Search Results - "Hu, Chenming Calvin"
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Gate Recessed Quasi-Normally OFF Al2O3/AlGaN/GaN MIS-HEMT With Low Threshold Voltage Hysteresis Using PEALD AlN Interfacial Passivation Layer
Published in IEEE electron device letters (01-07-2014)“…In this letter, a gate recessed normally OFF AlGaN/GaN MIS-HEMT with low threshold voltage hysteresis using Al 2 O 3 /AlN stack gate insulator is presented…”
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BSIM-SPICE Models Enable FinFET and UTB IC Designs
Published in IEEE access (2013)“…Two turn-key surface potential-based compact models are developed to simulate multigate transistors for integrated circuit (IC) designs. The BSIM-CMG…”
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Impact of AlN Interfacial Dipole on Effective Work Function of Ni and Band Alignment of Ni/HfO2/In0.53Ga0.47As Gate-Stack
Published in IEEE transactions on electron devices (01-12-2015)“…AlN has successfully been applied to passivate the oxide/III-V interface; however, it changes both the metal work function (WF) and band alignment of the…”
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Investigation of Multilayer TiNi Alloys as the Gate Metal for nMOS In0.53Ga0.47As
Published in IEEE transactions on electron devices (01-12-2016)“…To achieve low power consumption for CMOS devices, the gate metals must have effective work function (EWF) aligned with the band edges of the channel material…”
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BSIM-IMG: A Compact Model for Ultrathin-Body SOI MOSFETs With Back-Gate Control
Published in IEEE transactions on electron devices (01-08-2012)“…In this paper, we present an accurate and computationally efficient model for circuit simulation of ultrathin-body silicon-on-insulator MOSFETs with strong…”
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Plasma Enhanced Atomic Layer Deposition Passivated HfO2/AlN/In0.53Ga0.47As MOSCAPs With Sub-Nanometer Equivalent Oxide Thickness and Low Interface Trap Density
Published in IEEE electron device letters (01-12-2015)“…The impact of in situ plasma-enhanced atomic layer deposition passivation on the electrical properties of HfO 2 /In 0.53 Ga 0.47 As metal-oxide-semiconductor…”
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Electrical Characteristics of n, p-In0.53Ga0.47As MOSCAPs With In Situ PEALD-AlN Interfacial Passivation Layer
Published in IEEE transactions on electron devices (01-08-2014)“…The effects of plasma enhanced atomic layer deposition (PEALD)-AlN interfacial passivation layer (IPL) on the Al 2 O 3 /In 0.53 Ga 0.47 As interfaces qualities…”
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Impact of AlN Interfacial Dipole on Effective Work Function of Ni and Band Alignment of Ni/HfO sub(2)/In sub(0.53)Ga sub(0.47)As Gate-Stack
Published in IEEE transactions on electron devices (01-12-2015)“…AlN has successfully been applied to passivate the oxide/III-V interface; however, it changes both the metal work function (WF) and band alignment of the…”
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Journal Article -
9
Investigation of Multilayer TiNi Alloys as the Gate Metal for nMOS In 0.53 Ga 0.47 As
Published in IEEE transactions on electron devices (01-12-2016)Get full text
Journal Article -
10
Effects of In-Situ Plasma-Enhanced Atomic Layer Deposition Treatment on the Performance of HfO2/In0.53Ga0.47As Metal-Oxide-Semiconductor Field-Effect Transistors
Published in IEEE electron device letters (01-08-2016)“…In-situ plasma-enhanced atomic layer deposition (PEALD) technique was employed for device passivation to realize a high-performance inversion-mode HfO 2 /In…”
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11
Phenomenological Compact Model for QM Charge Centroid in Multigate FETs
Published in IEEE transactions on electron devices (01-04-2013)“…We present a phenomenological compact model of the inversion charge centroid considering both the structural and electrical confinements in multigate FETs. The…”
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12
Effects of In-Situ Plasma-Enhanced Atomic Layer Deposition Treatment on the Performance of HfO sub(2)/In sub(0.53)Ga sub(0.47)As Metal-Oxide-Semiconductor Field-Effect Transistors
Published in IEEE electron device letters (01-08-2016)“…In-situ plasma-enhanced atomic layer deposition (PEALD) technique was employed for device passivation to realize a high-performance inversion-mode HfO…”
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Journal Article -
13
Electrical Characteristics of n, p-In sub(0.53)Ga sub(0.47)As MOSCAPs With In Situ PEALD-AlN Interfacial Passivation Layer
Published in IEEE transactions on electron devices (01-08-2014)“…The effects of plasma enhanced atomic layer deposition (PEALD)-AlN interfacial passivation layer (IPL) on the Al sub(2)O sub(3)/In sub(0. 53)Ga sub(0.47)As…”
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Journal Article -
14
Electrical Characteristics of n, p-In 0.53 Ga 0.47 As MOSCAPs With In Situ PEALD-AlN Interfacial Passivation Layer
Published in IEEE transactions on electron devices (01-08-2014)Get full text
Journal Article -
15
BSIM compact MOSFET models for SPICE simulation
Published in Proceedings of the 20th International Conference Mixed Design of Integrated Circuits and Systems - MIXDES 2013 (01-06-2013)“…Continuous technology advancements have forced MOSFET architecture to evolve from bulk to SOI to multigate MOSFETs. BSIM compact models have helped circuit…”
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