Search Results - "Hu, Chenming Calvin"

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  1. 1

    Gate Recessed Quasi-Normally OFF Al2O3/AlGaN/GaN MIS-HEMT With Low Threshold Voltage Hysteresis Using PEALD AlN Interfacial Passivation Layer by Ting-En Hsieh, Chang, Edward Yi, Yi-Zuo Song, Yueh-Chin Lin, Huan-Chung Wang, Shin-Chien Liu, Salahuddin, Sayeef, Hu, Chenming Calvin

    Published in IEEE electron device letters (01-07-2014)
    “…In this letter, a gate recessed normally OFF AlGaN/GaN MIS-HEMT with low threshold voltage hysteresis using Al 2 O 3 /AlN stack gate insulator is presented…”
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    Journal Article
  2. 2

    BSIM-SPICE Models Enable FinFET and UTB IC Designs by Paydavosi, Navid, Venugopalan, Sriramkumar, Chauhan, Yogesh Singh, Duarte, Juan Pablo, Jandhyala, Srivatsava, Niknejad, Ali M., Hu, Chenming Calvin

    Published in IEEE access (2013)
    “…Two turn-key surface potential-based compact models are developed to simulate multigate transistors for integrated circuit (IC) designs. The BSIM-CMG…”
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    Journal Article
  3. 3

    Impact of AlN Interfacial Dipole on Effective Work Function of Ni and Band Alignment of Ni/HfO2/In0.53Ga0.47As Gate-Stack by Huy Binh Do, Quang Ho Luc, Minh Thien Huu Ha, Hu, Chenming Calvin, Yueh Chin Lin, Chang, Edward Yi

    Published in IEEE transactions on electron devices (01-12-2015)
    “…AlN has successfully been applied to passivate the oxide/III-V interface; however, it changes both the metal work function (WF) and band alignment of the…”
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    Journal Article
  4. 4

    Investigation of Multilayer TiNi Alloys as the Gate Metal for nMOS In0.53Ga0.47As by Huy Binh Do, Quang Ho Luc, Minh Thien Huu Ha, Sa Hoang Huynh, Chenming Calvin Hu, Yueh Chin Lin, Yi Chang, Edward

    Published in IEEE transactions on electron devices (01-12-2016)
    “…To achieve low power consumption for CMOS devices, the gate metals must have effective work function (EWF) aligned with the band edges of the channel material…”
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    Journal Article
  5. 5

    BSIM-IMG: A Compact Model for Ultrathin-Body SOI MOSFETs With Back-Gate Control by Khandelwal, S., Chauhan, Y. S., Lu, D. D., Venugopalan, S., Karim, Muhammed Ahosan Ul, Sachid, A. B., Bich-Yen Nguyen, Rozeau, O., Faynot, O., Niknejad, A. M., Hu, C. C.

    Published in IEEE transactions on electron devices (01-08-2012)
    “…In this paper, we present an accurate and computationally efficient model for circuit simulation of ultrathin-body silicon-on-insulator MOSFETs with strong…”
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    Journal Article
  6. 6

    Plasma Enhanced Atomic Layer Deposition Passivated HfO2/AlN/In0.53Ga0.47As MOSCAPs With Sub-Nanometer Equivalent Oxide Thickness and Low Interface Trap Density by Quang Ho Luc, Huy Binh Do, Minh Thien Huu Ha, Hu, Chenming Calvin, Yueh Chin Lin, Chang, Edward Yi

    Published in IEEE electron device letters (01-12-2015)
    “…The impact of in situ plasma-enhanced atomic layer deposition passivation on the electrical properties of HfO 2 /In 0.53 Ga 0.47 As metal-oxide-semiconductor…”
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    Journal Article
  7. 7

    Electrical Characteristics of n, p-In0.53Ga0.47As MOSCAPs With In Situ PEALD-AlN Interfacial Passivation Layer by Quang Ho Luc, Chang, Edward Yi, Hai Dang Trinh, Yueh Chin Lin, Hong Quan Nguyen, Yuen Yee Wong, Huy Binh Do, Salahuddin, Sayeef, Hu, Chenming Calvin

    Published in IEEE transactions on electron devices (01-08-2014)
    “…The effects of plasma enhanced atomic layer deposition (PEALD)-AlN interfacial passivation layer (IPL) on the Al 2 O 3 /In 0.53 Ga 0.47 As interfaces qualities…”
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    Journal Article
  8. 8

    Impact of AlN Interfacial Dipole on Effective Work Function of Ni and Band Alignment of Ni/HfO sub(2)/In sub(0.53)Ga sub(0.47)As Gate-Stack by Do, Huy Binh, Luc, Quang Ho, Ha, Minh Thien Huu, Hu, Chenming Calvin, Lin, Yueh Chin, Chang, Edward Yi

    Published in IEEE transactions on electron devices (01-12-2015)
    “…AlN has successfully been applied to passivate the oxide/III-V interface; however, it changes both the metal work function (WF) and band alignment of the…”
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    Journal Article
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    Effects of In-Situ Plasma-Enhanced Atomic Layer Deposition Treatment on the Performance of HfO2/In0.53Ga0.47As Metal-Oxide-Semiconductor Field-Effect Transistors by Quang Ho Luc, Shou Po Cheng, Po Chun Chang, Huy Binh Do, Jin Han Chen, Minh Thien Huu Ha, Sa Hoang Huynh, Hu, Chenming Calvin, Yueh Chin Lin, Chang, Edward Yi

    Published in IEEE electron device letters (01-08-2016)
    “…In-situ plasma-enhanced atomic layer deposition (PEALD) technique was employed for device passivation to realize a high-performance inversion-mode HfO 2 /In…”
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    Journal Article
  11. 11

    Phenomenological Compact Model for QM Charge Centroid in Multigate FETs by Venugopalan, S., Karim, M. A., Salahuddin, S., Niknejad, A. M., Hu, C. C.

    Published in IEEE transactions on electron devices (01-04-2013)
    “…We present a phenomenological compact model of the inversion charge centroid considering both the structural and electrical confinements in multigate FETs. The…”
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    Journal Article
  12. 12
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    Electrical Characteristics of n, p-In sub(0.53)Ga sub(0.47)As MOSCAPs With In Situ PEALD-AlN Interfacial Passivation Layer by Luc, Quang Ho, Chang, Edward Yi, Trinh, Hai Dang, Lin, Yueh Chin, Nguyen, Hong Quan, Wong, Yuen Yee, Do, Huy Binh, Salahuddin, Sayeef, Hu, Chenming Calvin

    Published in IEEE transactions on electron devices (01-08-2014)
    “…The effects of plasma enhanced atomic layer deposition (PEALD)-AlN interfacial passivation layer (IPL) on the Al sub(2)O sub(3)/In sub(0. 53)Ga sub(0.47)As…”
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    Journal Article
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