Search Results - "Hou, Kaihong"

An approach to estimate CCV (cycle-to-cycle variation) of effective energy output of thermal engine: A case study on a high speed gasoline engine by Chen, Yangyang, Deng, Banglin, Chen, Mingmin, Hou, Kaihong

“…Cycle-to-cycle variations (CCV) of engine (or other power sources) effective power output is a crucial parameter for engine itself and connecting machines, but…”
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Energy flow behavior and emission reduction of a turbo-charging and EGR non-road diesel engine equipped with DOC and DPF under NRTC (non-road transient cycle) by Hu, Songyu, Deng, Banglin, Wu, Di, Hou, Kaihong

“…•Energy balance and emissions of a non-road diesel engine were measured under Non-road Transient Cycle.•A new concept “thermal delay effect” is proposed to…”
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The correlation between intake fluctuation and combustion CCV (cycle-to-cycle variations) on a high speed gasoline engine: A wide range operating condition study by Deng, Banglin, Hou, Kaihong, Duan, Xiongbo, Xu, Zhengxin

“…•The CCV in engine thoroughly estimated under various operating and controlling parameters.•A residual method was proposed to assess the CCV data’s accuracy…”
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Improvements on performance and emissions of a heavy duty diesel engine by throttling degree optimization: A steady-state and transient experimental study by Wu, Di, Deng, Banglin, Li, Meng, Fu, Jianqin, Hou, Kaihong

“…[Display omitted] •The throttling effects on performances of a heavy-duty diesel engine were explored.•The throttle response of this engine is more sensitive…”
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An experimental and numerical investigation on cycle-to-cycle variation of three different displacements single-cylinder motorcycle engines: The sequential analysis from intake to flame propagation process by Deng, Banglin, Chen, Yangyang, Hou, Kaihong, Fu, Jianqin, Feng, Renhua

“…•CCVs of three motorcycle engines were investigated thoroughly by combined experiment and CFD.•Large displacement engine displayed lowest COV at middle speed…”
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For cleaner exhaust of a high performance motorcycle: A macroscopic comparative study of catalytic converters under world-wide motorcycle test cycle by Hou, Kaihong, Deng, Banglin, Chen, Yangyang, Ran, Jiaqi, Fu, Jianqin

“…Considering the noble metals resources used in Three-way catalysts are extremely limited, traditional Three-way catalysts can no longer meet the increasingly…”
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Effects of intake fluctuation and chemical reaction on operating stability of a small displacement gasoline engine: An experimental and numerical study by Chen, Yangyang, Xu, Zhengxin, Deng, Banglin, Hou, Kaihong, Fu, Jianqin

“…•CCV of a high speed engine was investigated thoroughly by combining experiment and CFD.•The engine load has lesser impact on CCV at higher speed.•Three…”
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Research on environmental adaptability of AI-based visual perception system under the perspective of vibration by Li, Xingge, Zhang, Shufeng, Chen, Xun, Wang, Yashun, Fan, Zhengwei, Pang, Xiaofei, Hu, Jingwen, Hou, Kaihong

“…Artificial intelligence (AI) models are widely used in intelligent devices. However, challenging vibration environments can seriously affect the environmental…”
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Quantitative detection, sources exploration and reduction of in-cabin benzene series hazards of electric buses through climate chamber experiments by Deng, Banglin, Hou, Kaihong, Chen, Yangyang, Chen, Zhenyu, Duan, Xiongbo, Huang, Zhe, Tao, Da

“…In this study, a large-scale in-cabin benzene series hazard detection is firstly performed on 20 electric buses by a full-scale climate chamber. The sources of…”
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Dispersion behaviors of exhaust gases and nanoparticle of a passenger vehicle under simulated traffic light driving pattern by Deng, Banglin, Chen, Yangyang, Duan, Xiongbo, Li, Di, Li, Qing, Tao, Da, Ran, Jiaqi, Hou, Kaihong

“…In the present study, the flow structure and pollutants dispersions were investigated by experiment and simulation on a typical passenger vehicle under…”
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Key design and layout factors influencing performance of three-way catalytic converters: Experimental and semidecoupled numerical study under real-life driving conditions by Deng, Banglin, Chen, Zetao, Sun, Chengqi, Zhang, Shoujun, Yu, Weijiao, Huang, Min, Hou, Kaihong, Ran, Jiaqi, Zhou, Lili, Chen, Chao, Pan, Xinxiang

“…The optimization of three-way catalyst (TWC) design and layout is important for reducing mobile source emissions and requires numerical modeling. To date, the…”
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Measurement of harmful nanoparticle distribution among filters, smokers' respiratory systems, and surrounding air during cigarette smoking by Hou, Kaihong, Deng, Banglin, Liu, Aodong, Ran, Jiaqi

“…This study was undertaken to investigate the filtration effect of filter on nanoparticle and the deposition behavior of nanoparticle in the human respiratory…”
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Research of 3D-TSV crystal plastic constitutive and Optimization of electroplated copper filling by Hou, Kaihong, Fan, Zhengwei, Chen, Xun, Zhang, Shufeng, Yu, Dianlong, Wang, Yashun

“…Three-dimensional advanced packaging (3D packaging) technology, as the key technology to surpass Moore's Law, still faces many technical problems to be solved,…”
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Evaluation of the Performance of Autonomous Visual Perception Units in Challenging Environments by Li, Xingge, Chen, Xun, Zhang, Shufeng, Hu, Jingwen, Pang, Xiaofei, Hou, Kaihong

“…With the application of intelligent systems is expanding, the reliability and security of intelligent systems have higher requirements. This paper studies the…”
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Dimension Influence on the Interface Fatigue Characteristics of Three-Dimensional TSV Array: A Fully Coupled Thermal-Electrical-Structural Analysis by Hou, Kaihong, Fan, Zhengwei, Zhang, Shufeng, Wang, Yashun, Chen, Xun

“…As the interconnected structure of 3D chip, through.silicon via undertakes the key functions in energy transmission, mechanical support and signal transmission…”
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Analysis of Thermal Expansion Behavior and Interface Evolution of TSV Under Thermal Cycle Loading Based on Crystal Plastic Finite Element Method by Hou, Kaihong, Fan, Zhengwei, Chen, Xun, Zhang, Shufeng, Wang, Yashun, Jiang, Yu

“…As a key vertical interconnection microstructure, Through.Silicon Via (TSV) plays an important role in three-dimension (3D) chips. The reliability issues of…”
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