Search Results - "Huang, Jay C. Y."

Integration of four-phase QFD and TRIZ in product R&D: a notebook case study by Yeh, C. H., Huang, Jay C. Y., Yu, C. K.

“…Worldwide demand for notebook computers has outstripped that for desktop computers. Today, notebook computer design and manufacturing is one of the most…”
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Reducing Solder Paste Inspection in Surface-Mount Assembly Through Mahalanobis-Taguchi Analysis by Huang, J C Y

“…Increased functional density and reduced input/output (I/O) spacing are the market trends in the electronics manufacturing industry. Industry reports indicate…”
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Reliability assessment for the PoP lead free solder joint through temperature cycling test by Yang, Jimmy, Huang, Jay C Y, Li, K C, Ku, J L, Lee, A

“…Trends in the packaging of semiconductors are towards miniaturization and high functionality. The package-on-package (PoP) with increasing demands is…”
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Stencil evaluation of ultra fine pitch solder paste printing process by Yang, Jimmy, Huang, Jay C Y, Lee, Vincent, Tsai, Jojo, Ku, J L, Li, K C, Hsieh, Ander, Cheng Yu Chen

“…For the ultra fine pitch applications, solder paste printing acts as one of the most critical step in the SMT assembly process. A review of literature…”
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