Search Results - "Hwang, Tae Kyung"

Experimental and analytical approach for the size effect on the fiber strength of CFRP by Hwang, Tae-Kyung, Kim, Hyoung-Geun

“…In this article, experimental test and an analytical approach were conducted to verify the fiber tensile strength of filament wound pressure vessel. As a test…”
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Composite damage model based on continuum damage mechanics and low velocity impact analysis of composite plates by Kim, Eun-Ho, Rim, Mi-Sun, Lee, In, Hwang, Tae-Kyung

“…A composite damage model based on continuum damage mechanics (CDMs) is proposed for the progressive damage analysis of a composite structure. The damage…”
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Evaluation of fiber material properties in filament-wound composite pressure vessels by Hwang, Tae-Kyung, Park, Jae-Beom, Kim, Hyoung-Geun

“…Fiber material properties are the most important factors from among various material properties for the design of composite pressure vessels because of their…”
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Damage evaluation and strain monitoring of composite plates using metal-coated FBG sensors under quasi-static indentation by Kim, Sang-Woo, Cha, Myung-Chan, Lee, In, Kim, Eun-Ho, Kwon, Il-Bum, Hwang, Tae-Kyung

“…Metal-coated optical fiber sensors (MCOFSs) have a memory effect due to the elasto-plastic characteristics of the metal coating. Our study is first…”
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Probiotic Feed Additives Mitigate Odor Emission in Cattle Farms through Microbial Community Changes by Park, Min-Kyu, Hwang, Tae-Kyung, Kim, Wanro, Jo, YoungJae, Park, Yeong-Jun, Kim, Min-Chul, Son, HyunWoo, Seo, DaeWeon, Shin, Jae-Ho

“…Odor emissions from animal manure present a significant environmental challenge in livestock farming, impacting air quality and farm sustainability…”
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Seasonal and regional variations of atmospheric ammonia across the South Korean Peninsula by Park, Taehyun, Singh, Rahul, Ban, Jihee, Kim, Kyunghoon, Park, Gyutae, Kang, Seokwon, Choi, Siyoung, Song, Jeongin, Yu, Dong-Gil, Bae, Min-Suk, Ahn, Junyoung, Jung, Hae-Jin, Lim, Yong-Jae, Kim, Hyun Woong, Hwang, Tae Kyung, Choi, Yu Jin, Kim, Soo-Young, Kim, Hyo Seon, Chang, Yu Woon, Shin, Hye Jung, Lim, Yunsung, Lee, Jongtae, Park, Jinsoo, Choi, Jinsoo, Lee, Taehyoung

“…This study aimed to identify the factors causing NH 3 emissions in the South Korean Peninsula and West Sea region. To analyze the trends of NH 3 and other air…”
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Determination of the maximum strains experienced by composite structures using metal coated optical fiber sensors by Kim, Sang-Woo, Jeong, Min-Soo, Lee, In, Kim, Eun-Ho, Kwon, Il-Bum, Hwang, Tae-Kyung

“…A determination technique for the maximum strains experienced by composites is proposed using the permanent deformation characteristics of elasto-plastic…”
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Prediction of onset and propagation of damage in the adhesive joining of a dome-separated composite pressure vessel including temperature effects by Im, Jae-Moon, Kang, Seung-Gu, Shin, Kwang-Bok, Hwang, Tae-Kyung

“…In this study, a Cohesive Zone Model (CZM) was used to predict the progressive failure behavior of adhesive joining of a domeseparated composite pressure…”
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Effects of mechanical and geometric properties of adhesive layer on performance of metal-coated optical fiber sensors by Kim, Sang-Woo, Jeong, Min-Soo, Lee, In, Kwon, Il-Bum, Hwang, Tae-Kyung

“…The concept underlying metal-coated optical fiber sensors (MCOFSs) is to evaluate the maximum strains previously experienced by host structures from the…”
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Temperature effect on the flexural deformation and strength of carbon fiber-reinforced plastic laminate by Hwang, Tae-Kyung, Park, Jae-Beom, Kim, Hyoung-Geun

“…Tests and numerical analysis were conducted to evaluate the flexural deformation and strength of laminated carbon fiber-reinforced plastic under high…”
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Probabilistic deformation and strength prediction for a filament wound pressure vessel by Hwang, Tae-Kyung, Hong, Chang-Sun, Kim, Chun-Gon

“…In this study; probabilistic analysis and experimental tests are conducted to predict the probabilistic deformation and strength of composite pressure vessels…”
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A study on coining processes of solder bumps on organic substrates by Nah, Jae-Woong, Paik, Kyung Wook, Hwang, Tae-Kyung, Kim, Won-Hoe

“…Solder flip chip bumping and subsequent coining processes on printed circuit board (PCB) were investigated to solve the warpage problem of organic substrates…”
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Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level Underfill by Joon-Yeob Lee, Tae-Kyung Hwang, Jin-Young Kim, Min Yoo, Eun-Sook Sohn, Ji-Young Chung, Dreiza, M.

“…In spite of a great success of stacked package (PoP) in the market, some reliability issues have been raised. One of them is a board level reliability…”
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Size effect on the fiber strength of composite pressure vessels by Hwang, Tae-Kyung, Hong, Chang-Sun, Kim, Chun-Gon

“…In this study, experimental tests and an analytical approach are conducted to verify the size effect on the fiber strength of a composite pressure vessel. As…”
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Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents by Kang, S.K., Lauro, P., Da-Yuan Shih, Henderson, D.W., Gosselin, T., Bartelo, J., Cain, S.R., Goldsmith, C., Puttlitz, K.J., Tae-Kyung Hwang

“…The electronic industry is making substantial progress toward a full transition to Pb-free soldering in the near future. At present, the leading candidate…”
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Heterogeneity in the health effects of PM2.5 sources across the major metropolitan cities, South Korea: Significance of region-specific management by Kim, Sangcheol, Yi, Seung-Muk, Kim, Ho, Park, Seung-Myung, Hwang, Tae Kyung, Jung, Sun-A, Kim, Hyoseon, Jeon, Kwonho, Hopke, Philip K., Koutrakis, Petros, Park, Jieun

“…Ambient PM2.5, well-known for its adverse impacts on human health, is a very heterogeneous pollutant. Its chemical composition and attributable sources vary by…”
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Board level reliability assessments of thru-mold via package on package (TMV™ PoP) by Tae-Kyung Hwang, Dong-Joo Park, Jin-Seong Kim, Jae-Dong Kim, Choon-Heung Lee

“…In recent years, package-on-package (PoP) has been adopted as major application package platform in 3D integration of logic and memory devices. However, as…”
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Board level reliability assessments of package on package by Hwang, Tae-Kyung, Sohn, Eun-Sook, Kang, Won-Joon, Cha, Se-Woong, Lee, Joon-Yeob, Hwang, Chan-Ha, Lee, Choon-Heung

“…In spite of a great success of stacked package (PoP) in the market, some reliability issues about package on package (PoP) have been raised by several…”
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A study on the thermal deformation of ACF assemblies using moire interferometry and FEM by Tae-Kyung Hwang, Suk-Jin Ham, Soon-Bok Lee

“…The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is a major…”
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Numerical analysis of the formation of coined solder bumps by Tae-Kyung Hwang, Soon-Bok Lee, Jae-Woong Nah, Kyung-Wook Paik

“…In this study, two solder materials, Sn-37Pb and Sn-3.5Ag, were tested and numerically analyzed for the solder bumps coining process. This process has an…”
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