Search Results - "Hsia, C.C"

Progressive multifocal leukoencephalopathy during ixazomib-based chemotherapy by Sawicki, C P, Climans, S A, Hsia, C C, Fraser, J A

“…Progressive multifocal leukoencephalopathy (pml) is a rare demyelinating disease of the central nervous system that most often affects immunocompromised…”
Get full text

膵腫瘍ラットにおける In-DTPA Octreotideと In-DOTATOCの生体内分布の比較 by Lin, Y.C, Hung, G.U, Luo, T.Y, Chen, C.H, Hsia, C.C, Chen, S.L, Ho, Y.J, Lin, W.Y

Get full text

A case of transfusion independence in a patient with myelodysplastic syndrome using deferasirox, sustained for two years after stopping therapy by Sanford, D, Hsia, C C

“…Patients with myelodysplastic syndrome (mds) experience clinical complications related to progressive marrow failure and have an increased risk of developing…”
Get full text

Acute myeloid leukemia in a healthy hematopoietic stem cell donor following past exposure to a short course of G-CSF by Hsia, C C, Linenberger, M, Howson-Jan, K, Mangel, J, Chin-Yee, I H, Collins, S, Xenocostas, A

Get full text

Analysis of Cu/Low- k structure under back end of line process by Chiu, C.C., Lee, C.C., Chou, T.L., Hsia, C.C., Chiang, K.N.

“…As the progress of the semiconductor process develops to achieve miniaturization and attain better performances for the electronic device, next-generation IC…”
Get full text

Reliability of interfacial adhesion in a multi-level copper/low- k interconnect structure by Chiu, C.C., Chang, H.H., Lee, C.C., Hsia, C.C., Chiang, K.N.

“…As the electronics industry continues its efforts in miniaturizing the integrated circuit (IC), an IC chip with copper/low- k stacked back end of line (BEoL)…”
Get full text

Molecular and serological aspects of HBsAg-negative hepatitis B virus infections in North America by Hsia, C.C., Scudamore, C.H., Di Bisceglie, A.M., Tabor, E.

“…A few hepatitis B virus (HBV) infections are characterized by the presence of HBV DNA in serum or liver tissue, or both, in the absence of detectable hepatitis…”
Get full text

A novel array-based test methodology for local process variation monitoring by Tseng-Chin Luo, Chao, M.C.-T., Wu, M.S.-Y., Kuo-Tsai Li, Hsia, C.C., Huan-Chi Tseng, Chuen-Uan Huang, Yuan-Yao Chang, Pan, S.C., Young, K.K.-L.

“…As process technologies continually advance, local process variation has greatly increased and gradually become one of the most critical factors for IC…”
Get full text

Integration of hepatitis B virus containing mutations in the core promoter/X gene in patients with hepatocellular carcinoma by Momosaki, S, Hsia, C.C, Nakashima, Y, Kojiro, M, Tabor, E

“…Integration of hepatitis B virus is thought to be an essential step in hepatitis B virus associated hepatocarcinogenesis. Mutations at nucleotides 1762 and…”
Get full text

Analysis and comparison of sleeping posture classification methods using pressure sensitive bed system by Hsia, C.C., Liou, K.J., Aung, A.P.W., Foo, V., Huang, W., Biswas, J.

“…Pressure ulcers are common problems for bedridden patients. Caregivers need to reposition the sleeping posture of a patient every two hours in order to reduce…”
Get full text

A comparison of biodistribution between 111In-DTPA octreotide and 111In-DOTATOC in rats bearing pancreatic tumors by Lin, Y.C.(National Chung Hsing Univ. (Taiwan)), Hung, G.U, Luo, T.Y, Chen, C.H, Hsia, C.C, Chen, S.L, Ho, Y.J, Lin, W.Y

“…111In-DTPA octreotide (DTPAOC) has been used for detecting somatostatin receptor positive tumor for years. In-111 DOTA-Tyr3-octreotide (DOTATOC) is newly…”
Get full text

Analysis of I-129 in radwastes by neutron activation by Chao, J.H., Tseng, C.L., Lee, C.J., Hsia, C.C., Teng, S.P.

“…Determination of 129I activity of low-level waste has become important from the standpoint of radiation safety and environmental concern. The 129I generated…”
Get full text

p53 in malignant and benign liver lesions by Schaff, Zs, Sárosi, I., Hsia, C.C., Kiss, A., Tabor, E.

“…p53 expression was studied by immunohistochemical methods in benign and malignant human epithelial liver lesions in 46 patients from Hungary. Positive…”
Get full text

Numerical modeling and characterization of the stress migration behaviour upon various 90 nanometer Cu/Low k interconnects by Huang, T.C., Yao, C.H., Wan, W.K., Hsia, C.C., Liang, M.S.

“…Stress migration (SM) behavior found on various Cu/Low k interconnects is analyzed in this article. The simulation results demonstrate that the minimum…”
Get full text

Evaluation and Numerical Simulation of Optimal Structural Designs for Reliable Packaging of Ultra Low K Process Technology by Huang, T.C., Peng, C.T., Yao, C.H., Huang, C.H., Li, S.Y., Liang, M.S., Wang, Y.C., Wan, W.K., Lin, K.C., Hsia, C.C., Mong-Song Liang

“…The die edge-seals and circuit under fad (CUF) are structurally optimized through 3D finite element analysis (FEA). Die edge-seals having the mechanically…”
Get full text

Plasma damage during dielectric etch in high density plasma etcher by Bing-Yue Tsui, Shyue-Shyh Lin, Chia-Shone Tsai, Hsia, C.C.

“…Plasma process induced damage from a high density plasma dielectric etcher was studied comprehensively. PMOS devices are damaged more readily than NMOS…”
Get full text

Compounding effects of UV exposure, ion bombardment, electron shading and plasma charging in a high density plasma poly etcher by Shyue-Shyh Lin, Bing-Yue Tsui, Chia-Shone Tsai, Hsia, C.C.

“…A complete set of test structures was developed to monitor the compounding effects of UV exposure, ion bombardment, electron shading and plasma charging in a…”
Get full text

BEOL process integration of 65nm Cu/low k interconnects by Jeng, C.C., Wan, W.K., Lin, H.H., Ming-Shuo Liang, Tang, K.H., Kao, I.C., Lo, H.C., Chi, K.S., Huang, T.C., Yao, C.H., Lin, C.C., Lei, M.D., Hsia, C.C., Mong-Song Liang

“…The process development, characterization and performance evaluation of low-k dielectrics to form multi-level Cu interconnects for the 65 nm CMOS technology…”
Get full text

Enhancement of formation of the esophageal carcinogen benzylmethylnitrosamine from its precursors by Candida albicans by Hsia, C.C, Sun, T.T, Wang, Y.Y, Anderson, L.M, Armstrong, D, Good, R.A

“…Previous studies in Linxian, an area of China with a high incidence of esophageal carcinoma, showed that fungal infections are common in the esophageal…”
Get full text

An optimized integration scheme for 0.13 /spl mu/m technology node dual-damascene Cu interconnect by Shyue-Shyh Lin, Chih-Wei Chen, Shien-Ming Huang, Tsung-Kuei Kang, Chen-Nan Yeh, Tsyr-Lih Li, Bing-Yue Tsui, Hsia, C.C.

“…From electrical simulations, the best performance dual damascene Cu/FSG integration scheme has been defined to be via first without etching stop layer and with…”
Get full text