Search Results - "Hsieh, Emma"

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  1. 1

    Occlusion-Based Three-Dimensional Craniofacial Anthropometric and Symmetric Evaluation in Preadolescences: A Comparative COHORT Study by Chen, Gloria, Hsieh, Emma Yuh-Jia, Chen, Shih-Heng, Pai, Betty C J, Tsai, Ching-Yen, Wang, Sheng-Wei, Chou, Pang-Yun

    Published in Journal of clinical medicine (30-07-2023)
    “…The importance of early diagnosis of pediatric malocclusion and early intervention has been emphasized. Without use of radiation, 3D imaging holds the…”
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    Journal Article
  2. 2

    Workflow and Strategies for Recruitment and Retention in Longitudinal 3D Craniofacial Imaging Study by Denadai, Rafael, Tu, Junior Chun-Yu, Tsai, Ya-Ru, Tsai, Yi-Ning, Hsieh, Emma Yuh-Jia, Pai, Betty Cj, Chen, Chih-Hao, Kane, Alex, Lo, Lun-Jou, Chou, Pang-Yun

    “…Longitudinal epidemiological studies are considered the gold standard for understanding craniofacial morphologic development, but participant recruitment and…”
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    Journal Article
  3. 3

    Does Hand-Predominance Have a Predominant Influence on Craniofacial Asymmetric and Anthropometric Analysis in Preadolescences? by Chen, Gloria, Tu, Junior Chun-Yu, Chen, Shih-Heng, Hsieh, Emma Yuh-Jia, Pai, Betty C. J, Tsai, Ching-Yen, Chou, Pang-Yun

    Published in Diagnostics (Basel) (23-10-2024)
    “…Background: Although the human body generally exhibits bilateral symmetry, achieving perfect symmetry is exceedingly uncommon. During preadolescent…”
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    Journal Article
  4. 4

    Amelia An Animated Short Film About Giving and Receiving Help by Hsieh, Emma Yun-chieh

    Published 01-01-2018
    “…Amelia is an animated short film that expresses a personal journey of finding the importance of the balance between giving and receiving. "Giving is better…”
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    Dissertation
  5. 5

    A study of chip-last embedded flip-chip package by Chao, Shin-Hua, Tong, Ho-Ming, Hung, Chih-Pin, Lai, Yishao, Liu, Colin, Hsieh, Emma, Luh, Ding-Bang

    “…Flip-chip chip-scale packaging (FCCSP) has recently emerged as a package solution achieving superior performance over traditional wire-bonding technology…”
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    Journal Article
  6. 6

    A study of chip-last embedded FCCSP by Shin-Hua Chao, Chih-Pin Hung, Yishao Lai, Liu, Colin, Hsieh, Emma, Ding-Bang Luh

    “…Flip-Chip Chip-Scale Packaging (FCCSP) has recently emerged as one of mainstream package solutions due to the superior performance & miniaturization over the…”
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    Conference Proceeding