Search Results - "Hsia, L. C."

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  1. 1

    Preperiodic points for families of rational maps by Ghioca, D., Hsia, L.‐C., Tucker, T. J.

    “…Let X be a smooth curve defined over Q¯, let a,b∈P1(Q¯) and let fλ(x)∈Q¯(x) be an algebraic family of rational maps indexed by all λ∈X(C). We study whether…”
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    Journal Article
  2. 2

    Determination of Raman Phonon Strain Shift Coefficient of Strained Silicon and Strained SiGe by Wong, L. H., Wong, C. C., Liu, J. P., Sohn, D. K., Chan, L., Hsia, L. C., Zang, H., Ni, Z. H., Shen, Z. X.

    Published in Japanese Journal of Applied Physics (01-11-2005)
    “…The use of Raman spectroscopy to characterize strain in strained Si and strained SiGe has been widely accepted. To use Raman spectroscopy for quantitative…”
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    Journal Article
  3. 3

    Characterization of tetra methyl cyclo tetra siloxanes-based low- k dielectric film by Widodo, J., Lu, W., Mhaisalkar, S.G., Hsia, L.C., Tan, P.Y., Shen, L., Zeng, K.Y.

    Published in Thin solid films (01-09-2004)
    “…In this work, chemical vapor deposited low- k films using tetra methyl tetra cyclo siloxanes (TMCTS) precursors were studied. Process parameters studied…”
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    Journal Article
  4. 4

    Adhesion study of tetra methyl cyclo tetra siloxanes (TMCTS) and tri methyl silane (3MS)-based low- k films by Widodo, J., Damayanti, M., Mhaisalkar, S.G., Lu, W., Ong, S., Sritharan, T., Zeng, K.Y., Hsia, L.C.

    Published in Microelectronic engineering (01-07-2005)
    “…Chemical vapor deposited (CVD) low- k films using tri methyl silane (3MS) precursors and tetra methyl cyclo tetra siloxanes (TMCTS) precursors were studied…”
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    Journal Article
  5. 5

    Effects of X-ray irradiation on GIDL in MOSFETs by Acovic, A., Hsu, C.C.-H., Hsia, L.-C., Balasinski, A., Ma, T.-P.

    Published in IEEE electron device letters (01-04-1992)
    “…The effect of X-ray irradiation on the gate-induced drain leakage (GIDL) is shown to be mostly due to the electrostatic effect of the trapped positive charge…”
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    Stress-induced voiding in multi-level copper/low-k interconnects by Lim, Y.K., Lim, Y.H., Seet, C.S., Zhang, B.C., Chok, K.L., See, K.H., Lee, T.J., Hsia, L.C., Pey, K.L.

    “…Stress-induced voiding phenomenon in vias at different metallization layers was studied in details with stress temperatures ranging from 150/spl deg/C to…”
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    Conference Proceeding
  8. 8

    Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low- k Large-Die Flip Chip Package by Ong, J.M.G., Tay, A.A.O., Zhang, X., Kripesh, V., Lim, Y.K., Yeo, D., Chan, K.C., Tan, J.B., Hsia, L.C., Sohn, D.K.

    “…The trend toward finer pitch and higher performance integrated circuit devices has driven the semiconductor industry to incorporate copper and low-k dielectric…”
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    Journal Article
  9. 9

    Adhesion study of low- k/Si system using 4-point bending and nanoscratch test by Damayanti, M., Widodo, J., Sritharan, T., Mhaisalkar, S.G., Lu, W., Gan, Z.H., Zeng, K.Y., Hsia, L.C.

    “…Chemical vapour deposited (CVD) low- k films using tri-methyl-silane (3MS) and tetra-methyl cyclo-tetra-siloxanes (TMCTS) precursors were studied. A 4-point…”
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    Journal Article
  10. 10

    Effects of CO2 and O2 on the property of tetra methyl tetra cyclo siloxanes based low-k film by Widodo, J., Lu, W., Mhaisalkar, S.G., Sudijono, J.L., Hsia, L.C., Shen, L., Zeng, K.Y.

    Published in Thin solid films (24-01-2005)
    “…In this work, chemical vapor--deposited carbon--doped oxide (CDO) films using tetra methyl cyclo tetra siloxanes (TMCTS) precursors were studied. Process…”
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    Journal Article
  11. 11

    Study of upstream electromigration bimodality and its improvement in Cu low-k interconnects by Liu, W, Lim, Y K, Zhang, F, Liu, H, Zhao, Y H, Du, A Y, Zhang, B C, Tan, J B, Sohn, D K, Hsia, L C

    “…The bimodality of upstream electromigration (EM) failures in the dual damascene structure of 45 nm Cu interconnection process with low-k material is…”
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    Conference Proceeding
  12. 12
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    Effects of O 2 and He on the properties of the trimethyl silane based low-k films by Widodo, J., Goh, L. N., Lu, W., Mhaisalkar, S. G., Ong, S., Sudijono, J. L., Hsia, L. C., Tan, P. Y., Zeng, K. Y.

    “…In this work, chemical vapor deposited carbon doped oxide films using trimethyl silane precursors with dielectric constant in the range of 2.75 to 3.62 were…”
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    Journal Article
  14. 14

    Strain relaxation in transistor channels with embedded epitaxial silicon germanium source/drain by Liu, J. P., Li, K., Pandey, S. M., Benistant, F. L., See, A., Zhou, M. S., Hsia, L. C., Schampers, Ruud, Klenov, Dmitri O.

    Published in Applied physics letters (01-12-2008)
    “…We report on the channel strain relaxation in transistors with embedded silicon germanium layer selectively grown in source and drain areas on recessed…”
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    Journal Article
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    Radiation damage study of bipolar devices in x‐ray lithography by Hsia, L. C., Magdo, I.

    “…The radiation damage of bipolar transistors has been investigated using the vacuum ultraviolet (VUV) storage ring of the National Synchrotron Light Source at…”
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    Conference Proceeding Journal Article
  17. 17

    Under-surface observation of thin-film alumina on NiAl(100) with scanning tunneling microscopy by Wang, C.T., Lin, C.W., Hsia, C.L., Chang, B.W., Luo, M.F.

    Published in Thin solid films (30-03-2012)
    “…Scanning tunneling microscopy (STM) was used to investigate the oxide structures underlying the surface of alumina thin-film grown on NiAl(100). At a bias…”
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    Auger recombination enhanced hot carrier degradation in nMOSFETs with positive substrate bias by Chiang, L.P., Tsai, C.W., Wang, T., Liu, U.C., Wang, M.C., Hsia, L.C.

    “…Enhanced hot carrier degradation is observed in DTMOS-like operation mode. This phenomenon is attributed to Auger recombination assisted hot electron process…”
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    Conference Proceeding
  20. 20

    Implant damage and strain relaxation of embedded epitaxial silicon germanium layer on silicon by Liu, J. P., Li, J., See, A., Zhou, M. S., Hsia, L. C.

    Published in Applied physics letters (25-06-2007)
    “…The authors report on the implant damage and strain relaxation in embedded silicon germanium (SiGe) layer, selectively grown on recessed silicon (Si) (001)…”
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    Journal Article