Search Results - "Houzet, Gregory"

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    Electrical Broadband Characterization Method of Dielectric Molding in 3-D IC and Results by Lacrevaz, Thierry, Bermond, Cedric, Bouayadi, Ossama El, Houzet, Gregory, Artillan, Philippe, Lamy, Yann, Dieng, Khadim, Flechet, Bernard

    “…This paper deals with the wideband frequency molding material characterization in three dimensions stack of integrated circuits (3-D IC). This material is…”
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    Journal Article
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    Mixed Reality Games by Marty, Jean-Charles, Carron, Thibault, Pernelle, Philippe, Talbot, Stéphane, Houzet, Gregory

    “…The authors' research work deals with the development of new game-based learning (gbl) environments. They think that the way of acquiring knowledge during a…”
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    Journal Article
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    Fast and robust RF characterization method of insulators used in high speed interconnects networks by Lacrevaz, Thierry, Houzet, Gregory, Auchere, David, Artillan, Philippe, Bermond, Cedric, Blampey, Benjamin, Flechet, Bernard

    “…A wide band (1 GHz-67 GHz) characterization method of insulator layers is presented. This method is well suitable for a fast, simple and accurate extraction of…”
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    Conference Proceeding
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    High gain Vivaldi antenna from 26 up to 40GHz for 5G applications by Thi‐Hong‐Le Dam, Houzet, Gregory, Lacrevaz, Thierry, Tan‐Phu Vuong

    Published in Microwave and optical technology letters (01-07-2022)
    “…We propose a directive broadband and high gain Vivaldi antenna in the Ka‐band (26–40 GHz) for 5G applications. To increase the gain of this antenna, we use a…”
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    Journal Article
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    High gain Vivaldi antenna from 26 up to 40 GHz for 5G applications by Dam, Thi‐Hong‐Le, Houzet, Gregory, Lacrevaz, Thierry, Vuong, Tan‐Phu

    Published in Microwave and optical technology letters (01-07-2022)
    “…We propose a directive broadband and high gain Vivaldi antenna in the Ka‐band (26–40 GHz) for 5G applications. To increase the gain of this antenna, we use a…”
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    Journal Article
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    Through Silicon Capacitors (TSC) for noise reduction in Power Distribution Network by Dieng, Khadim, Artillan, Philippe, Bermond, Cedric, Guiller, Olivier, Lacrevaz, Thierry, Joblot, Sylvain, Houzet, Gregory, Farcy, Alexis, Lamy, Yann, Flechet, Bernard

    “…Inspired from Through Silicon Vias (TSVs), Through Silicon Capacitors (TSCs) are newly developed and integrated throughout silicon interposers. Thanks to the…”
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    Conference Proceeding
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    High frequency modeling of Through Silicon Capacitors (TSC) architectures in silicon interposer by Dieng, Khadim, Bermond, Cedric, Artillan, Philippe, Guiller, Olivier, Lacrevaz, Thierry, Joblot, Sylvain, Houzet, Gregory, Farcy, Alexis, Lamy, Yann, Flechet, Bernard

    “…The ≪Through Silicon Vias≫ technology, developed for silicon interposer interconnects network, has inspired new capacitors components named ≪Through Silicon…”
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    Conference Proceeding
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    Characterization in a Wide Frequency Range (40 MHz-67 GHz) of a KTa0.65Nb0.35O3 Thin Film for Tunable Applications by Houzet, Grégory, Lacrevaz, Thierry, Bermond, Cédric, Fléchet, Bernard, Le Febvrier, Arnaud, Députier, Stéphanie, Guilloux-Viry, Maryline, Queffelec, Patrick

    Published in Integrated ferroelectrics (22-11-2014)
    “…A (100) oriented KTa 0.65 Nb 0.35 O 3  400 nm-thin film has been deposited by Pulsed Laser Deposition on MgO substrate. Microwave measurements, performed on…”
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    Journal Article
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    Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer by Dieng, Khadim, Artillan, Philippe, Bermond, Cedric, Guiller, Olivier, Lacrevaz, Thierry, Joblot, Sylvain, Houzet, Gregory, Farcy, Alexis, Lamy, Yann, Flechet, Bernard

    “…Inspired from Through Silicon Vias (TSVs), Through Silicon Capacitors (TSCs) are newly developed capacitors integrated throughout the silicon interposer. This…”
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    Conference Proceeding
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    Omega-Type Balanced Composite Negative Refractive Index Materials by Lheurette, E., Houzet, G., Carbonell, J., Fuli Zhang, Vanbesien, O., Lippens, D.

    “…We report on the theoretical and experimental analysis of Omega-type metamaterials operating in X and Ku-bands. The prototypes are fabricated on the basis of…”
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    Journal Article
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    Dispersion and loss of ferroelectric Ba0.5Sr0.5TiO3 thin films up to 110 GHz by Houzet, Gregory, Burgnies, Ludovic, Velu, Gabriel, Carru, Jean-Claude, Lippens, Didier

    Published in Applied physics letters (04-08-2008)
    “…The frequency dependence of the complex permittivity (ε∗=ε′-jε″) of Ba0.5Sr0.5TiO3 0.3-μm-thick film is measured up to 110 GHz by using interdigitated…”
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    Journal Article
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    A 360 degrees BST phase shifter with moderate bias voltage at 30 GHz by Vélu, Gabriel, Blary, Karine, Burgnies, Ludovic, Marteau, Aurélien, Houzet, Gregory, Lippens, Didier, Carru, Jean-Claude

    “…Paraelectric BaSrTiO 3 films deposited by sol-gel have been investigated from 1 kHz to 40 GHz using coplanar waveguides, resonators, and inter-digitated…”
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    Journal Article
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    A TRL-Like Calibration for Tunable Interdigitated BST Varactors by Burgnies, L., Velu, G., Houzet, G., Blary, K., Carru, J.-C., Lippens, D.

    “…We report on a de-embedding technique for measuring the reflection coefficients of comblike capacitors patterned on barium-strontium-titanate (BST)…”
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    Journal Article
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    Characterization in a Wide Frequency Range (40 MHz-67 GHz) of a KTa sub(0.65)Nb sub(0.35)O sub(3) Thin Film for Tunable Applications by Houzet, Gregory, Lacrevaz, Thierry, Bermond, Cedric, Flechet, Bernard, Le Febvrier, Arnaud, Deputier, Stephanie, Guilloux-Viry, Maryline, Queffelec, Patrick

    Published in Integrated ferroelectrics (22-11-2014)
    “…A (100) oriented KTa sub(0.65)Nb sub(0.35)O sub(3) 400 nm-thin film has been deposited by Pulsed Laser Deposition on MgO substrate. Microwave measurements,…”
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    Journal Article
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    In-situ characterization up to 100 ​GHz of insulators used in new 3D “System in Package on board” (SiPoB) technologies by Houzet, Gregory, Lacrevaz, Thierry, Bermond, Cedric, Artillan, Philippe, Auchère, David, Schwarz, Laurent, Flechet, Bernard

    Published in Microelectronics (01-02-2021)
    “…Insulating materials used for the packaging of integrated circuits play an important role in the electrical performance of the new System-in-Package (SiP),…”
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    Journal Article
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    A Low Profile Dual Band Implantable Antenna for Biomedical Applications by Bahrouni, Majdi, Houzet, Gregory, Trabelsi, Hichem, Vuong, Tan Phu

    “…In this paper, a miniature double-band structure derived from the first iteration of Hilbert's fractal curve is designed to operate at a depth of 2 mm…”
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    Conference Proceeding
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    Ferroelectric tunable balanced right- and left-handed transmission lines by Marteau, Aurélien, Velu, Gabriel, Houzet, Gregory, Burgnies, Ludovic, Lheurette, Eric, Carru, Jean Claude, Lippens, Didier

    Published in Applied physics letters (12-01-2009)
    “…The tuning of the dispersion characteristics of a balanced composite right- and left-handed transmission lines is demonstrated at centimeter and millimeter…”
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    Journal Article
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    Dispersion and loss of ferroelectric Ba 0.5 Sr 0.5 TiO 3 thin films up to 110 GHz by Houzet, Gregory, Burgnies, Ludovic, Velu, Gabriel, Carru, Jean-Claude, Lippens, Didier

    Published in Applied physics letters (08-08-2008)
    “…The frequency dependence of the complex permittivity ( ε ∗ = ε ′ - j ε ″ ) of Ba 0.5 Sr 0.5 TiO 3 0.3 - μ m -thick film is measured up to 110 GHz by using…”
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    Journal Article
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