…”
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Journal Article -
9
Single‐cell RNA Sequencing Reveals Novel Cellular Factors for Response to Immunosuppressive Therapy in Aplastic Anemia
Published in HemaSphere (01-11-2023)“…Aplastic anemia (AA) is a lethal hematological disorder; however, its pathogenesis is not fully understood. Although immunosuppressive therapy (IST) is a major…”
Get full text
Journal Article -
10
Power Integrity Performance Gain of a Novel Integrated Stack Capacitor (ISC) Solution for High-end Computing Applications
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01-06-2020)“…An integrated stack capacitor (ISC) solution, which can effectively suppress power noise in high frequency bands, is introduced. The basic structure of the ISC…”
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Conference Proceeding -
11
Low temperature wafer scale MEMS packaging and intrapackage humidity monitoring
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Dissertation -
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The Thermal Dissipation Characteristics of The Novel System-In-Package Technology (ICE-SiP) for Mobile and 3D High-end Packages
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01-05-2019)“…As information technologies evolve with the 4th industry revolution, such as artificial intelligence and 5G mobile communication, much more computing power and…”
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Conference Proceeding -
13
Low temperature wafer scale MEMS packaging and intrapackage humidity monitoring
Published 01-01-2004“…As Micro-Electro-Mechanical Systems technology is increasingly adopted into commercial products, packaging of MEMS is becoming more important for performance…”
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Dissertation -
14
High-performance Substrate Design for DRAM Flip-chip Interconnection using Etch-back Process
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01-05-2007)“…To apply an Au-stud bumping, which has the merit of being a supportable fine pad/bump pitch comparable to that of conventional wire-bonding, in the…”
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Conference Proceeding