Search Results - "Hsia, L. C."
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Preperiodic points for families of rational maps
Published in Proceedings of the London Mathematical Society (01-02-2015)“…Let X be a smooth curve defined over Q¯, let a,b∈P1(Q¯) and let fλ(x)∈Q¯(x) be an algebraic family of rational maps indexed by all λ∈X(C). We study whether…”
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Determination of Raman Phonon Strain Shift Coefficient of Strained Silicon and Strained SiGe
Published in Japanese Journal of Applied Physics (01-11-2005)“…The use of Raman spectroscopy to characterize strain in strained Si and strained SiGe has been widely accepted. To use Raman spectroscopy for quantitative…”
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Characterization of tetra methyl cyclo tetra siloxanes-based low- k dielectric film
Published in Thin solid films (01-09-2004)“…In this work, chemical vapor deposited low- k films using tetra methyl tetra cyclo siloxanes (TMCTS) precursors were studied. Process parameters studied…”
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Adhesion study of tetra methyl cyclo tetra siloxanes (TMCTS) and tri methyl silane (3MS)-based low- k films
Published in Microelectronic engineering (01-07-2005)“…Chemical vapor deposited (CVD) low- k films using tri methyl silane (3MS) precursors and tetra methyl cyclo tetra siloxanes (TMCTS) precursors were studied…”
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5
Effects of X-ray irradiation on GIDL in MOSFETs
Published in IEEE electron device letters (01-04-1992)“…The effect of X-ray irradiation on the gate-induced drain leakage (GIDL) is shown to be mostly due to the electrostatic effect of the trapped positive charge…”
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Radiation damage effects on bipolar and MOS devices in X-Ray lithography
Published in Journal of electronic materials (01-07-1992)“…Article abstract not available…”
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7
Stress-induced voiding in multi-level copper/low-k interconnects
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)“…Stress-induced voiding phenomenon in vias at different metallization layers was studied in details with stress temperatures ranging from 150/spl deg/C to…”
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Conference Proceeding -
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Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low- k Large-Die Flip Chip Package
Published in IEEE transactions on components and packaging technologies (01-12-2009)“…The trend toward finer pitch and higher performance integrated circuit devices has driven the semiconductor industry to incorporate copper and low-k dielectric…”
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9
Adhesion study of low- k/Si system using 4-point bending and nanoscratch test
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15-08-2005)“…Chemical vapour deposited (CVD) low- k films using tri-methyl-silane (3MS) and tetra-methyl cyclo-tetra-siloxanes (TMCTS) precursors were studied. A 4-point…”
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10
Effects of CO2 and O2 on the property of tetra methyl tetra cyclo siloxanes based low-k film
Published in Thin solid films (24-01-2005)“…In this work, chemical vapor--deposited carbon--doped oxide (CDO) films using tetra methyl cyclo tetra siloxanes (TMCTS) precursors were studied. Process…”
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11
Study of upstream electromigration bimodality and its improvement in Cu low-k interconnects
Published in 2010 IEEE International Reliability Physics Symposium (01-05-2010)“…The bimodality of upstream electromigration (EM) failures in the dual damascene structure of 45 nm Cu interconnection process with low-k material is…”
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Conference Proceeding -
12
Characterization of Mg,Al-hydrotalcite conversion film on Mg alloy and Cl− and CO32- anion-exchangeability of the film in a corrosive environment
Published in Scripta materialia (01-06-2007)Get full text
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13
Effects of O 2 and He on the properties of the trimethyl silane based low-k films
Published in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures (01-05-2004)“…In this work, chemical vapor deposited carbon doped oxide films using trimethyl silane precursors with dielectric constant in the range of 2.75 to 3.62 were…”
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14
Strain relaxation in transistor channels with embedded epitaxial silicon germanium source/drain
Published in Applied physics letters (01-12-2008)“…We report on the channel strain relaxation in transistors with embedded silicon germanium layer selectively grown in source and drain areas on recessed…”
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15
Under-surface observation of thin-film alumina on NiAI(100) with scanning tunneling microscopy
Published in Thin solid films (2012)Get full text
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16
Radiation damage study of bipolar devices in x‐ray lithography
Published in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures (01-11-1989)“…The radiation damage of bipolar transistors has been investigated using the vacuum ultraviolet (VUV) storage ring of the National Synchrotron Light Source at…”
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17
Under-surface observation of thin-film alumina on NiAl(100) with scanning tunneling microscopy
Published in Thin solid films (30-03-2012)“…Scanning tunneling microscopy (STM) was used to investigate the oxide structures underlying the surface of alumina thin-film grown on NiAl(100). At a bias…”
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Auger recombination enhanced hot carrier degradation in nMOSFETs with positive substrate bias
Published in 2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104) (2000)“…Enhanced hot carrier degradation is observed in DTMOS-like operation mode. This phenomenon is attributed to Auger recombination assisted hot electron process…”
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Conference Proceeding -
20
Implant damage and strain relaxation of embedded epitaxial silicon germanium layer on silicon
Published in Applied physics letters (25-06-2007)“…The authors report on the implant damage and strain relaxation in embedded silicon germanium (SiGe) layer, selectively grown on recessed silicon (Si) (001)…”
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