Search Results - "Hwang, Bohee"

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  1. 1

    Hybrid Organic-Inorganic Perovskite Memory with Long-Term Stability in Air by Hwang, Bohee, Lee, Jang-Sik

    Published in Scientific reports (06-04-2017)
    “…Organic-inorganic perovskite materials have attracted extensive attention for wide range of applications such as solar cells, photo detectors, and memory…”
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    Journal Article
  2. 2

    Effect of halide-mixing on the switching behaviors of organic-inorganic hybrid perovskite memory by Hwang, Bohee, Gu, Chungwan, Lee, Donghwa, Lee, Jang-Sik

    Published in Scientific reports (08-03-2017)
    “…Mixed halide perovskite materials are actively researched for solar cells with high efficiency. Their hysteresis which originates from the movement of defects…”
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    Journal Article
  3. 3

    A Strategy to Design High‐Density Nanoscale Devices utilizing Vapor Deposition of Metal Halide Perovskite Materials by Hwang, Bohee, Lee, Jang‐Sik

    Published in Advanced materials (Weinheim) (01-08-2017)
    “…The demand for high memory density has increased due to increasing needs of information storage, such as big data processing and the Internet of Things…”
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    Journal Article
  4. 4

    Impact of Grain Sizes on Programmable Memory Characteristics in Two-Dimensional Organic–Inorganic Hybrid Perovskite Memory by Lee, Dongwoo, Hwang, Bohee, Lee, Jang-Sik

    Published in ACS applied materials & interfaces (05-06-2019)
    “…Recently, organic–inorganic hybrid perovskites (OIHPs) have been used in resistive switching memory applications because of current–voltage hysteresis that…”
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    Journal Article
  5. 5

    Recent Advances in Memory Devices with Hybrid Materials by Hwang, Bohee, Lee, Jang‐Sik

    Published in Advanced electronic materials (01-01-2019)
    “…Increasing demands for information‐storage capacity and for miniaturization of memory cells have driven exploration of new‐generation data storage devices,…”
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    Journal Article
  6. 6

    2D Perovskite‐Based Self‐Aligned Lateral Heterostructure Photodetectors Utilizing Vapor Deposition by Hwang, Bohee, Lee, Jang‐Sik

    Published in Advanced optical materials (01-02-2019)
    “…2D organic–inorganic hybrid perovskites (OIPs) hold great promise for electronics and optoelectronics due to structural diversity, high photoluminescence, and…”
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    Journal Article
  7. 7

    Metal Halide Perovskites: A Strategy to Design High‐Density Nanoscale Devices utilizing Vapor Deposition of Metal Halide Perovskite Materials (Adv. Mater. 29/2017) by Hwang, Bohee, Lee, Jang‐Sik

    Published in Advanced materials (Weinheim) (01-08-2017)
    “…In article number 1701048, Jang‐Sik Lee and Bohee Hwang report an approach for designing high density memory devices utilizing organolead halide perovskite…”
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    Journal Article
  8. 8

    Control of Gold Nanoparticle–Protein Aggregates in Albumen Matrix for Configurable Switching Devices by Kim, Sung‐Jo, Hwang, Bohee, Lee, Jang‐Sik

    Published in Advanced materials interfaces (09-05-2018)
    “…Protein–nanoparticle (P–NP) interactions are of great importance in the biomedical applications, and are extensively studied for biotechnology and biomedicine…”
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    Journal Article
  9. 9

    A Study on the Surface Activation of Cu and Oxide for Hybrid Bonding Joint Interface by Hwang, Bohee, Kim, Sanwi, Lee, Jeonghwan, Lee, Soohwan, Jee, Youngkun, Park, Sangcheon, Jo, Gyeongjae, Kim, Kwangbae, Han, Sungjin, Kim, Ilhwan, Park, Jumyong, Jung, Hyunchul, Kang, Dongwoo, Kang, Un-Byoung

    “…Hybrid copper bonding technology (HCB) has been developed to reduce the joint gap of stacked chips to the limit for miniaturization of I/O pitch and high heat…”
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    Conference Proceeding
  10. 10

    A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology by Lee, Sanghoon, Jee, Youngkun, Park, Sangcheon, Lee, Soohwan, Hwang, Bohee, Jo, Gyeongjae, Lee, Chungsun, Park, Jumyong, Jang, Aeni, Jung, HyunChul, Kim, Ilhwan, Kang, Dongwoo, Baek, Seungduk, Kim, Dae-Woo, Kang, Unbyung

    “…Hybrid copper bonding (HCB) technology has been introduced and evaluated to overcome a fine pitch limit and degradation in thermal properties in 3D…”
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    Conference Proceeding