Search Results - "Houzet, Gregory"
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Modeling and Frequency Performance Analysis of Through Silicon Capacitors in Silicon Interposers
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-04-2017)“…The feasibility of cointegration of new capacitors, named "through silicon capacitors" (TSCs) with "through silicon vias" in silicon interposers has recently…”
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2
Electrical Broadband Characterization Method of Dielectric Molding in 3-D IC and Results
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-09-2014)“…This paper deals with the wideband frequency molding material characterization in three dimensions stack of integrated circuits (3-D IC). This material is…”
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3
Mixed Reality Games
Published in International journal of game-based learning (01-01-2015)“…The authors' research work deals with the development of new game-based learning (gbl) environments. They think that the way of acquiring knowledge during a…”
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4
Fast and robust RF characterization method of insulators used in high speed interconnects networks
Published in 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) (01-05-2018)“…A wide band (1 GHz-67 GHz) characterization method of insulator layers is presented. This method is well suitable for a fast, simple and accurate extraction of…”
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Conference Proceeding -
5
High gain Vivaldi antenna from 26 up to 40GHz for 5G applications
Published in Microwave and optical technology letters (01-07-2022)“…We propose a directive broadband and high gain Vivaldi antenna in the Ka‐band (26–40 GHz) for 5G applications. To increase the gain of this antenna, we use a…”
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6
High gain Vivaldi antenna from 26 up to 40 GHz for 5G applications
Published in Microwave and optical technology letters (01-07-2022)“…We propose a directive broadband and high gain Vivaldi antenna in the Ka‐band (26–40 GHz) for 5G applications. To increase the gain of this antenna, we use a…”
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7
Through Silicon Capacitors (TSC) for noise reduction in Power Distribution Network
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01-05-2015)“…Inspired from Through Silicon Vias (TSVs), Through Silicon Capacitors (TSCs) are newly developed and integrated throughout silicon interposers. Thanks to the…”
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Conference Proceeding -
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High frequency modeling of Through Silicon Capacitors (TSC) architectures in silicon interposer
Published in 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) (01-05-2016)“…The ≪Through Silicon Vias≫ technology, developed for silicon interposer interconnects network, has inspired new capacitors components named ≪Through Silicon…”
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Conference Proceeding -
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Characterization in a Wide Frequency Range (40 MHz-67 GHz) of a KTa0.65Nb0.35O3 Thin Film for Tunable Applications
Published in Integrated ferroelectrics (22-11-2014)“…A (100) oriented KTa 0.65 Nb 0.35 O 3 400 nm-thin film has been deposited by Pulsed Laser Deposition on MgO substrate. Microwave measurements, performed on…”
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10
Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer
Published in 2014 International 3D Systems Integration Conference (3DIC) (01-12-2014)“…Inspired from Through Silicon Vias (TSVs), Through Silicon Capacitors (TSCs) are newly developed capacitors integrated throughout the silicon interposer. This…”
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Conference Proceeding -
11
Omega-Type Balanced Composite Negative Refractive Index Materials
Published in IEEE transactions on antennas and propagation (01-11-2008)“…We report on the theoretical and experimental analysis of Omega-type metamaterials operating in X and Ku-bands. The prototypes are fabricated on the basis of…”
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12
Dispersion and loss of ferroelectric Ba0.5Sr0.5TiO3 thin films up to 110 GHz
Published in Applied physics letters (04-08-2008)“…The frequency dependence of the complex permittivity (ε∗=ε′-jε″) of Ba0.5Sr0.5TiO3 0.3-μm-thick film is measured up to 110 GHz by using interdigitated…”
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13
A 360 degrees BST phase shifter with moderate bias voltage at 30 GHz
Published in IEEE transactions on microwave theory and techniques (01-02-2007)“…Paraelectric BaSrTiO 3 films deposited by sol-gel have been investigated from 1 kHz to 40 GHz using coplanar waveguides, resonators, and inter-digitated…”
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14
A TRL-Like Calibration for Tunable Interdigitated BST Varactors
Published in IEEE transactions on instrumentation and measurement (01-06-2008)“…We report on a de-embedding technique for measuring the reflection coefficients of comblike capacitors patterned on barium-strontium-titanate (BST)…”
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15
Characterization in a Wide Frequency Range (40 MHz-67 GHz) of a KTa sub(0.65)Nb sub(0.35)O sub(3) Thin Film for Tunable Applications
Published in Integrated ferroelectrics (22-11-2014)“…A (100) oriented KTa sub(0.65)Nb sub(0.35)O sub(3) 400 nm-thin film has been deposited by Pulsed Laser Deposition on MgO substrate. Microwave measurements,…”
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16
In-situ characterization up to 100 GHz of insulators used in new 3D “System in Package on board” (SiPoB) technologies
Published in Microelectronics (01-02-2021)“…Insulating materials used for the packaging of integrated circuits play an important role in the electrical performance of the new System-in-Package (SiP),…”
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17
A Low Profile Dual Band Implantable Antenna for Biomedical Applications
Published in 2023 22nd Mediterranean Microwave Symposium (MMS) (30-10-2023)“…In this paper, a miniature double-band structure derived from the first iteration of Hilbert's fractal curve is designed to operate at a depth of 2 mm…”
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Conference Proceeding -
18
Ferroelectric tunable balanced right- and left-handed transmission lines
Published in Applied physics letters (12-01-2009)“…The tuning of the dispersion characteristics of a balanced composite right- and left-handed transmission lines is demonstrated at centimeter and millimeter…”
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19
Dispersion and loss of ferroelectric Ba 0.5 Sr 0.5 TiO 3 thin films up to 110 GHz
Published in Applied physics letters (08-08-2008)“…The frequency dependence of the complex permittivity ( ε ∗ = ε ′ - j ε ″ ) of Ba 0.5 Sr 0.5 TiO 3 0.3 - μ m -thick film is measured up to 110 GHz by using…”
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20
Electrical Model of Different Architectures of through Silicon Capacitors for High Frequency Power Distribution Network (PDN) Decoupling Operations
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01-05-2016)“…The "Through Silicon Vias" technology, developed for silicon interposer interconnects network, has inspired new capacitor components named "Through Silicon…”
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Conference Proceeding