Search Results - "Hwang, Kihyun"
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Electrical characteristics of SiO2/ZrO2 hybrid tunnel barrier for charge trap flash memory
Published in Japanese Journal of Applied Physics (01-08-2017)“…In this paper, we investigate the electrical characteristics of SiO2/ZrO2 hybrid tunnel oxide in metal-Al2O3-SiO2-Si3N4-SiO2-silicon (MAONOS) structure in an…”
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Ge surface-energy-driven secondary grain growth via two-step annealing
Published in Thin solid films (28-11-2014)“…A two-step annealing method with a low thermal budget is proposed for advanced surface-energy-driven secondary grain growth of Ge films without any…”
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Hole trap effect on time-dependent-dielectric breakdown (TDDB) of high-voltage peripheral nMOSFETs in flash memory application
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01-04-2017)“…In this work, the TDDB mechanism in high-voltage nMOSFETs with high-density of pre-existing defects in the gate oxide is investigated. In contrast to the…”
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Conference Proceeding -
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Advanced Si solid phase crystallization for vertical channel in vertical NANDs
Published in APL materials (01-07-2014)“…The advanced solid phase crystallization (SPC) method using the SiGe/Si bi-layer structure is proposed to obtain high-mobility poly-Si thin-film transistors in…”
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Investigation of ultra thin polycrystalline silicon channel for vertical NAND flash
Published in 2011 International Reliability Physics Symposium (01-04-2011)“…We have investigated thin film transistors (TFTs) with ultra-thin polycrystalline silicon (poly-Si) of 77 Å - 185 Å. The TFT charge transfer characteristics…”
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Conference Proceeding -
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Cu Microstructure of High Density Cu Hybrid Bonding Interconnection
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01-05-2019)“…The scaling of semiconductor device below 10nm has faced the higher process difficulty and longer development periods. Three-dimensional integrated circuits…”
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Conference Proceeding -
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Origins of wear-induced tungsten corrosion defects in semiconductor manufacturing during tungsten chemical mechanical polishing
Published in Applied surface science (01-10-2022)“…[Display omitted] •W contact plugs in CMOS IC wafers have been found to undergo corrosion.•Mismatch in the CMP processing times results in extended DI rinsing…”
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Effect of Millisecond Annealing Temperature of Ni1-xPtx Si Formation on Leakage Current Characteristics of Static Random- Access Memory Cells
Published in IEEE transactions on electron devices (01-01-2019)“…The importance of optimizing the millisecond annealing (MSA) temperature for Pt-doped NiSi (<inline-formula> <tex-math notation="LaTeX">{\mathrm…”
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Effect of Millisecond Annealing Temperature of Ni1- x Pt x Si Formation on Leakage Current Characteristics of Static Random- Access Memory Cells
Published in IEEE transactions on electron devices (01-01-2019)“…The importance of optimizing the millisecond annealing (MSA) temperature for Pt-doped NiSi ([Formula Omitted]Pt x Si) contact formation was highlighted by…”
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Electrical characteristics of SiO 2 /ZrO 2 hybrid tunnel barrier for charge trap flash memory
Published in Japanese Journal of Applied Physics (01-08-2017)Get full text
Journal Article -
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Electrical characteristics of SiO^sub 2^/ZrO^sub 2^ hybrid tunnel barrier for charge trap flash memory
Published in Japanese Journal of Applied Physics (01-08-2017)“…In this paper, we investigate the electrical characteristics of SiO2/ZrO2 hybrid tunnel oxide in metal–Al2O3–SiO2–Si3N4–SiO2–silicon (MAONOS) structure in an…”
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Journal Article -
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Pt-doped Ni-silicide films formed by pulsed-laser annealing: Microstructural evolution and thermally robust Ni1-xPtxSi2 formation
Published in Journal of alloys and compounds (05-06-2019)“…Pulsed-laser annealing (PLA) was performed on a preformed Pt-doped Ni-rich silicide film (Ni2Si phase), and its microstructural and phase evolution were…”
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Acceptor-like trap effect on negative-bias temperature instability (NBTI) of SiGe pMOSFETs on SRB
Published in 2016 IEEE International Electron Devices Meeting (IEDM) (01-12-2016)“…In this work, the oxide electric field (Eox) reduction caused by negatively charged traps is proposed to explain the robustness of SiGe pMOSFETs to negative…”
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Conference Proceeding -
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Embedded STT-MRAM in 28-nm FDSOI Logic Process for Industrial MCU/IoT Application
Published in 2018 IEEE Symposium on VLSI Technology (01-06-2018)“…We demonstrate, for the first time, 28-nm embedded STT-MRAM operating at full industrial temperature range (-40~125°C) with >1E+6 endurance and >10 year…”
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Conference Proceeding -
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Lamellar-structured Ni-silicide film formed by eutectic solidification
Published in Journal of alloys and compounds (15-01-2019)“…Pt-doped NiSi‒NiSi2 thin films in a uniform lamellar structure with a periodicity on the scale of a few tens of nanometers were formed on Si(001) substrates…”
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Observation of heterostructure epitaxy of Pt-doped Ni-monosilicide on Si(001)
Published in Microelectronic engineering (15-01-2019)“…The objective of this study was to determine detailed microstructure of a Ni1–xPtxSi film formed via a melting/quenching process using high temperature laser…”
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Analysis of trap distribution in polysilicon channel transistors using the variable amplitude charge pumping method
Published in Solid-state electronics (01-02-2015)“…•Proposing a novel method to determine the trap distribution in poly-Si channel MOSFETs.•Demonstrating the validity of the method using MOSFETs with various…”
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A 1280×960 Dynamic Vision Sensor with a 4.95-μm Pixel Pitch and Motion Artifact Minimization
Published in 2020 IEEE International Symposium on Circuits and Systems (ISCAS) (01-10-2020)“…This paper reports a 1280×960 DVS. A 4.95-μm pixel pitch is achieved with in-pixel Cu-Cu connection and the newly designed GIDL-suppression scheme. A…”
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Conference Proceeding -
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Highly-reliable NAND flash memory using Al2O3-inserted inter-poly dielectric
Published in 2010 IEEE International Memory Workshop (01-05-2010)“…The improvement of device performances has been achieved successfully through OAO IPD EOT scaling, which shows that OAO IPD is applicable to sub-40nm devices…”
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Conference Proceeding