Search Results - "Huis in‘t Veld, A. J"

Laser-Induced Nanoscale Superhydrophobic Structures on Metal Surfaces by Jagdheesh, R, Pathiraj, B, Karatay, E, Römer, G. R. B. E, Huis in‘t Veld, A. J

“…The combination of a dual-scale (nano and micro) roughness with an inherent low-surface energy coating material is an essential factor for the development of…”
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On the surface topography of ultrashort laser pulse treated steel surfaces by Vincenc Obona, J., Ocelík, V., Skolski, J.Z.P., Mitko, V.S., Römer, G.R.B.E., Huis in’t Veld, A.J., De Hosson, J.Th.M.

“…► Influence of ultrashort pulsed laser–matter interaction on formation of small and big ripples is discussed. ► Small ripples lying between big ones are formed…”
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On the formation of laser induced self-organizing nanostructures by Römer, G.R.B.E., Huis in’t Veld, A.J., Meijer, J., Groenendijk, M.N.W.

“…Laser induced self-organizing rippled nanostructures on steel are formed by femtosecond laser pulses. They are applied as hydrophobic surfaces. A low fluence…”
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Annealing of SnO₂ thin films by ultra-short laser pulses by Scorticati, D, Illiberi, A, Bor, T, Eijt, S W H, Schut, H, Römer, G R B E, de Lange, D F, in 't Veld, A J Huis

“…Post-deposition annealing by ultra-short laser pulses can modify the optical properties of SnO₂ thin films by means of thermal processing. Industrial grade…”
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Two-photon-induced internal modification of silicon by erbium-doped fiber laser by Verburg, P C, Römer, G R B E, Huis In 't Veld, A J

“…Three-dimensional bulk modification of dielectric materials by multiphoton absorption of laser pulses is a well-established technology. The use of multiphoton…”
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Interfacial fatigue stress in PVD TiN coated tool steels under rolling contact fatigue conditions by Carvalho, N.J.M, Huis in 't Veld, A.J, De Hosson, J.Th

“…Titanium–nitrogen (TiN) films were Physical Vapour Deposited (PVD) on tool steel substrates with different hardness and surface roughness, in a Bai 640R unit…”
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Crystal structure of laser-induced subsurface modifications in Si by Verburg, P. C., Smillie, L. A., Römer, G. R. B. E., Haberl, B., Bradby, J. E., Williams, J. S., Huis in ’t Veld, A. J.

“…Laser-induced subsurface modification of dielectric materials is a well-known technology. Applications include the production of optical components and…”
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Modification of Cu surface with picosecond laser pulses by VINCENC OBONA, J, OCELIK, V, RAO, J. C, SKOLSKI, J. Z. P, RÖMER, G. R. B. E, HUIS IN 'T VELD, A. J, DE HOSSON, J. Th. M

“…High purity, mirror-polished polycrystalline Cu surface was treated with single picosecond laser pulses at fluence levels close to the single-pulse…”
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Determination of irradiation parameters for laser-induced periodic surface structures by Eichstädt, J., Römer, G.R.B.E., Huis in ‘t Veld, A.J.

“…► We present an approach for the determination of irradiation parameters for laser-induced periodic surface structures. ► The approach is based on accumulated…”
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Two-temperature model for pulsed-laser-induced subsurface modifications in Si by Verburg, P. C., Römer, G. R. B. E., Huis in ’t Veld, A. J.

“…We investigated the laser–material interaction during the production of laser-induced subsurface modifications in silicon with a numerical model. Such…”
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Large area laser surface micro/nanopatterning by contact microsphere lens arrays by Sedao, X., Derrien, T. J.-Y., Romer, G. R. B. E., Pathiraj, B., Huis in ‘t Veld, A. J.

“…Laser surface micro/nanopatterning by particle lens arrays is a well-known technique. Enhanced optical fields can be achieved on a substrate when a laser beam…”
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Material transfer of POM in sliding contact by Mergler, Y.J., Schaake, R.P., Huis in’t Veld, A.J.

“…Material transfer is an important factor in the sliding behaviour of polymers, as it governs the development of friction and wear in the course of time…”
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On the formation of laser induced elf-organizing nanostructures by RÖMER, G. R. B. E, HUIS IN'T VELD, A. J, MEIJER, J, GROENENDIJK, M. N. W

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Novel approaches for low-cost Through-Silicon Vias by Bullema, J. E., Bressers, P. M. M. C., Oosterhuis, G., Mueller, M., Huis in't Veld, A. J., Roozeboom, F.

“…3D stacking of integrated circuits is an emerging packaging technology to enable a high degree of functional integration and miniaturization. Footprint…”
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