Search Results - "Howe, R.T."

Technologies for Cofabricating MEMS and Electronics by Fedder, Gary K., Howe, Roger T., Liu, Tsu-Jae King, Quevy, Emmanuel P.

“…Microfabrication technologies initially developed for integrated electronics have been successfully applied to batch-fabricate a wide variety of…”
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Microstructure to substrate self-assembly using capillary forces by Srinivasan, U., Liepmann, D., Howe, R.T.

“…We have demonstrated the fluidic self-assembly of micromachined silicon parts onto silicon and quartz substrates in a preconfigured pattern with submicrometer…”
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Thermal budget limits of quarter-micrometer foundry CMOS for post-processing MEMS devices by Takeuchi, H., Wung, A., Xin Sun, Howe, R.T., Tsu-Jae King

“…Thermal budget limits for low stand-by power ( LSP), 0.25 /spl mu/m foundry CMOS devices have been investigated, in order to assess the impact of…”
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A vacuum packaged surface micromachined resonant accelerometer by Seshia, A.A., Palaniapan, M., Roessig, T.A., Howe, R.T., Gooch, R.W., Schimert, T.R., Montague, S.

“…This paper describes the operation of a vacuum packaged resonant accelerometer subjected to static and dynamic acceleration testing. The device response is in…”
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An integrated CMOS micromechanical resonator high-Q oscillator by Nguyen, C.T.-C., Howe, R.T.

“…A completely monolithic high-Q oscillator, fabricated via a combined CMOS plus surface micromachining technology, is described, for which the oscillation…”
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Polycrystalline silicon-germanium films for integrated microsystems by Franke, A.E., Heck, John.M., Tsu-Jae King, Howe, R.T.

“…Two approaches were demonstrated for fabricating microstructures after completion of CMOS circuits with aluminum metallization. The first approach employed…”
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Analytical Modeling of the Suspended-Gate FET and Design Insights for Low-Power Logic by Akarvardar, K., Eggimann, C., Tsamados, D., Singh Chauhan, Y., Wan, G.C., Ionescu, A.M., Howe, R.T., Wong, H.-S.P.

“…An analytical model for the suspended-gate field-effect transistor (SGFET), dedicated to the dc analysis of SGFET logic circuits, is developed. The model is…”
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Electrostatic charge and field sensors based on micromechanical resonators by Riehl, P.S., Scott, K.L., Muller, R.S., Howe, R.T., Yasaitis, J.A.

“…We have developed highly sensitive electrometers and electrostatic fieldmeters (EFMs) that make use of micromechanical variable capacitors. Modulation of the…”
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High-performance inductors using capillary based fluidic self-assembly by Scott, K.L., Hirano, T., Yang, H., Singh, H., Howe, R.T., Niknejad, A.M.

“…In this paper, a batch microfabrication process is presented for creating high aspect ratio, micron-sized helical and toroidal inductors with Q greater than or…”
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Fluidic self-assembly of micromirrors onto microactuators using capillary forces by Srinivasan, U., Helmbrecht, M.A., Rembe, C., Muller, R.S., Howe, R.T.

“…The authors discuss the application of self-assembly techniques for positioning microscopic components onto a substrate in a desired configuration. The basis…”
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Microelectromechanical filters for signal processing by Liwei Lin, Howe, R.T., Pisano, A.P.

“…Microelectromechanical filters based on coupled lateral microresonators are demonstrated. This new class of microelectromechanical systems (MEMS) has potential…”
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Modal Coupling in Micromechanical Vibratory Rate Gyroscopes by Phani, A.S., Seshia, A.A., Palaniapan, M., Howe, R.T., Yasaitis, J.A.

“…The authors present modeling approaches to describe the coupling of modes in a resonant vibratory rate gyroscope. Modal coupling due to off-diagonal stiffness…”
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Fatigue of polycrystalline silicon for microelectromechanical system applications: crack growth and stability under resonant loading conditions by Muhlstein, C.L., Howe, R.T., Ritchie, R.O.

“…Although bulk silicon is not known to exhibit susceptibility to cyclic fatigue, micron-scale structures made from silicon films are known to be vulnerable to…”
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Recent progress toward a manufacturable polycrystalline SiC surface micromachining technology by Di Gao, Wijesundara, M.B.J., Carraro, C., Howe, R.T., Maboudian, R.

“…In this paper, we present results of recent research from our laboratory directed toward a manufacturable SiC surface micromachining technology for…”
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Pulsed-laser annealing, a low-thermal-budget technique for eliminating stress gradient in poly-SiGe MEMS structures by Sedky, S., Howe, R.T., Tsu-Jae King

“…In this paper, we demonstrate eliminating the stress gradient in polycrystalline silicon germanium films at temperatures compatible with standard CMOS (Al…”
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A microfabricated electrochemical oxygen generator for high-density cell culture arrays by Maharbiz, M.M., Holtz, W.J., Sharifzadeh, S., Keasling, J.D., Howe, R.T.

“…We present a silicon microfabricated electrolytic oxygen generator for use in high-density miniature cell culture arrays. The generator consists of Ti/Pt…”
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Fracture of polycrystalline 3C-SiC films in microelectromechanical systems by Di Gao, Carraro, C., Radmilovic, V., Howe, R.T., Maboudian, R.

“…The fracture of polycrystalline SiC films is investigated using a micrometer-sized fracture tester fabricated by micromachining techniques. A series of SiC…”
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Electrostatic Comb Drive Levitation And Control Method by Tang, W.C., Lim, M.G., Howe, R.T.

“…This paper presents the theory, simulation results, and experimental study of the levitating force (normal to the substrate) associated with Interdigitated…”
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Batch transfer of microstructures using flip-chip solder bonding by Singh, A., Horsley, D.A., Cohn, M.B., Pisano, A.P., Howe, R.T.

“…This paper describes a novel method for transfer and assembly of microstructures using sacrificial-layer micromachining and flip-chip bonding. The technique is…”
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An integrated force-balanced capacitive accelerometer for low- g applications by Chau, K.H.-L, Lewis, S.R, Zhao, Y, Howe, R.T, Bart, S.F, Marcheselli, R.G

“…A low-cost monolithic accelerometer which incorporates a surface-micromachined polysilicon sensor with bipolar/MOS interface circuitry on a single chip has…”
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